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公开(公告)号：DE50111575D1
公开(公告)日：2007-01-11
申请号：DE50111575
申请日：2001-09-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS
IPC: G02B6/42 , H01L31/0232 , H01S5/022
Abstract: A transmission and reception configuration for bi-directional optical data transmission, in particular, through plastic-fiber optical waveguides, includes a transmitter and a receiver, a coupling lens projecting light, delivered through an optical waveguide, onto the receiver, and a micro-lens, mounted on the transmitter, which focuses forward emitted light of the transmitter and projects it onto an edge region of the coupling lens, from which it is injected into the optical waveguide. The receiver and the transmitter are disposed next to one another on a substrate.
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公开(公告)号：DE10351704A1
公开(公告)日：2005-06-30
申请号：DE10351704
申请日：2003-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS
Abstract: The invention relates to an adapter and to an optoelectronic transmitting and/or receiving arrangement with an optoelectronic transducer module and a corresponding adapter. The adapter has an adapter body with at least one planar side, a plurality of first electrical contacts, and a plurality of second electrical contacts. The first electrical contacts are arranged on a planar side of the adapter body and the second electrical contacts are arranged on another side of the adapter body, wherein respective ones of the first electrical contacts and second electrical contacts are connected to one another by means of a conductor running inside the adapter body.
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公开(公告)号：DE102007019033A1
公开(公告)日：2008-10-23
申请号：DE102007019033
申请日：2007-04-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS , BEER GOTTFRIED
Abstract: The assembly has an optoelectronic module (1) with an optoelectronic component (2) e.g. laser diode, and fastened to a module carrier (4) i.e. molded interconnect device. Accommodating structures (40, 43) accommodate an optical fiber (7). The carrier has a coupling opening (5) i.e. linear hopper, in a wall region to ensure an optical coupling between the component and the fiber guided into the structures. The opening is designed such that size of the opening changes between sides. The opening has limitation surfaces coated with gold. A reflecting plastic is molded on the carrier. Independent claims are also included for the following: (1) a method for optical coupling of optoelectronic components (2) a method for manufacturing an optoelectronic assembly.
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公开(公告)号：DE10237403A1
公开(公告)日：2004-03-04
申请号：DE10237403
申请日：2002-08-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS , BEER GOTTFRIED , WITTL JOSEF
IPC: G02B6/12 , G02B6/38 , G02B6/42 , H01L31/12 , H01L33/48 , H01L33/54 , H01L33/62 , H04B10/80 , H01L31/0203 , H01L31/0232 , H01L33/00 , H04B10/02
Abstract: An optoelectronic sender/receiver module comprises a sender and/or receiver chip (1) and a circuit chip on a carrier (7) in a housing (6) having an extension (62) along the optical axis (5) to couple with an optical plug. The carrier is parallel to the optical axis and thus forms a tongue-shaped region with the chips in the extension. An Independent claim is also included for an optical plug for the above.
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公开(公告)号：DE10151113A1
公开(公告)日：2003-06-05
申请号：DE10151113
申请日：2001-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS
IPC: G02B6/42 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/58 , H01L33/00
Abstract: An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module housing having an opening for introducing the support and a coupling region for the coupling attachment of a component to be coupled on. The module housing is filled with a molding of a translucent, moldable material. A separate coupling lens for coupling light between the transmitting and/or receiving element and the component to be coupled on is provided, which lens is disposed adjacent to the molding in or just before the coupling region in the module housing. The invention also relates to several methods for producing such a module.
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Patent Agency Ranking6.发明专利
公开(公告)号：DE102007019031B4
公开(公告)日：2010-07-08
申请号：DE102007019031
申请日：2007-04-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS , BEER GOTTFRIED
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公开(公告)号：DE102007019031A1
公开(公告)日：2008-10-30
申请号：DE102007019031
申请日：2007-04-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS , BEER GOTTFRIED
Abstract: The device has an optoelectronic module (1) with an optoelectronic component (2) e.g. LED, and fastened to a module carrier (4) e.g. molded interconnect device. An under-filling (6) is inserted into a region between the module and the carrier, to form a lens (61). The carrier forms a mounting surface (41) for the optoelectronic module, which is fixed or electrically contacted to the surface by a solder contact. A reflective plastic is extruded on the module carrier at a region of a coupling opening (5), and gold is settled down on limiting surfaces of the opening. Independent claims are also included for the following: (1) a method for optical coupling of an optoelectronic component with an optical fiber (2) a method for manufacturing an optoelectronic device.
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公开(公告)号：DE502004005146D1
公开(公告)日：2007-11-15
申请号：DE502004005146
申请日：2004-08-31
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HURT HANS , WITTL JOSEF , WEBERPALS FRANK , SCHUNK NIKOLAUS , AUBURGER ALBERT , PAULUS STEFAN , PRUCKER STEPHAN
Abstract: A method for fabricating an optical or electronic module equipped with a plastics housing involves initially preparing at least one optical or electronic component or unit having an effective range (11) sufficient for active continuity of the component/unit with the ambience in the completed module, mounting a protective layer (12) on the component/unit (1), encapsulating the component or unit with at least one plastics compound (40) for forming the plastics housing (4) followed by partial removal of the plastics compound externally by laser device (13) so that the plastics compound between the protective layer (12) and the outer face of the housing (4) is removed and in which the protective layer is opaque to the radiation emanating from the laser device (13). An independent claim is included for an optical or electronic module.
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公开(公告)号：DE10237403B4
公开(公告)日：2004-07-29
申请号：DE10237403
申请日：2002-08-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS , BEER GOTTFRIED , WITTL JOSEF
IPC: G02B6/12 , G02B6/38 , G02B6/42 , H01L31/12 , H01L33/48 , H01L33/54 , H01L33/62 , H04B10/80 , H01L31/0203 , H01L31/0232 , H01L33/00 , H04B10/02
Abstract: An optoelectronic sender/receiver module comprises a sender and/or receiver chip (1) and a circuit chip on a carrier (7) in a housing (6) having an extension (62) along the optical axis (5) to couple with an optical plug. The carrier is parallel to the optical axis and thus forms a tongue-shaped region with the chips in the extension. An Independent claim is also included for an optical plug for the above.
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公开(公告)号：DE10151113B4
公开(公告)日：2004-03-25
申请号：DE10151113
申请日：2001-10-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SCHUNK NIKOLAUS
IPC: G02B6/42 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/58 , H01L33/00
Abstract: An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module housing having an opening for introducing the support and a coupling region for the coupling attachment of a component to be coupled on. The module housing is filled with a molding of a translucent, moldable material. A separate coupling lens for coupling light between the transmitting and/or receiving element and the component to be coupled on is provided, which lens is disposed adjacent to the molding in or just before the coupling region in the module housing. The invention also relates to several methods for producing such a module.
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