APPARATUS FOR CLEANING SUBSTRATE USING MEGASONIC POWER

    公开(公告)号:IL190454A

    公开(公告)日:2011-12-29

    申请号:IL19045408

    申请日:2008-03-26

    Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

    METHOD AND MATERIAL FOR CLEANING A SUBSTRATE

    公开(公告)号:SG133541A1

    公开(公告)日:2007-07-30

    申请号:SG2006087407

    申请日:2006-12-15

    Applicant: LAM RES CORP

    Abstract: Methods for cleaning using a tri-state body are disclosed. A substrate having a particle deposited thereon is provided. A tri-state body that has a solid portion, liquid portion, and a gas portion is generated. A force is applied over the tri-state body to promulgate an interaction between the solid portion and the particle. The tri-state body is removed along with the particle from the surface of the substrate. The interaction between the solid portion and the particle causing the particle to be removed along with the tri-state body.

    METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES

    公开(公告)号:AU2003277212A1

    公开(公告)日:2004-04-19

    申请号:AU2003277212

    申请日:2003-09-30

    Applicant: LAM RES CORP

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

    METHOD FOR REMOVING CONTAMINATION FROM A SUBSTRATE AND FOR MAKING A CLEANING SOLUTION

    公开(公告)号:MY150857A

    公开(公告)日:2014-03-14

    申请号:MYPI20064607

    申请日:2006-11-30

    Applicant: LAM RES CORP

    Abstract: A METHOD IS PROVIDED FOR REMOVING CONTAMINATION FROM A SUBSTRATE. THE METHOD INCLUDES APPLYING A CLEANING SOLUTION HAVING A DISPERSED PHASE, A CONTINUOUS PHASE AND PARTICLES DISPERSED WITHIN THE CONTINUOUS PHASE TO A SURFACE OF THE SUBSTRATE. THE METHOD INCLUDES FORCING ONE OF THE PARTICLES DISPERSED WITHIN THE CONTINUOUS PHASE PROXIMATE TO ONE OF THE SURFACE CONTAMINANTS. THE FORCING IS SUFFICIENT TO OVERCOME ANY REPULSIVE FORCES BETWEEN THE PARTICLES AND THE SURFACE CONTAMINANTS SO THAT THE ONE OF THE PARTICLES AND THE ONE OF THE SURFACE CONTAMINANTS ARE ENGAGED. THE METHOD ALSO INCLUDES REMOVING THE ENGAGED PARTICLE AND SURFACE CONTAMINANT FROM THE SURFACE OF THE SUBSTRATE. A PROCESS TO MANUFACTURE THE CLEANING MATERIAL IS ALSO PROVIDED.

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