STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF
    1.
    发明申请
    STRENGTHENED MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING THEREOF 审中-公开
    加强型微机电系统装置及其制造方法

    公开(公告)号:WO2012112452A2

    公开(公告)日:2012-08-23

    申请号:PCT/US2012024886

    申请日:2012-02-13

    Abstract: In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

    Abstract translation: 在一个实施例中,微机电装置可以包括衬底,梁和隔离接头。 梁可以相对于衬底的表面悬挂。 隔离接头可以在梁的第一部分和第二部分之间,并且可以具有非线性形状。 在另一个实施例中,微机电装置可以包括衬底,梁和隔离接头。 梁可以相对于衬底的表面悬挂。 隔离接头可以位于梁的第一部分和第二部分之间。 隔离接头可以具有第一部分,第二部分以及第一部分和第二部分之间的桥接部分。 隔离接头的第一和第二部分可以各自具有接缝和空隙,而桥接部分可以是实心的。

    MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES
    2.
    发明申请
    MICRO-ELECTROMECHANICAL SYSTEM DEVICES AND METHODS OF MAKING MICRO-ELECTROMECHANICAL SYSTEM DEVICES 审中-公开
    微机电系统装置及制造微电子系统装置的方法

    公开(公告)号:WO2012112395A2

    公开(公告)日:2012-08-23

    申请号:PCT/US2012024672

    申请日:2012-02-10

    Abstract: A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first, second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.

    Abstract translation: 微机电系统(MEMS)装置包括基板,第一光束,第二光束和第三光束。 第一梁包括由隔离接头隔开的第一和第二部分。 第一和第二部分各自包括半导体和第一介电层。 导电迹线机械耦合到第一光束并且电耦合到第二部分的半导体,但不耦合到第一部分的半导体。 第二光束包括第二介质层。 通过干蚀刻形成第一,第二和第三光束中的每一个的轮廓。 空腔将衬底的表面与第一,第二和第三光束分离。 通过干蚀刻形成空腔。 第一,第二和第三光束中的每一个的侧壁基本上没有布置在其上的电介质层,并且通过气相蚀刻去除了介电层。

Patent Agency Ranking