公开(公告)号：WO2007022538A3

公开(公告)日：2009-04-23

申请号：PCT/US2006032822

申请日：2006-08-21

Applicant: KLA TENCOR TECH CORP ,  SHI JIANOU ,  ZHANG XIAFANG ,  PEI SHIYOU ,  HUANG SHU CHUN ,  YEH DENNIS ,  RZEPIELA JEFFREY A ,  FENG YIPING ,  KHAN AHMAD ,  KAGAN ALEXANDER ,  EDELSTEIN SERGIO

Inventor： SHI JIANOU ,  ZHANG XIAFANG ,  PEI SHIYOU ,  HUANG SHU CHUN ,  YEH DENNIS ,  RZEPIELA JEFFREY A ,  FENG YIPING ,  KHAN AHMAD ,  KAGAN ALEXANDER ,  EDELSTEIN SERGIO

IPC: G01R31/02

CPC classification number: G01R31/2831 ,  G01R31/2856 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Test pads, methods, and systems for measuring properties of a wafer are provided. One test pad formed on a wafer includes a test structure configured such that one or more electrical properties of the test structure can be measured. The test pad also includes a conductive layer formed between the test structure and the wafer. The conductive layer prevents structures located under the test structure between the conductive layer and the wafer from affecting the one or more electrical properties of the test structure during measurement. One method for assessing plasma damage of a wafer includes measuring one or more electrical properties of a test structure formed on the wafer and determining an index characterizing the plasma damage of the test structure using the one or more electrical properties. In addition, systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure one or more conditions within the corona source. This system also includes a control subsystem configured to alter one or more parameters of the corona source based on the one or more conditions. Another system includes a corona source configured to deposit the charge on the wafer and a mixture of gases disposed within a discharge chamber of the corona source during the deposition of the charge. The mixture of gases alters one or more parameters of the charge deposited on the wafer.

Abstract translation: 提供了用于测量晶片性能的测试垫，方法和系统。 形成在晶片上的一个测试焊盘包括测试结构，其被配置为使得可以测量测试结构的一个或多个电特性。 测试垫还包括在测试结构和晶片之间形成的导电层。 导电层防止在测量期间位于导电层和晶片之间的测试结构下方的结构影响测试结构的一个或多个电性能。 用于评估晶片的等离子体损伤的一种方法包括测量形成在晶片上的测试结构的一个或多个电特性，并使用一个或多个电性质确定表征测试结构的等离子体损伤的指标。 此外，提供了用于控制晶片上的电荷沉积以测量晶片的一个或多个电性能的系统和方法。 一个系统包括配置成将电荷沉积在晶片上的电晕源和配置成测量电晕源内的一个或多个条件的传感器。 该系统还包括配置为基于一个或多个条件来改变电晕源的一个或多个参数的控制子系统。 另一种系统包括电晕源，其被配置为在电荷沉积期间将电荷沉积在晶片上以及布置在电晕源的放电室内的气体混合物。 气体混合物改变沉积在晶片上的电荷的一个或多个参数。

公开(公告)号：WO2004049016A3

公开(公告)日：2004-12-09

申请号：PCT/US0337939

申请日：2003-11-25

Applicant: KLA TENCOR TECH CORP

Inventor： NIKOONAHAD MEHRDAD ,  LEE SHING ,  KWAK HIDONG ,  EDELSTEIN SERGIO ,  ZHAO GUOHENG ,  JANIK GARY

IPC: G01N21/88 ,  G01N21/95 ,  G01J4/00 ,  G01B11/06 ,  G01N21/00 ,  G01N21/86

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: In an optical system (20) measuring sample characteristics, by reducing the amount of ambient absorbing gas or gases and moisture present in at least a portion of the illumination and detection paths experienced by vacuum ultraviolet (VUV) radiation (34) used in the measurement process, the attenuation of such wavelength components can be reduced. Such reduction can be accomplished by a process without requiring the evacuation of all gases and moisture from the measurement system (20). In one embodiment, the reduction can be accomplished by displacing at least some of the absorbing gas(es) and moisture present in at least a portion of the measuring paths so as to reduce the attenuation of VUV radiation. In this manner, the sample (42) does not need to be placed in a vacuum, thereby enhancing system throughput.

Abstract translation: 在测量样品特性的光学系统（20）中，通过减少在测量中使用的真空紫外（VUV）辐射（34）所经历的照明和检测路径的至少一部分中存在的环境吸收气体或气体和水分的量 可以减少这种波长成分的衰减。 这种还原可以通过一种方法来实现，而不需要从测量系统（20）排出所有的气体和水分。 在一个实施例中，可以通过置换至少一部分测量路径中的吸收气体和水分中的至少一些来实现还原，以便减少VUV辐射的衰减。 以这种方式，样品（42）不需要放置在真空中，从而提高系统生产量。

公开(公告)号：WO2004049016A9

公开(公告)日：2004-09-02

申请号：PCT/US0337939

申请日：2003-11-25

Applicant: KLA TENCOR TECH CORP

Inventor： NIKOONAHAD MEHRDAD ,  LEE SHING ,  KWAK HIDONG ,  EDELSTEIN SERGIO ,  ZHAO GUOHENG ,  JANIK GARY

IPC: G01N21/88 ,  G01N21/95 ,  G02B

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: In an optical system measuring sample characteristics, by reducing the amount of ambient absorbing gas or gases and moisture present in at least a portion of the illumination and detection paths experienced by vacuum ultraviolet (VUV) radiation used in the measurement process, the attenuation of such wavelength components can be reduced. Such reduction can be accomplished by a process without requiring the evacuation of all gases and moisture from the measurement system. In one embodiment, the reduction can be accomplished by displacing at least some of the absorbing gas(es) and moisture present in at least a portion of the measuring paths so as to reduce the attenuation of VUV radiation. In this manner, the sample does not need to be placed in a vacuum, thereby enhancing system throughput.

Abstract translation: 在测量样品特性的光学系统中，通过减少在测量过程中使用的真空紫外线（VUV）辐射所经历的照明和检测路径的至少一部分中存在的环境吸收气体或气体和水分的量， 可以减少波长分量。 这种还原可以通过一种方法来实现，而不需要从测量系统排出所有的气体和水分。 在一个实施例中，可以通过置换至少部分测量路径中的至少一些吸收气体和水分来实现还原，以便减少VUV辐射的衰减。 以这种方式，样品不需要放置在真空中，从而提高系统产量。