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    Control of ambient environment using proximity head during wafer drying
    1.
    发明专利
    Control of ambient environment using proximity head during wafer drying 有权
    在干燥期间使用接头头控制环境环境

    公开(公告)号：JP2005311354A

    公开(公告)日：2005-11-04

    申请号：JP2005100376

    申请日：2005-03-31

    Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

    Inventor： KOROLIK MIKHAIL ,  DE LARIOS JOHN M ,  RAVKIN MIKE ,  FARBER JEFFREY

    IPC: H01L21/304 ,  B08B3/04 ,  H01L21/00

    CPC classification number: H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus which efficiently supplies and removes fluids to and from wafer surfaces while reducing contamination and decreasing wafer cleaning cost. SOLUTION: While a fluid meniscus treats a top surface 108a, a wafer 108 is rotated, or may be held still, and a proximity head 106 is moved. The proximity head 106 includes source inlets 1302 and 1306 and a source outlet 1304. Isopropyl alcohol vapor 1310 in nitrogen gas is supplied to the wafer surface through the source inlet 1302, and a vacuum 1312 acts on the wafer surface through the source outlet 1304, and a treatment fluid 1314 is supplied to the wafer surface through the source inlet 1306. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种有效地向晶片表面提供流体并从晶片表面去除流体的设备，同时减少污染并降低晶片清洁成本。 解决方案：当流体弯液面处理顶部表面108a时，晶片108被旋转或者可以保持静止，并且接近头部106被移动。 邻近头106包括源入口1302和1306以及源出口1304.氮气中的异丙醇蒸汽1310通过源入口1302供应到晶片表面，并且真空1312通过源出口1304作用在晶片表面上， 并且处理流体1314通过源入口1306供应到晶片表面。版权所有：（C）2006，JPO＆NCIPI

    METHOD AND APPARATUS OF CLEANING SUBSTRATE USING NON-NEWTONIAN FLUID
    2.
    发明专利
    METHOD AND APPARATUS OF CLEANING SUBSTRATE USING NON-NEWTONIAN FLUID 审中-公开

    公开(公告)号：JP2006352130A

    公开(公告)日：2006-12-28

    申请号：JP2006164312

    申请日：2006-06-14

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRED C

    IPC: H01L21/304

    Abstract: PROBLEM TO BE SOLVED: To provide a method of cleaning a substrate using a non-newtonian fluid. SOLUTION: A non-newtonian fluid flowing between a surface of a supply unit 704 and a surface of a substrate 702 has a high yield point compared with shearing stress applied to the non-newtonian fluid over a gap 706. Therefore, most of flow of the fluid becomes plug flow. In other words, part of flow to be the plug flow substantially extends between the surface of the supply unit 704 and the surface of the substrate 702. Therefore, a flow rate profile of the flow is substantially uniform. In an embodiment, the term "substantially" implies that the plug flow extends about 80% to 100% between the surfaces. COPYRIGHT: (C)2007,JPO&INPIT

    4.
    发明专利
    未知

    公开(公告)号：AT467230T

    公开(公告)日：2010-05-15

    申请号：AT05251901

    申请日：2005-03-29

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  KOROLIK MIKHAIL ,  RAVKIN MIKE ,  FARBER JEFFREY

    IPC: H01L21/00 ,  H01L21/304 ,  B08B3/04

    Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.

    METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS USING COMPRESSED AND/OR PRESSURIZED FOAMS, BUBBLES AND/OR LIQUIDS
    6.
    发明专利
    METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS USING COMPRESSED AND/OR PRESSURIZED FOAMS, BUBBLES AND/OR LIQUIDS 未知

    公开(公告)号：MY140370A

    公开(公告)日：2009-12-31

    申请号：MYPI20045251

    申请日：2004-12-20

    Applicant: LAM RES CORP

    Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRITZ ,  OWCZARZ ALEKSANDER

    IPC: B08B3/00 ,  H01L21/00

    Abstract: An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

    METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS
    7.
    发明专利
    METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS 未知

    公开(公告)号：SG149849A1

    公开(公告)日：2009-02-27

    申请号：SG2009003047

    申请日：2006-06-14

    Applicant: LAM RES CORP

    Inventor： LARIOS JOHN M DE ,  RAVKIN MIKE ,  FARBER JEFFREY ,  KOROLIK MIKHAIL ,  REDEKER FRED C

    Abstract: METHOD AND APPARATUS FOR CLEANING A SUBSTRATE USING NON-NEWTONIAN FLUIDS A method for cleaning a substrate is provided. In this method, a flow of non- Newtonian fluid is provided where at least a portion of the flow exhibits plug flow. To remove particles from a surface of the substrate, the surface of the substrate is placed in contact with the portion of the flow that exhibits plug flow such that the portion of the flow exhibiting plug flow moves over the surface of the substrate. Additional methods and apparatuses for cleaning a substrate also are described.

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