公开(公告)号：WO2008002669A3

公开(公告)日：2008-05-02

申请号：PCT/US2007015249

申请日：2007-06-28

Applicant: LAM RES CORP ,  ZHU JI ,  YUN SEOKMIN ,  WILCOXSON MARK ,  DE LARIOS JOHN M

Inventor： ZHU JI ,  YUN SEOKMIN ,  WILCOXSON MARK ,  DE LARIOS JOHN M

IPC: H01L21/00 ,  B08B3/00

CPC classification number: H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

Abstract: A method for cleaning the surface of a semiconductor wafer is disclosed. A first cleaning solution is applied to the wafer surface to remove contaminants on the wafer surface. The first cleaning solution is removed with some of the contaminants on the wafer surface. Next, an oxidizer solution is applied to the wafer surface. The oxidizer solution forms an oxidized layer on remaining contaminants. The oxidizer solution is removed and then a second cleaning solution is applied to the wafer surface. The second cleaning solution is removed from the wafer surface. The cleaning solution is configured to substantially remove the oxidized layer along with the remaining contaminants.

Abstract translation: 公开了一种用于清洁半导体晶片的表面的方法。 将第一种清洁溶液施加到晶片表面以去除晶片表面上的污染物。 第一个清洁溶液会被晶圆表面的一些污染物清除。 接下来，将氧化剂溶液施加到晶片表面。 氧化剂溶液在剩余的污染物上形成氧化层。 去除氧化剂溶液，然后将第二清洁溶液施加到晶片表面。 第二清洁溶液从晶片表面移除。 清洁溶液被配置为基本上除去氧化层以及剩余的污染物。

公开(公告)号：WO2007078955A3

公开(公告)日：2008-02-07

申请号：PCT/US2006048548

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

IPC: C11D7/32

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

Abstract translation: 提供了制备用于制备基底表面的溶液的方法。 该方法包括提供将聚合物材料添加到连续介质的连续介质。 将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到 通过施加的搅拌超过聚合物材料的屈服应力。 施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

公开(公告)号：EP1782461A4

公开(公告)日：2008-05-28

申请号：EP05762857

申请日：2005-06-23

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: H01L21/461 ,  B08B7/04 ,  C23C14/00 ,  H01L27/01

CPC classification number: H01L21/31133 ,  H01L21/6708

Abstract: One embodiment provides a method of processing a substrate. The method includes applying a solution to a surface of a substrate. At least one reacting species has been produced by dissociation of the solution by applying energy such as a light to the solution. A first material on the substrate is reacted and removing the reacted first material. A system for processing a substrate is also described.

公开(公告)号：EP1965930A4

公开(公告)日：2012-09-26

申请号：EP06845929

申请日：2006-12-19

Applicant: LAM RES CORP

Inventor： KOROLIK MIKHAIL ,  FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MIKE ,  REDEKER FRED

IPC: C11D11/00 ,  B08B3/08 ,  C09G1/02 ,  C11D3/14 ,  C11D17/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/306 ,  H01L21/67 ,  H05K3/26

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

公开(公告)号：WO2005003864A3

公开(公告)日：2005-04-14

申请号：PCT/US2004020332

申请日：2004-06-23

Applicant: LAM RES CORP ,  HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

Inventor： HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: G03F7/20

CPC classification number: G03F7/70341 ,  Y10S134/902

Abstract: A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.

Abstract translation: 提供一种用于处理基板的方法，其包括在基板的表面上产生弯月面并且通过弯月面施加光刻光以使得能够对基板的表面进行光刻处理。

公开(公告)号：WO2004032160A9

公开(公告)日：2004-05-21

申请号：PCT/US0330718

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00 ,  H01G

CPC classification number: B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

公开(公告)号：JP2005328039A

公开(公告)日：2005-11-24

申请号：JP2005100392

申请日：2005-03-31

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： RAVKIN MICHAEL ,  SMITH MICHAEL G R ,  DE LARIOS JOHN M ,  REDEKER FRITZ ,  KOROLIK MIKHAIL ,  DIPIETRO CHRISTIAN

IPC: B08B3/00 ,  B08B3/04 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

CPC classification number: H01L21/67051 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67063 ,  Y10S134/902

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method for reducing contamination capable of achieving lower costs, and more sufficiently supplying and removing fluid to and from a wafer surface. SOLUTION: Processing fluid is supplied to the wafer surface and almost instantly removed with fluid on a wafer by a vacuum provided by an outlet 304. The processing fluid is supplied to the wafer surface such that the processing fluid is present in an area between a proximity head and the wafer surface for a moment with the given fluid on the wafer surface. In this processing, a meniscus 116 is formed and the boundary of the meniscus 116 acts as an IPA/processing fluid interface 118. Therefore, the meniscus 116 is supplied to the surface and practically acts as a fixed flow removed with the given fluid on the wafer surface. The fluid is almost instantly removed from the wafer surface area during drying, so that the formation of droplets of the fluid is prevented in the wafer surface area during drying and the probability of contamination on a wafer 108 is reduced. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种减少污染的设备和方法，能够实现更低的成本，并且更充分地向晶片表面提供流体和从晶片表面去除流体。 解决方案：通过出口304提供的真空，将处理流体供应到晶片表面并几乎立即用晶片上的流体除去。处理流体被供应到晶片表面，使得处理流体存在于区域 在接近头部和晶片表面之间与晶片表面上的给定流体一会儿。 在该处理中，形成弯液面116，并且弯液面116的边界用作IPA /处理流体界面118.因此，弯月面116被供应到表面，并且实际上用作与给定流体一起去除的固定流 晶圆表面。 在干燥期间，流体几乎立即从晶片表面区域移除，从而在干燥期间在晶片表面区域中防止流体液滴的形成，并且晶片108上的污染概率降低。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2007053341A

公开(公告)日：2007-03-01

申请号：JP2006164313

申请日：2006-06-14

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： DE LARIOS JOHN M ,  RAVKIN MIKE ,  PARKS JOHN ,  KOROLIK MIKHAIL ,  REDEKER FRED C

IPC: H01L21/677 ,  B65G49/07 ,  B65G51/00 ,  H01L21/304

CPC classification number: H01L21/67784 ,  H01L21/67057

Abstract: PROBLEM TO BE SOLVED: To solve the problem that transferring a board with rollers and other mechanical devices may result in application of a large stress to the board, thus leading to the deterioration of the board.
SOLUTION: A non-Newtonian fluid is provided to float the board in the non-Newtonian fluid capable of supporting the board. Subsequently, a supply force is added to the non-Newtonian fluid to cause the non-Newtonian fluid to flow so that the flow moves the board along a direction of the flow. This method applies to a device and a system that transfers the board using the non-Newtonian fluid.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题为了解决用辊和其他机械装置传送板的问题可能导致对板的施加大的应力，导致板的劣化。

解决方案：提供非牛顿流体以将板漂浮在能够支撑板的非牛顿流体中。 随后，向非牛顿流体添加供应力以使非牛顿流体流动，使得流动沿着流动方向移动板。 此方法适用于使用非牛顿流体传输电路板的设备和系统。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：WO2009051763A2

公开(公告)日：2009-04-23

申请号：PCT/US2008011830

申请日：2008-10-15

Applicant: LAM RES CORP ,  DE LARIOS JOHN M ,  FREER ERIK M ,  RAVKIN MICHAEL ,  MARKS JEFFREY

Inventor： DE LARIOS JOHN M ,  FREER ERIK M ,  RAVKIN MICHAEL ,  MARKS JEFFREY

IPC: H01L21/302

CPC classification number: H01L21/02057 ,  H01L21/67051

Abstract: Methods and apparatus for cleaning wafer surfaces are provided, especially for cleaning surfaces of patterned wafers. The cleaning apparatus includes a cleaning head with channels on the surface facing the patterned wafer, which has a predominant pattern. Cleaning material flowing the channels exerts a shear force on the surface of a patterned wafer, which is oriented in a specific direction to the cleaning head. The shear force and the specific orientation between the patterned wafer and the cleaning head improve the removal efficiency of the surface contaminants.

Abstract translation: 提供了用于清洁晶片表面的方法和装置，特别是用于清洁图案化晶片的表面。 清洁装置包括清洁头，该清洁头在面向图案化晶片的表面上具有通道，其具有主要图案。 流动通道的清洁材料在图案化晶片的表面上施加剪切力，该图案化晶片的面向清洁头的特定方向。 图案化晶片和清洁头之间的剪切力和特定取向提高了表面污染物的去除效率。

公开(公告)号：WO2006068958A3

公开(公告)日：2007-04-26

申请号：PCT/US2005045673

申请日：2005-12-16

Applicant: LAM RES CORP ,  MIKHAYLICHENKO KATRINA ,  YAKOVLEV VLADISLAV ,  RAVKIN MICHAEL ,  DE LARIOS JOHN M ,  REDEKER FRITZ C

Inventor： MIKHAYLICHENKO KATRINA ,  YAKOVLEV VLADISLAV ,  RAVKIN MICHAEL ,  DE LARIOS JOHN M ,  REDEKER FRITZ C

IPC: H01L21/00

CPC classification number: H01L21/31116 ,  B23K26/0069 ,  B23K26/40 ,  B23K2203/172 ,  H01L21/0209

Abstract: A substrate preparation method is provided. The method includes providing a substrate to be prepared. The substrate has a first layer and second layer. The first layer is to be removed from over the second layer. An energy frequency that is to be absorbed by the second layer while penetrating through the first layer transparently is determined. Energy that has the determined energy frequency is applied onto the first layer so as to disrupt a bond between the first layer and the second layer at a location of application of the energy. A portion of the first layer defined at the location of application of energy is removed. A substrate preparation apparatus is also provided.

Abstract translation: 提供了底物制备方法。 该方法包括提供待制备的基底。 衬底具有第一层和第二层。 第一层将从第二层上方移除。 确定在透过第一层时被第二层吸收的能量频率。 具有确定的能量频率的能量被施加到第一层上，以便在施加能量的位置处破坏第一层和第二层之间的结合。 去除在施加能量的位置限定的第一层的一部分。 还提供了基板制备装置。