公开(公告)号：WO2011150246A3

公开(公告)日：2012-02-23

申请号：PCT/US2011038197

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JAMES E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

Inventor： MCCONNELL JAMES E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/12 ,  B23K31/02 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Abstract translation: 电容器具有与第一外部端子电接触的第一平面内部电极。 第二平面内部电极与第一平面内部电极交错，其中第二平面内部电极与第二外部端子电接触。 电介质在第一平面内部电极和第二平面内部电极之间，并且至少一个外部端子包括选自聚合物焊料和瞬态液相烧结粘合剂的材料。

公开(公告)号：EP2791951A4

公开(公告)日：2015-11-11

申请号：EP12858253

申请日：2012-12-10

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  WEBSTER ALAN P ,  JONES LONNIE G ,  RENNER GARRY L ,  BELL JEFFREY

IPC: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP2577694A4

公开(公告)日：2014-07-02

申请号：EP11787439

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/232 ,  H01G4/005 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00