Abstract:
PROBLEM TO BE SOLVED: To provide a novel polymer easily spreadable on an electronic part with a very favorable electron insulating effect after cyclization, sufficient stability to chemicals and elevated temperatures, good adhesiveness and filling properties. SOLUTION: The present invention relates to an dielectric material for aluminum and copper metallizing being stable at elevated temperature. Polybenzoxazole is prepared by reacting bis-o-aminophenol with a dicarboxylic acid or its activated derivative (acid chloride) to give poly-o-hydroxamide followed by heating for dehydration and cyclization. The dielectric material of this polymer composition is very suitable for filling a narrow trench, surprisingly even though it is dehydrated during cyclization, and the filled trench shows no defect, bubble or crack. The polybenzoxazole has a low dielectric constant (≤2.7) and suitable for an electric insulator and further exhibits favorable adhesiveness to all the surfaces participating in microelectron optics. COPYRIGHT: (C)2004,JPO
Abstract:
The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, are suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.
Abstract:
The invention relates to compositions for memory applications, a memory cell comprising said composition along with two electrodes, a method for producing microelectronic components, and the use of the inventive composition during the production of said microelectronic components.
Abstract:
The invention relates to an integrated circuit comprising an organic semiconductor, particularly an organic field effect transistor (OEFT) that is provided with a dielectric layer. Said integrated circuit is produced by means of a polymer formulation consisting of a) 100 parts of at least one crosslinkable basic polymer, b) 10 to 20 parts of at least one electrophilic crosslinking component, c) 1 to 10 parts of at least one thermal acid catalyst that generates an activating proton at temperatures ranging from 100 to 150 DEG C, dissolved in d) at least one solvent. The invention further relates to a method for producing an integrated circuit, which makes it possible to produce integrated circuits comprising dielectric layers, especially for OFETs, at low temperatures.
Abstract:
The invention relates to novel memory cells, comprising two electrodes and a layer arranged between the same, made from an active material, comprising (a) a compound of the structure given in general formula (I), where R 1 to R 2 independently = -H, -(CH 2 ) m CH 3 , -phenyl, -O-(CH 2 ) m CH 3 , -O-phenyl, -S(CH 2 ) m CH 3 , -S-aryl, -NR 3 R 4 , -SR or a halide, where R 1 and R 2 can together form a ring and where R 3 and R 4 independently = -H, preferably 1-10 C alkyl, -aryl, -heteroaryl, m = 0 or a whole number from 1-10 and n = a whole number from 2 to 1000 and (b) a compound of general formula (II): where R 5 to R 12 independently = -H, -(CH 2 ) m CH 3 , -phenyl, -0-(CH 2 ) m CH 3 , -O-phenyl, -CO(CH 2 ) m CH 3 , -halogen, -CN and/or -NO 2 , where R 5 and R 6 , or R 6 and R 7 , R 7 and R 8 , R 9 and R 10 , R 10 and R 11 and/or R 11 and R 12 can together form a ring, m having the meaning already given. The invention further relates to a method for production of said cells and the novel application of a composition which may be used as active material for the memory cells.
Abstract:
The invention relates to an integrated circuit comprising an organic semiconductor, especially an organic field effect transistor (OEFT) that is provided with a dielectric layer. Said integrated circuit is produced by means of a polymer formulation consisting of a) 100 parts of at least one crosslinkable basic polymer, b) 10 to 20 parts of at least one dibenzyl or tribenzyl alcohol compound as an electrophilic crosslinking component, c) 0.2 to 10 parts of at least one photo acid generator dissolved in d) at least one solvent. The invention further relates to a method for producing an integrated circuit, which makes it possible to produce integrated circuits comprising dielectric layers, particularly for OFETs, at low temperatures.
Abstract:
The invention relates to a resistive storage element containing a dielectric as the storage medium, in which isolated nanoparticles are arranged. The dielectric is preferably configured from an organic polymer. The storage element exhibits a resistive hysteresis effect. Below a voltage Vhold, the storage element is switched to a slightly conductive state, whereas above a voltage Vkrit, the storage element changes over into a conductive state. The conductive state of the storage element can be read out by applying a voltage that lies between Vhold and Vkrit.<>
Abstract:
An integrated circuit having resistive memory is disclosed. In one embodiment, the memory includes novel memory cells which have two electrodes and a layer arranged in between and including an active material which contains [1,2]dithiolo[4,3-[c]-1,2-dithiol-3,6-dithione, (2,4,7-trinitro-9-fluorenylidene)malonodinitrile and a polymer are disclosed. In one embodiment, a process for the production of the cells according to the invention is provided, as well as the novel use of a composition which can be used as active material for the memory cells.