公开(公告)号：WO2005003864A3

公开(公告)日：2005-04-14

申请号：PCT/US2004020332

申请日：2004-06-23

Applicant: LAM RES CORP ,  HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

Inventor： HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: G03F7/20

CPC classification number: G03F7/70341 ,  Y10S134/902

Abstract: A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.

Abstract translation: 提供一种用于处理基板的方法，其包括在基板的表面上产生弯月面并且通过弯月面施加光刻光以使得能够对基板的表面进行光刻处理。

公开(公告)号：EP2132767A4

公开(公告)日：2012-10-03

申请号：EP08726002

申请日：2008-02-22

Applicant: LAM RES CORP

Inventor： RAVKIN MICHAEL ,  DE LARIOS JOHN ,  REDEKER FRED C ,  KOROLIK MIKHAIL ,  FREER ERIK M

IPC: H01L21/67

CPC classification number: H01L21/67051

公开(公告)号：EP1782461A4

公开(公告)日：2008-05-28

申请号：EP05762857

申请日：2005-06-23

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: H01L21/461 ,  B08B7/04 ,  C23C14/00 ,  H01L27/01

CPC classification number: H01L21/31133 ,  H01L21/6708

Abstract: One embodiment provides a method of processing a substrate. The method includes applying a solution to a surface of a substrate. At least one reacting species has been produced by dissociation of the solution by applying energy such as a light to the solution. A first material on the substrate is reacted and removing the reacted first material. A system for processing a substrate is also described.

公开(公告)号：EP1965930A4

公开(公告)日：2012-09-26

申请号：EP06845929

申请日：2006-12-19

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

IPC: C11D11/00 ,  B08B3/08 ,  C09G1/02 ,  C11D3/14 ,  C11D17/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/306 ,  H01L21/67 ,  H05K3/26

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

公开(公告)号：WO2007079373A2

公开(公告)日：2007-07-12

申请号：PCT/US2006062604

申请日：2006-12-26

Applicant: LAM RES CORP ,  FREER ERIK M ,  REDEKER FRED C ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

Inventor： FREER ERIK M ,  REDEKER FRED C ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: B08B7/00 ,  B08B3/00

CPC classification number: H01L21/67092 ,  B08B3/00 ,  B08B7/00 ,  B08B7/02 ,  C11D9/02 ,  C11D11/0047 ,  C11D17/0017 ,  C23G1/18 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67086 ,  Y10T137/4891

Abstract: A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then die substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.

Abstract translation: 提供一种清洗基板的方法。 该方法通过将激活溶液施加到基底的表面来启动。 活化溶液和基材的表面与固体清洁表面的表面接触。 活化溶液被吸收到固体清洁元件的一部分中，然后被吸收到基片上，或者固体清洁表面相对于彼此移动以清洁基底的表面。 还提供了一种用经历塑性变形的固体清洁元件清洁基板表面的方法。 还提供了相应的清洁装置。

公开(公告)号：WO2006012174A2

公开(公告)日：2006-02-02

申请号：PCT/US2005022172

申请日：2005-06-23

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

Inventor： KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: H01L21/3065

CPC classification number: H01L21/31133 ,  H01L21/6708

Abstract: One embodiment provides a method of processing a substrate. The method includes applying a solution to a surface of a substrate. At least one reacting species has been produced by dissociation of the solution by applying energy such as a light to the solution. A first material on the substrate is reacted and removing the reacted first material. A system for processing a substrate is also described.

Abstract translation: 一个实施例提供了一种处理衬底的方法。 该方法包括将溶液施加到基底的表面。 至少一种反应物质是通过将溶液中的光等能量进行解离来解离的。 将基板上的第一材料反应并除去反应的第一材料。 还描述了一种用于处理衬底的系统。

公开(公告)号：JP2007208246A

公开(公告)日：2007-08-16

申请号：JP2006353539

申请日：2006-12-28

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: H01L21/304 ,  C11D1/04 ,  C11D3/02 ,  C11D3/04

CPC classification number: H01L21/02052 ,  B08B3/04 ,  B08B7/00 ,  C11D11/0047 ,  C11D17/0013 ,  C11D17/0017 ,  G03F1/82 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: PROBLEM TO BE SOLVED: To provide a cleaning agent for cleaning the surface of a wafer which is more efficient and has weak polishing effect, and to provide a method thereof.
SOLUTION: A method of executing cleaning with a three-phase body 110 is disclosed. A substrate 112 on which particles 102 are deposited on its surface is prepared. The three-phase body provided with a solid portion 108, a liquid portion 106 and a gas portion 104 is generated. A force F is applied to the three-phase body and an interaction between the solid portion and the particles is promoted. The three-phase body is removed from the surface of the substrate together with the particles. The particles are removed together with the three-phase body by the interaction between the solid portion and the particles.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于清洁晶片表面的清洁剂，其更有效并且具有较弱的抛光效果，并提供其方法。 公开了一种用三相体110进行清洗的方法。 制备其表面上沉积有颗粒102的基板112。 产生具有固体部分108，液体部分106和气体部分104的三相体。 力F施加到三相体上，促进了固体部分和颗粒之间的相互作用。 三相体与颗粒一起从衬底的表面去除。 颗粒通过固体部分和颗粒之间的相互作用与三相体一起被去除。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005328039A

公开(公告)日：2005-11-24

申请号：JP2005100392

申请日：2005-03-31

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： RAVKIN MICHAEL ,  SMITH MICHAEL G R ,  DE LARIOS JOHN M ,  REDEKER FRITZ ,  KOROLIK MIKHAIL ,  DIPIETRO CHRISTIAN

IPC: B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

CPC classification number: H01L21/67051 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67063 ,  Y10S134/902

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method for reducing contamination capable of achieving lower costs, and more sufficiently supplying and removing fluid to and from a wafer surface. SOLUTION: Processing fluid is supplied to the wafer surface and almost instantly removed with fluid on a wafer by a vacuum provided by an outlet 304. The processing fluid is supplied to the wafer surface such that the processing fluid is present in an area between a proximity head and the wafer surface for a moment with the given fluid on the wafer surface. In this processing, a meniscus 116 is formed and the boundary of the meniscus 116 acts as an IPA/processing fluid interface 118. Therefore, the meniscus 116 is supplied to the surface and practically acts as a fixed flow removed with the given fluid on the wafer surface. The fluid is almost instantly removed from the wafer surface area during drying, so that the formation of droplets of the fluid is prevented in the wafer surface area during drying and the probability of contamination on a wafer 108 is reduced. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种减少污染的设备和方法，能够实现更低的成本，并且更充分地向晶片表面提供流体和从晶片表面去除流体。 解决方案：通过出口304提供的真空，将处理流体供应到晶片表面并几乎立即用晶片上的流体除去。处理流体被供应到晶片表面，使得处理流体存在于区域 在接近头部和晶片表面之间与晶片表面上的给定流体一会儿。 在该处理中，形成弯液面116，并且弯液面116的边界用作IPA /处理流体界面118.因此，弯月面116被供应到表面，并且实际上用作与给定流体一起去除的固定流 晶圆表面。 在干燥期间，流体几乎立即从晶片表面区域移除，从而在干燥期间在晶片表面区域中防止流体液滴的形成，并且晶片108上的污染概率降低。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：WO2007078955A3

公开(公告)日：2008-02-07

申请号：PCT/US2006048548

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

IPC: C11D7/32

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

Abstract translation: 提供了制备用于制备基底表面的溶液的方法。 该方法包括提供将聚合物材料添加到连续介质的连续介质。 将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到 通过施加的搅拌超过聚合物材料的屈服应力。 施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

公开(公告)号：WO2007078956A3

公开(公告)日：2008-01-03

申请号：PCT/US2006048552

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

Inventor： FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

IPC: B08B3/00

CPC classification number: B08B3/024 ,  B08B3/003 ,  B08B3/08 ,  B08B6/00 ,  H01L21/67051

Abstract: A method and system for cleaning a surface, having particulate matter thereon, of a substrate features impinging upon the surface a jet of a liquid having coupling elements entrained therein. A sufficient drag force is imparted upon the coupling elements to have the same move with respect to the liquid and cause the particulate matter to move with respect to the substrate.

Abstract translation: 一种用于清洁其上具有颗粒物质的表面的表面的方法和系统，其特征在于其表面上具有夹带在其中的具有耦合元件的液体的射流。 赋予耦合元件足够的阻力以相对于液体具有相同的移动并使颗粒物质相对于基底移动。