APPARATUS AND METHOD FOR IN-SITU ELECTROSLEEVING AND IN-SITU ELECTROPOLISHING INTERNAL WALLS OF METALLIC CONDUITS

    公开(公告)号:WO2021184114A1

    公开(公告)日:2021-09-23

    申请号:PCT/CA2021/050349

    申请日:2021-03-16

    Abstract: An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).

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