公开(公告)号：WO2004030052A2

公开(公告)日：2004-04-08

申请号：PCT/US0331136

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： DE LARIOS JOHN M ,  GARCIA JAMES P ,  WOODS CARL ,  RAVKIN MIKE ,  REDEKER FRITZ ,  BOYD JOHN ,  NICKHOU AFSHIN

IPC: H01L21/00

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously. In an alternative embodiment, a method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.

Abstract translation: 提供了衬底制备系统的许多实施例之一，其包括具有头表面的头部，其中头部表面靠近衬底的表面。 该系统还包括用于通过头部将第一流体输送至基底表面的第一导管以及用于通过头部将第二流体输送至基底表面的第二导管，其中第二流体不同于第一流体 流体。 该系统还包括第三管道，用于从第一管道，第二管道和第三管道基本同时起作用的衬底表面去除第一流体和第二流体中的每一个。 在替代实施例中，提供了一种用于处理基板的方法，其包括在基板的表面上产生流体弯月面并且将声能施加到流体弯月面。 该方法还包括将流体弯月面移动到衬底的表面上以处理衬底的表面。

公开(公告)号：WO2004032160A9

公开(公告)日：2004-05-21

申请号：PCT/US0330718

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00 ,  H01G

CPC classification number: B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

公开(公告)号：EP1856586A4

公开(公告)日：2010-05-26

申请号：EP05799707

申请日：2005-09-22

Applicant: LAM RES CORP

Inventor： GARCIA JAMES P

IPC: G05D7/00 ,  B01F3/08 ,  B01F15/00 ,  B01F15/04 ,  B24B57/02

CPC classification number: B24B57/02 ,  B01F3/0803 ,  B01F15/00253 ,  B01F15/0441 ,  G05D11/132

公开(公告)号：WO2006039225A3

公开(公告)日：2006-07-06

申请号：PCT/US2005034321

申请日：2005-09-26

Applicant: LAM RES CORP ,  GARCIA JAMES P ,  REDEKER FRED C ,  DE LARIOS JOHN

Inventor： GARCIA JAMES P ,  REDEKER FRED C ,  DE LARIOS JOHN

IPC: F26B21/00

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  Y10S134/902

Abstract: A method of forming a dynamic liquid meniscus includes forming a meniscus at a first size, the meniscus being formed between a proximity head and a first surface and changing the meniscus to a second size by modulating a flow through at least one of a set of ports on a proximity head. A system for modulating flow through the ports in a proximity head is also described.

Abstract translation: 形成动态液体弯液面的方法包括：以第一尺寸形成弯液面，所述弯液面形成在邻近头部和第一表面之间，并且通过调制通过一组端口中的至少一个的流动将所述弯月面改变为第二尺寸 在靠近的头上。 还描述了用于调制在邻近头部中的端口的流动的系统。

公开(公告)号：WO2004030051A3

公开(公告)日：2004-09-02

申请号：PCT/US0331051

申请日：2003-09-30

Applicant: LAM RES CORP

Inventor： WOODS CARL ,  GARCIA JAMES P ,  DE LARIOS JOHN ,  RAVKIN MIKE ,  REDEKER FRED C ,  NICKHOU AFSHIN

IPC: H01L21/00

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

Abstract: An apparatus and method for processing a wafer is provided. The system and method are designed to process a surface of a wafer using a meniscus. The meniscus is controlled and is capable of being moved over the surface of the wafer to enable cleaning, rinsing, chemical processing, and drying. The apparatus can be defined using a number of configurations to enable specific processing of the wafer surface using the meniscus, and such configurations can include the use of proximity heads.

Abstract translation: 提供了一种用于处理晶片的设备和方法。 该系统和方法被设计成使用弯月面来处理晶片的表面。 弯月面是受控制的，并且能够移动到晶片的表面上以实现清洁，冲洗，化学处理和干燥。 该设备可以使用多种配置来定义，以使得能够使用弯月面对晶片表面进行特定的处理，并且这样的配置可以包括使用邻近头。

公开(公告)号：WO2006039197A3

公开(公告)日：2009-09-11

申请号：PCT/US2005034088

申请日：2005-09-22

Applicant: LAM RES CORP ,  GARCIA JAMES P

Inventor： GARCIA JAMES P

IPC: G05D7/00 ,  G05D11/02

CPC classification number: B24B57/02 ,  B01F3/0803 ,  B01F15/00253 ,  B01F15/0441 ,  G05D11/132

Abstract: A dispensing measuring system for dispensing a measure of fluid for use with a system to treat semiconductor workpieces is disclosed. The dispensing measuring system includes at least one feedline having a receiving tank having a volumetric capacity for receiving a measure of fluid. A sensor senses when the receiving tank has received the measure of fluid. A mix tank is attached to the at least one feedline for receiving the measure of fluid from the receiving tank to create a batch of fluid. A controller is electrically connected to the at least one feedline to control the flow of fluid through the at least one feedline. The controller is electrically connected to the mix tank. A connecting line is attached to the mix tank.

Abstract translation: 公开了一种用于分配与用于处理半导体工件的系统一起使用的流体测量的分配测量系统。 所述分配测量系统包括至少一个馈线，所述馈线具有接收罐，所述接收罐具有用于接收流体测量的容积。 传感器感测接收罐何时已经接收到流体的测量。 混合罐附接到至少一个进料管线，用于接收来自接收罐的流体测量值以产生一批流体。 控制器电连接到至少一个馈线以控制通过至少一个馈线的流体流。 控制器电连接到混合罐。 连接线连接到混合罐。

公开(公告)号：WO2004032160A3

公开(公告)日：2004-06-24

申请号：PCT/US0330718

申请日：2003-09-29

Applicant: LAM RES CORP

Inventor： WOODS CARL A ,  GARCIA JAMES P ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  REDEKER FRED C

IPC: H01L25/00 ,  B08B1/02 ,  B08B3/04 ,  H01L21/00

CPC classification number: B08B3/04 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  Y10S134/902

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

Abstract translation: 将弯月面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯月面。 弯月面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。 移动弯月面的系统和方法也可以用于沿着衬底的边缘移动弯月面。

公开(公告)号：JP2006032943A

公开(公告)日：2006-02-02

申请号：JP2005189324

申请日：2005-06-29

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： GARCIA JAMES P ,  REDEKER FRITZ

IPC: H01L21/304 ,  B08B3/00 ,  B08B3/04 ,  H01L21/00

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B11/02 ,  B08B2203/0229 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/68707

Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for preventing the transfer of accumulated fluid to semiconductor wafers during cleaning operations.
SOLUTION: When a wafer 110 is supported by a plurality of self-draining edge wheels 120, any fluid contacting the edge wheels 120 is channeled away from the wafer 110 towards a bottom surface of each of the edge wheels 120. The channeling occurs by manufacturing the bottom portions of the edge wheels 120 to have different configurations. The different configurations enhance fluid channeling away from the wafer 110. To further prevent fluid from wetting a bottom surface of the edge wheels 120, an edge wheel dryer 140 can be positioned proximately adjacent to at least one edge wheel 120 to suction the fluid away from the bottom surface by using a vacuum channel of the edge wheel dryer 140.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于在清洁操作期间防止积聚的流体转移到半导体晶片的系统和方法。 解决方案：当晶片110由多个自引流边缘轮120支撑时，接触边缘轮120的任何流体被引导离开晶片110朝向每个边缘轮120的底表面。引导 通过制造边缘轮120的底部以具有不同的构造而发生。 不同的配置增强了远离晶片110的流体通道。为了进一步防止流体润湿边缘轮120的底部表面，边缘轮干燥器140可以被定位成邻近至少一个边缘轮120，以将流体从 通过使用边缘轮式干燥器140的真空通道来形成底面。版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006148069A

公开(公告)日：2006-06-08

申请号：JP2005283367

申请日：2005-09-29

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： GARCIA JAMES P

IPC: H01L21/304 ,  B05C5/00 ,  B05D1/26 ,  B05D3/12 ,  H01L21/306

CPC classification number: H01L21/67028 ,  H01L21/02057 ,  H01L21/6704 ,  H01L21/67051 ,  Y10S134/902

Abstract: PROBLEM TO BE SOLVED: To efficiently coat and remove a fluid on a wafer surface while attempting to reduce impurity and a wafer treatment cost. SOLUTION: A method that treats a substrate is provided with a step that coats the fluid on the surface of the substrate from a part of a plurality of injection inlets and a step that removes the fluid from the surface of the substrate while the fluid is coated on the surface. The step of coating the fluid and the step of removing the fluid form a fluid mechanic section on the surface of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了有效地涂覆和除去晶片表面上的流体，同时试图减少杂质和晶片处理成本。 解决方案：处理基板的方法具有从多个注入口的一部分涂覆基板表面上的流体的步骤，以及从基板的表面除去流体的步骤，同时 流体被涂在表面上。 涂布流体的步骤和除去流体的步骤在基材表面上形成流体力学部分。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005340781A

公开(公告)日：2005-12-08

申请号：JP2005100378

申请日：2005-03-31

Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

Inventor： WOODS CARL ,  SMITH MICHAEL G R ,  PARKS JOHN ,  GARCIA JAMES P ,  DE LARIOS JOHN M

IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

CPC classification number: H01L21/67063 ,  B05C9/02 ,  H01L21/02052 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S134/902

Abstract: PROBLEM TO BE SOLVED: To reduce contamination and reduce wafer cleaning cost in semiconductor wafer processing.
SOLUTION: Management of movement of a manifold carrier 104, movement of a secondary manifold 102, flow-in and drain of a fluid between a primary manifold 106 and the secondary manifold 102, and flow-in and drain of a fluid using a flow-in channel and a drain channel are managed by a fluid controller 250. The fluid controller 250 comprises any appropriate software and/or hardware that is executable of appropriate adjustment and movement required for monitoring wafer processing and processing a wafer 108 as required using the primary manifold 106, secondary manifold 102, and manifold carrier 104. The secondary manifold 102 further moves the primary manifold 106 to an opening 109.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：减少半导体晶片加工中的污染和降低晶圆清洗成本。 解决方案：管理歧管支架104的运动，辅助歧管102的运动，在主歧管106和次级歧管102之间的流体的流入和排出，以及流体的流入和排出，使用 流体通道和排出通道由流体控制器250管理。流体控制器250包括任何适当的软件和/或硬件，其可执行适当的调整和移动，用于根据需要监视晶片处理和处理晶片108所需的使用 主歧管106，次级歧管102和歧管载体104.次级歧管102进一步将主歧管106移动到开口109.版权所有：（C）2006，JPO＆NCIPI