公开(公告)号：WO2006114267A3

公开(公告)日：2007-04-19

申请号：PCT/EP2006003795

申请日：2006-04-25

Applicant: INFINEON TECHNOLOGIES AG ,  BIRZER CHRISTIAN ,  BOCK GERALD ,  ORT THOMAS ,  RAKOW BERND ,  SCHAETZLER BERNHARD ,  SCHOTT ALBERT ,  STEINER RAINER ,  WAIDHAS BERND ,  WALTER JUERGEN

Inventor： BIRZER CHRISTIAN ,  BOCK GERALD ,  ORT THOMAS ,  RAKOW BERND ,  SCHAETZLER BERNHARD ,  SCHOTT ALBERT ,  STEINER RAINER ,  WAIDHAS BERND ,  WALTER JUERGEN

IPC: H01L23/498 ,  H05K3/34

CPC classification number: B23K3/0623 ,  B23K2201/40 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.

Abstract translation: 电子部件包括具有包括铜的外部接触区域的基板。 无铅焊料凸点设置在电子部件的外部接触区域上。 电子配置包括电子部件和印刷电路板。 电子元件通过无铅焊接电气连接安装在印刷电路板上。

公开(公告)号：DE112006001036T5

公开(公告)日：2008-02-28

申请号：DE112006001036

申请日：2006-04-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BIRZER CHRISTIAN ,  BOCK GERALD ,  ORT THOMAS ,  RAKOW BERND ,  SCHAETZLER BERNHARD ,  SCHOTT ALBERT ,  STEINER RAINER ,  WAIDHAS BERND ,  WALTER JUERGEN

IPC: H01L23/498

Abstract: An electronic component includes a substrate with outer contact areas including copper. Lead-free solder bumps are disposed on the outer contact areas of the electronic component. An electronic configuration includes an electronic component and a printed circuit board. The electronic component is mounted on the printed circuit board by lead-free solder electrical connections.