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1.USING THREE-DIMENSIONAL REPRESENTATIONS FOR DEFECT-RELATED APPLICATIONS 审中-公开
Title translation: 使用缺陷相关应用的三维表示法公开(公告)号:WO2012170477A3
公开(公告)日:2013-04-25
申请号:PCT/US2012041019
申请日:2012-06-06
Applicant: KLA TENCOR CORP , PARK ALLEN , CHANG ELLIS , AJI PRASHANT A , LANGE STEVEN R
Inventor: PARK ALLEN , CHANG ELLIS , AJI PRASHANT A , LANGE STEVEN R
IPC: H01L21/66
CPC classification number: G06F17/5068 , G01N21/9501 , G06F17/50 , G06F17/5009 , G06F2217/12 , H01L22/12 , H01L2924/0002 , H01L2924/00
Abstract: A method for determining one or more inspection parameters for a wafer inspection recipe is described. The method comprises the steps of: generating a three-dimensional representation of one or more layers of a wafer based on design data; and determining one or more inspection parameters for a wafer inspection recipe based on the three-dimensional representation. The method is performed by a computer system.
Abstract translation: 描述了一种用于确定晶片检查配方的一个或多个检查参数的方法。 该方法包括以下步骤:基于设计数据生成晶片的一层或多层的三维表示; 以及基于所述三维表示确定用于晶片检查配方的一个或多个检查参数。 该方法由计算机系统执行。
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2.USING THREE-DIMENSIONAL REPRESENTATIONS FOR DEFECT-RELATED APPLICATIONS 审中-公开
Title translation: 用于故障排除应用三维交涉公开(公告)号:EP2718967A4
公开(公告)日:2015-03-11
申请号:EP12797503
申请日:2012-06-06
Applicant: KLA TENCOR CORP
Inventor: PARK ALLEN , CHANG ELLIS , AJI PRASHANT A , LANGE STEVEN R
CPC classification number: G06F17/5068 , G01N21/9501 , G06F17/50 , G06F17/5009 , G06F2217/12 , H01L22/12 , H01L2924/0002 , H01L2924/00
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公开(公告)号:EP3117453A4
公开(公告)日:2017-11-01
申请号:EP15809587
申请日:2015-06-19
Applicant: KLA-TENCOR CORP
Inventor: NICOLAIDES LENA , TSAI BEN-MING BENJAMIN , AJI PRASHANT A , GASVODA MICHAEL , STOKOWSKI STANLEY E , ZHAO GUOHENG , WEN YOUXIAN , MAHADEVAN MOHAN , HORN PAUL D , VOLLRATH WOLFGANG
IPC: H01L21/66 , G01N21/95 , G03F7/20 , H01L21/027
CPC classification number: G01N21/9503 , G01N2201/06113 , G03F7/7085 , H01L22/12
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