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    METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES
    1.
    发明申请
    METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES 审中-公开
    使用多个进入晶圆表面的入口和出口来干燥半导体晶片表面的方法和设备

    公开(公告)号：WO2004030052A2

    公开(公告)日：2004-04-08

    申请号：PCT/US0331136

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

    IPC: H01L21/00

    CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

    Abstract translation: 提供了衬底制备系统的许多实施例之一，其包括具有头表面的头部，其中头部表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送至基底表面的第一导管以及用于通过头部将第二流体输送至基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三管道，用于从第一管道，第二管道和第三管道基本同时起作用的衬底表面去除第一流体和第二流体中的每一个。 在替代实施例中，提供了一种用于处理基板的方法，其包括在基板的表面上产生流体弯月面并且将声能施加到流体弯月面。 该方法还包括将流体弯月面移动到衬底的表面上以处理衬底的表面。

    SYSTEM FOR SUBSTRATE PROCESSING WITH MENISCUS, VACUUM, IPA VAPOR, DRYING MANIFOLD
    2.
    发明申请
    SYSTEM FOR SUBSTRATE PROCESSING WITH MENISCUS, VACUUM, IPA VAPOR, DRYING MANIFOLD 审中-公开
    用于半透膜，真空，IPA蒸气，干燥歧管的基底处理系统

    公开(公告)号：WO2004030051A3

    公开(公告)日：2004-09-02

    申请号：PCT/US0331051

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： WOODS CARL ,  GARCIA JAMES P ,  DE LARIOS JOHN ,  RAVKIN MIKE ,  REDEKER FRED C ,  NICKHOU AFSHIN

    IPC: H01L21/00

    CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

    Abstract: An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.

    Abstract translation: 提供了一种用于处理晶片的设备和方法。 该系统和方法被设计成使用弯月面来处理晶片的表面。 弯月面是受控制的，并且能够移动到晶片的表面上以实现清洁，冲洗，化学处理和干燥。 该设备可以使用多种配置来定义，以使得能够使用弯月面对晶片表面进行特定的处理，并且这样的配置可以包括使用邻近头。

    3.
    发明专利
    未知

    公开(公告)号：DE60314508D1

    公开(公告)日：2007-08-02

    申请号：DE60314508

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

    IPC: H01L21/00

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

    6.
    发明专利
    未知

    公开(公告)号：DE60314508T2

    公开(公告)日：2008-02-21

    申请号：DE60314508

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

    IPC: H01L21/00

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

    7.
    发明专利
    未知

    公开(公告)号：AT556431T

    公开(公告)日：2012-05-15

    申请号：AT07007143

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

    IPC: H01L21/67 ,  C25D5/22 ,  C25D7/12 ,  H01L21/00

    Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

    9.
    发明专利
    未知

    公开(公告)号：DE60329978D1

    公开(公告)日：2009-12-24

    申请号：DE60329978

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： WOODS CARL ,  GARCIA JAMES P ,  DE LARIOS JOHN ,  RAVKIN MIKE ,  REDEKER FRED C ,  NICKHOU AFSHIN

    IPC: H01L21/00 ,  C25D5/22 ,  C25D7/12

    Abstract: A manifold for use in preparing a surface of a substrate, comprising: the manifold defined by a head that includes, a first portion in the manifold having a plurality of conduits to deliver a first fluid onto the surface of the substrate and a plurality of conduits for removing the first fluid from the surface of the substrate to define a first process window in the first portion of the manifold, a first fluid meniscus configured to be maintained in the first process window of the manifold; and a second portion in the manifold having a plurality of conduits to deliver a second fluid onto the surface of the substrate and a plurality of conduits for removing the second fluid from the surface of the substrate to define a second process window in the second portion of the manifold, a second fluid meniscus configured to be maintained in the second process window of the manifold; wherein the head is operable to be placed in proximity to the surface of the substrate so as to orient the first process window and the second process window toward the surface of the substrate.

    10.
    发明专利
    未知

    公开(公告)号：AT365375T

    公开(公告)日：2007-07-15

    申请号：AT03798815

    申请日：2003-09-30

    Applicant: LAM RES CORP

    Inventor： DE LARIOS JOHN ,  GARCIA JAMES ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

    IPC: H01L21/00

    Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

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