저 노이즈 센서를 이용한 암시야 검사
    1.
    发明公开
    저 노이즈 센서를 이용한 암시야 검사 审中-公开
    使用低噪音传感器进行暗场检测

    公开(公告)号:KR20180031060A

    公开(公告)日:2018-03-27

    申请号:KR20187007275

    申请日:2016-08-13

    Abstract: 이미지센서에의해캡쳐되는아날로그이미지데이터값(전하)이, 이미지센서의출력감지노드(부유확산부) 상에서출력신호로서전송되기이전에또는전송되는동안비닝(결합)되고, ADC가출력감지노드각각의리셋사이에서복수의대응하는디지털이미지데이터값을순차적으로생성하도록제어되는검사시스템및 방법. 출력비닝방법에따르면, 이미지센서는각각의리셋사이에서출력감지노드상으로복수의전하를순차적으로전송하도록구동되고, ADC는, 각각의전하가출력감지노드상으로전송된이후, 점진적으로증가하는출력신호를변환하도록제어된다. 다중샘플링방법에따르면, 출력감지노드로전송되기이전에복수의전하는수직으로또는수평으로비닝(합산/결합)되고, ADC는각각의대응하는출력신호를복수회 샘플링한다. 출력비닝및 다중샘플링방법은결합될수도있다.

    Abstract translation: 的模拟图像数据值(电荷)由图像传感器(副浮动扩散)的图像传感器中,每个ADC失控力感测节点的被捕获,和分级(组合的),而转移或传输到作为输出感测节点上的输出信号被发送 并且在该组图像之间顺序地生成多个对应的数字图像数据值。 根据该功率比紧固方法,该图像传感器驱动到多个中的电荷传输到每个复位序列,ADC之间的输出感测节点,每次充电以后发送到输出感测节点,以逐渐增加的 并被控制来转换输出信号。 根据多重采样方法,多个电荷在被发送到输出感测节点之前被垂直或水平地合并(相加/组合),并且ADC对多个相应的输出信号进行采样。 输出分箱和多种采样方法可以结合使用。

    リング状照射を備える暗視野検査システム
    2.
    发明专利
    リング状照射を備える暗視野検査システム 有权
    具有环形照明的暗场检测系统

    公开(公告)号:JP2014222239A

    公开(公告)日:2014-11-27

    申请号:JP2014140065

    申请日:2014-07-07

    CPC classification number: G01N21/9501 G01N21/8806 G01N2021/8822

    Abstract: 【課題】スペックルノイズの影響を低減した暗視野ウエハ検査システムを提供する。【解決手段】サンプル表面の粗度によるスペックルノイズを最小限に抑える暗視野検査システムは、ウェハ104上に合成集束照射線を生成するための、複数のビーム成形経路101を含み得る。各ビーム成形経路101は、傾斜角でウェハ104を照射することができる。複数のビーム成形経路101は、リング状照射を形成することができる。このリング状照射は、スペックルの影響を低減することにより、SNRを改善することができる。対物レンズは、ウェハ104からの散乱光を捕捉することができ、画像センサーは、対物レンズの出力を受け取ることができる。ウェハ104の照射が傾斜角で実施されるため、対物レンズは高いNAを有し得、このことによって、画像センサーの光学解像度、および結果的に得られる信号レベルが改善される。【選択図】図1A

    Abstract translation: 要解决的问题:提供减少斑点噪声影响的暗视场晶片检查系统。解决方案:使由于样品表面粗糙度引起的散斑噪声最小化的暗场检查系统可以包括多个光束整形路径101,用于产生 复合聚焦照明线路。每个光束整形路径101可以以倾斜角度照射晶片104。 多个光束整形路径101可以形成环形照明。 这种环形照明可以减少斑点效应,从而提高SNR。 物镜可以捕获来自晶片104的散射光,成像传感器可以接收物镜的输出。 由于晶片104的照射以倾斜角发生,所以物镜可以具有高NA,从而提高成像传感器的光学分辨率和所得到的信号电平。

    In-situ metalization monitoring using eddy current measurement or optical measurement
    3.
    发明专利
    In-situ metalization monitoring using eddy current measurement or optical measurement 有权
    使用EDDY电流测量或光学测量进行现场金属化监测

    公开(公告)号:JP2011164110A

    公开(公告)日:2011-08-25

    申请号:JP2011048928

    申请日:2011-03-07

    CPC classification number: B24B37/013 B24B49/105 G01N27/72

    Abstract: PROBLEM TO BE SOLVED: To provide a method of obtaining information in-situ regarding a film of a sample by using an eddy current probe, during a process for removing the film. SOLUTION: The eddy current probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy current probe. One or more first signals are measured in the sensing coil(s) of the eddy current probe when the sensing coil(s) are positioned proximate to the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy current probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. A gain and/or distortion of a phase included in the first signals is calibrated based on the second signals. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed. Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed. The CMP system includes: a polishing table; a sample carrier arranged to hold the sample over the polishing table; and an eddy current probe. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种在去除膜的过程中通过使用涡流探针在原位获得样品的膜的方法。

    解决方案:涡流探头具有至少一个感测线圈。 交流电压被施加到涡流探头的传感线圈上。 当感测线圈靠近样品的膜定位时,在涡流探针的感测线圈中测量一个或多个第一信号。 当感测线圈靠近具有固定的组成和/或与感测线圈的距离的参考材料定位时,在涡流探针的感测线圈中测量一个或多个第二信号。 基于第二信号校正包含在第一信号中的相位的增益和/或失真。 基于校准的第一信号确定胶片的属性值。 还公开了一种用于执行上述方法的装置。 此外,公开了一种用抛光剂抛光样品并监测样品的化学机械抛光(CMP)系统。 CMP系统包括:抛光台; 布置成将样品保持在抛光台上的样品载体; 和涡流探头。 版权所有(C)2011,JPO&INPIT

    Illumination apparatus and inspection apparatus for sample
    4.
    发明专利
    Illumination apparatus and inspection apparatus for sample 有权
    照明装置和样品检验装置

    公开(公告)号:JP2011107149A

    公开(公告)日:2011-06-02

    申请号:JP2010290415

    申请日:2010-12-27

    CPC classification number: G02B27/48 G02B6/0001 G02B6/04

    Abstract: PROBLEM TO BE SOLVED: To provide a method for illuminating a sample during a sample inspection, for example, for finding defects, and to provide an apparatus for the method. SOLUTION: The illumination apparatus includes optical fiber bundles with respective first ends and second ends in a certain aspect. The illumination apparatus further includes an illumination selector so as to output one or more selected incident beams from the second ends corresponding to one or more fibers, by selectively transmitting one or more incident beams to the first ends corresponding to one or more selected incident beams. The illumination apparatus includes a lens arrangement for receiving one or more selected incident beams selected from one or more second ends corresponding to the fibers to introduce the selected incident beams toward the sample. The lens arrangement and the fibers are constituted with respect to one another so that the imaging plane of the sample is imaged at a second end of the fiber. The incident beams are laser beam in an aspect. In a specific exemplary application, the sample is selected from the group consisting of a semiconductor device, a semiconductor wafer, and a semiconductor reticle. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供在样品检查期间照亮样品的方法,例如用于发现缺陷,并提供该方法的装置。 解决方案:照明装置包括在某一方面具有各自的第一端和第二端的光纤束。 照明装置还包括照明选择器,以便通过选择性地将一个或多个入射光束选择性地传输到对应于一个或多个所选入射光束的第一端,输出来自对应于一个或多个光纤的第二端的一个或多个选定入射光束。 照明装置包括透镜装置,用于接收从与纤维相对应的一个或多个第二端中选择的一个或多个选定的入射光束,以将选定的入射光束引向样品。 透镜布置和光纤相对于彼此构成,使得样品的成像平面在光纤的第二端成像。 入射光束是一方面的激光束。 在具体的示例性应用中,样品选自半导体器件,半导体晶片和半导体掩模版。 版权所有(C)2011,JPO&INPIT

    WAFER INSPECTION
    5.
    发明专利

    公开(公告)号:SG10201510329VA

    公开(公告)日:2016-01-28

    申请号:SG10201510329V

    申请日:2011-12-07

    Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.

    6.
    发明专利
    未知

    公开(公告)号:DE69828827T2

    公开(公告)日:2006-01-05

    申请号:DE69828827

    申请日:1998-09-18

    Abstract: A curved mirrored surface (78) is used to collect radiation scattered by a sample surface (76a) and originating from a normal illumination beam (70) and an oblique illumination beam (90). The collected radiation is focused to a detector (80). Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams (70, 90) on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors 78 to restrict detection to certain azimuthal angles.

    Improved sample inspection system

    公开(公告)号:AU9400098A

    公开(公告)日:1999-04-05

    申请号:AU9400098

    申请日:1998-09-18

    Abstract: A curved mirrored surface (78) is used to collect radiation scattered by a sample surface (76a) and originating from a normal illumination beam (70) and an oblique illumination beam (90). The collected radiation is focused to a detector (80). Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams (70, 90) on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors 78 to restrict detection to certain azimuthal angles.

    SYSTEME UND VERFAHREN ZUR KLASSIFIZIERUNG VON DEFEKTMATERIAL

    公开(公告)号:DE112018000314T5

    公开(公告)日:2019-09-26

    申请号:DE112018000314

    申请日:2018-01-02

    Abstract: Ein Inspektionssystem umfasst eine Beleuchtungsquelle zum Erzeugen eines Beleuchtungsstrahls, Fokussierungselemente zum Richten des Beleuchtungsstrahls auf eine Probe, einen Detektor, Sammelelemente zum Richten von von der Probe ausgehender Strahlung auf den Detektor, eine Detektionsmodus-Steuervorrichtung zum Abbilden der Probe in zwei oder mehr Erfassungsmodi, so dass der Detektor zwei oder mehr Sammelsignale basierend auf den zwei oder mehr Erfassungsmodi erzeugt, und einer Steuerung. Von der Probe ausgehende Strahlung umfasst mindestens von der Probe spiegelnd reflektierte Strahlung und von der Probe gestreute Strahlung. Die Steuereinrichtung bestimmt auf der Grundlage der zwei oder mehr Sammelsignale Defektstreueigenschaften, die mit durch Defekte auf der Probe gestreuter Strahlung verbunden sind. Die Steuerung klassifiziert auch das eine oder die mehreren Teilchen gemäß einem Satz vorbestimmter Defektklassifizierungen basierend auf dem einen oder den mehreren Defektstreueigenschaften.

    9.
    发明专利
    未知

    公开(公告)号:DE69819159T2

    公开(公告)日:2004-06-17

    申请号:DE69819159

    申请日:1998-07-28

    Abstract: A cylindrical mirror or lens is used to focus an input collimated beam of light onto a line on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of charge-coupled devices parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam.

    10.
    发明专利
    未知

    公开(公告)号:AT252731T

    公开(公告)日:2003-11-15

    申请号:AT98939174

    申请日:1998-07-28

    Abstract: A cylindrical mirror or lens is used to focus an input collimated beam of light onto a line on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of charge-coupled devices parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam.

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