公开(公告)号：JP2005252278A

公开(公告)日：2005-09-15

申请号：JP2005095685

申请日：2005-03-29

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： HAINZ OSWALD ,  PAULUS STEFAN ,  LEHNER RUDOLF ,  AUBURGER ALBERT ,  LANG DIETMAN ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L21/98 ,  H01L23/31 ,  H01L23/482 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L21/568 ,  H01L23/3107 ,  H01L23/482 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: PROBLEM TO BE SOLVED: To provide an inexpensive packaging method having a simple production process for realizing short signal path and a compact structure. SOLUTION: The housing includes a primary principal plane and a secondary principal plane that counters the primary principal plane, with most of them surrounding at least one semiconductor chip. The semiconductor chip includes a first metallization on the first principal plane side. The second principal planar side of the semiconductor chip reaches the second principal plane of the semiconductor structure element. The first metallizing of the semiconductor chip is also surrounded by the housing through a conductive material and connected with the contact section that reaches the second principal plane. Furthermore, the semiconductor chip includes a secondary metallization to pass signals to the second principal plane side. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 解决的问题：提供一种廉价的包装方法，其具有用于实现短信号路径和紧凑结构的简单制造工艺。 解决方案：壳体包括主要主平面和与主要主平面对准的次要主平面，其大部分围绕至少一个半导体芯片。 半导体芯片包括在第一主平面侧上的第一金属化。 半导体芯片的第二主平面侧到达半导体结构元件的第二主平面。 半导体芯片的第一金属化也被壳体通过导电材料包围并与到达第二主平面的接触部分连接。 此外，半导体芯片包括用于将信号传递到第二主平面侧的二次金属化。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2002124597A

公开(公告)日：2002-04-26

申请号：JP2001287531

申请日：2001-09-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  HAINZ OSWALD ,  LANG DIETMAR ,  PETZ MARTIN ,  WEBER MICHAEL

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a component, which can be produced by a known production method as easily as possible, composed of a little external contacts. SOLUTION: A contact pad 11 of at least one integrated circuit 1 is connected with a conductive projection 2 directly attached on a basic substrate.

公开(公告)号：JP2002100785A

公开(公告)日：2002-04-05

申请号：JP2001217278

申请日：2001-07-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  HURT HANS ,  WAIDHAS BERND ,  REILL JOACHIM ,  GERHARD KUHN ,  WEIGERT MARTIN DR ,  WICKE MARKUS ,  GATTINGER PETER

IPC: G02B6/42 ,  H01L31/0232 ,  H01L33/62 ,  H05K1/02 ,  H05K1/18 ,  H01L33/00

Abstract: PROBLEM TO BE SOLVED: To actualize easy manufacture and low-cost coupling having an optical waveguide by improving a surface-mountable optoelectronic module. SOLUTION: This surface-mountable optoelectronic module has a substrate, an optoelectronic element which is fitted on the 1st main surface side of the substrate, an internal electric terminal which is mounted on the 1st main surface and electrically connected to the optoelectronic element, and an external electrical terminal which is connected to a 2nd main surface of the substrate on the opposite side from the 1st main surface and connected to the internal electrical terminal by an electrical conductor. The substrate has transmissivity to at least one of wavelengths, which are usable for the optoelectronics element and a light incidence and/or light projection opening part is determined, by the arrangement and/or constitution of the external electrical terminal with respect to the optoelectronic element.

公开(公告)号：DE102005008600A1

公开(公告)日：2006-08-31

申请号：DE102005008600

申请日：2005-02-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AUBURGER ALBERT ,  STADLER BERND ,  DANGELMAIER JOCHEN ,  GUENGERICH VOLKER

IPC: H01L23/12 ,  H01L21/50 ,  H01L23/36

Abstract: A chip carrier (1) comprises two opposing surfaces (2, 3); and two recesses (4, 5) provided in the respective surface, where the chip carrier is configured to provide a heat sink for semiconductor chips arranged on the chip carrier, and the recesses are dimensioned to receive two semiconductor chips (10, 10'). Independent claims are also included for: (1) a system comprising a chip carrier and two semiconductor chips supported by the chip carrier, the chip carrier comprising two opposing surfaces, and two recesses in the respective surface, where the semiconductor chips are received within the respective recess, and the chip carrier is configured to provide a heat sink for the semiconductor chips supported by the chip carrier; and (2) a method for producing a chip carrier to support semiconductor chips, comprising forming a first recess in a first surface of the chip carrier; and forming a second recess in a second surface of the chip carrier, the second surface opposing the first surface, where the recesses are configured to receive the semiconductor chips in the respective recesses, and the chip carrier is configured to provide a heat sink for the semiconductor chips.

公开(公告)号：DE10201781A1

公开(公告)日：2003-08-07

申请号：DE10201781

申请日：2002-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUS HORST ,  AUBURGER ALBERT ,  KLOSE FRANK ,  LEHNER RUDOLF

IPC: H01L21/60 ,  H01L23/367 ,  H01L23/433 ,  H01L23/66 ,  H01L23/36 ,  H01L23/50 ,  H01L23/64 ,  H01L21/50

Abstract: A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

公开(公告)号：DE10146854A1

公开(公告)日：2003-04-30

申请号：DE10146854

申请日：2001-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  AUBURGER ALBERT ,  THEUS HORST ,  STADLER BERND

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/31 ,  H01L23/552 ,  H01L21/60 ,  H01L21/50

Abstract: The electronic component (2) comprises the semiconductor chip (4) on a metal substrate (6), and a housing (12). There is also a screen (124) against HF electromagnetic radiation, as an integral part of the housing, forming at least one part of the housing wall (122).The screen may comprise a metal, or a non-conductor, or non-conductor with metal plating. The metal substrate may contain a wiring structure (8) round the semiconductor chip(s), whose contact faces (43) are conductively coupled by bonding wires (10) to contact pads (81) of wiring structure. Independent claims are included for mfg. method of the electronic component.

公开(公告)号：DE102009038706B4

公开(公告)日：2023-01-12

申请号：DE102009038706

申请日：2009-08-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ELIAN KLAUS ,  AUBURGER ALBERT

IPC: G01L15/00 ,  B81B7/00 ,  B81C3/00 ,  G01L19/00 ,  H01L25/04

Abstract: Bauelement (100 - 400), umfassend:einen ersten Sensor (10) mit einer ersten Sensoroberfläche (12), wobei die erste Sensoroberfläche (12) exponiert ist, um das Erfassen einer ersten Variablen zu gestatten, und der erste Sensor (10) ein erstes Sensorsignal ausgibt,einen zum ersten Sensor (10) identischen zweiten Sensor (11) mit einer zweiten Sensoroberfläche (13), wobei die zweite Sensoroberfläche (13) abgedichtet ist, um das Erfassen der ersten Variablen zu blockieren, und der zweite Sensor (11) ein zweites Sensorsignal ausgibt,ein Formmaterial (14), das den ersten und zweiten Sensor (11, 12) einbettet, wobei das Formmaterial (14) die zweite Sensoroberfläche (13) abdichtet, wobei das Formmaterial (14) eine mechanische Spannung in dem ersten Sensor (10) und dem zweiten Sensor (11) verursacht, wobei die mechanische Spannung das erste Sensorsignal und das zweite Sensorsignal beeinflusst, undeine Auswertungseinheit zum Vergleichen des ersten und zweiten Sensorsignals und zum Kompensieren des Einflusses der mechanischen Spannung auf das erste Sensorsignal unter Verwendung des zweiten Sensorsignals.

公开(公告)号：DE102006057970B4

公开(公告)日：2020-01-02

申请号：DE102006057970

申请日：2006-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THEUSS HORST ,  AUBURGER ALBERT

IPC: H01L43/00 ,  G01R33/07 ,  G01R33/09

Abstract: Halbleiterbauteil (300) umfassend einen Halbleiterchip (10), wobei- ein Magnetfeldsensor (11) in den Halbleiterchip (10) integriert ist,- Lotdepots (16) auf eine aktive Hauptoberfläche (12) des Halbleiterchips (10) aufgebracht sind, und- ein Magnet (19) aus einem permanentmagnetischen Material auf die aktive Hauptoberfläche (12) des Halbleiterchips (10) zwischen den Lotdepots (16) aufgebracht ist, wobei der Magnetfeldsensor (11), der Magnet (19) und die Lotdepots (16) an der gleichen Hauptoberfläche (12) des Halbleiterchips (10) angeordnet sind.

公开(公告)号：DE102006012780B3

公开(公告)日：2007-06-06

申请号：DE102006012780

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WIETSCHORKE HELMUT ,  PAULUS STEFAN ,  THEUSS HORST ,  AUBURGER ALBERT ,  GHAHREMANI CYRUS ,  SCHMITT JEAN ,  DANGELMAIER JOCHEN ,  LICHTENEGGER THOMAS

IPC: H01L31/12 ,  G02B6/42 ,  H01L31/0232

Abstract: An optical coupler for interconverting optical and electrical signals comprises a housing (4) with plug connection (5) to a light conductor (6) and a mountable external contact (8) on a conductive film (9). An optical semiconductor chip (12) and an application-specific integrated circuit chip (13) lie on the optical axis (10) and the conductive film has a curved region (14) between the mounting position and external contact that is completely embedded in the housing material so that only the underside contact (25) is accessible. Independent claims are also included for the following: (A) A mobile phone; (B) A digital camera;and (C) A camcorder comprising the above.

公开(公告)号：DE10310617B4

公开(公告)日：2006-09-21

申请号：DE10310617

申请日：2003-03-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEBER MICHAEL ,  AUBURGER ALBERT ,  THEUSS HORST ,  DAECHE FRANK ,  EHRLER GUENTER ,  MECKES ANDREAS ,  AIGNER ROBERT

IPC: H01L21/50 ,  H01L23/31 ,  H01L23/495 ,  H03H9/05

Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.