公开(公告)号：WO2009086231A3

公开(公告)日：2009-08-27

申请号：PCT/US2008087878

申请日：2008-12-20

Applicant: LAM RES CORP ,  KOLICS ARTUR ,  LI SHIJIAN ,  ARUNAGIRI TIRUCHIRAPALLI ,  THIE WILLIAM

Inventor： KOLICS ARTUR ,  LI SHIJIAN ,  ARUNAGIRI TIRUCHIRAPALLI ,  THIE WILLIAM

IPC: H01L21/302 ,  H01L21/306

CPC classification number: H05K3/0085 ,  C11D7/3209 ,  C11D11/0047 ,  H01L21/02068 ,  H01L21/76849 ,  H01L21/76861

Abstract: One embodiment of the present invention is a method of fabricating an integrated circuit. The method includes providing a substrate having a metal and dielectric damascene metallization layer and depositing substantially on the metal a cap. After deposition of the cap, the substrate is cleaned with a solution comprising an amine to provide a pH for the cleaning solution of 7 to about 13. Another embodiment of the presented invention is a method of cleaning substrates. Still another embodiment of the present invention is a formulation for a cleaning solution.

Abstract translation: 本发明的一个实施例是一种制造集成电路的方法。 该方法包括提供具有金属和电介质镶嵌金属化层的衬底并且基本上在金属上沉积帽。 在盖子沉积之后，用包含胺的溶液清洁衬底以提供7至约13的清洁溶液的pH。本发明的另一个实施例是清洁衬底的方法。 本发明的又一个实施方案是用于清洁溶液的配制剂。

公开(公告)号：SG181638A1

公开(公告)日：2012-07-30

申请号：SG2012042909

申请日：2010-12-10

Applicant: LAM RES CORP

Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

公开(公告)号：SG10201407683UA

公开(公告)日：2014-12-30

申请号：SG10201407683U

申请日：2010-12-10

Applicant: LAM RES CORP

Inventor： WANG YAXIN ,  LI SHIJIAN ,  REDEKER FRITZ ,  PARKS JOHN ,  KOLICS ARTUR ,  YOON HYUNGSUK ALEXANDER ,  DE FILIPE TAREK SUWWAN ,  KOROLIK MIKHAIL

Abstract: PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING Methods and systems for handling a substrate through processes including an integrated electro less deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electro less deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate. FIG.4B