公开(公告)号：WO2011102884A3

公开(公告)日：2011-12-08

申请号：PCT/US2011000239

申请日：2011-02-10

Applicant: LAM RES CORP ,  SEXTON GREGORY

Inventor： SEXTON GREGORY

IPC: H01L21/205 ,  H01L21/3065 ,  H05H1/46

CPC classification number: F16B35/042 ,  H01J37/32807 ,  H01J37/32908

Abstract: A fastener assembly for parts of a plasma chamber. The fastener assembly includes a bolt with a tool engaging socket and a spring-loaded pin which fits in a through hole of the bolt. When installed, the spring-loaded pin substantially fills the space in the socket and thus prevents parasitic plasma from forming in spaces between opposed surfaces of the pin and bolt. When a tool such as a hex key is inserted into the socket, the spring-loaded pin retracts and the tool rotates the bolt to attach an upper part to a lower part by engaging threads of the bolt with a threaded hole in the lower part.

Abstract translation: 用于等离子室部件的紧固件组件。 紧固件组件包括具有工具接合套筒的螺栓和装配在螺栓的通孔中的弹簧加载销。 当安装时，弹簧加载销基本上填充插座中的空间，并因此防止在销和螺栓的相对表面之间的空间中形成寄生等离子体。 当诸如六角扳手之类的工具插入插座时，弹簧加载销缩回，并且工具通过将螺栓的螺纹与下部的螺纹孔接合而使螺栓旋转以将上部连接至下部。

公开(公告)号：WO2012173980A3

公开(公告)日：2014-05-08

申请号：PCT/US2012042034

申请日：2012-06-12

Applicant: LAM RES CORP ,  FISCHER ANDREAS ,  SEXTON GREGORY

Inventor： FISCHER ANDREAS ,  SEXTON GREGORY

IPC: H01L21/3065 ,  C23C16/54

CPC classification number: H01J37/32522 ,  H01J37/32568 ,  H01L21/67109

Abstract: Passive wafer gap compensation arrangements and methods relying on temperature- driven dimensional change of thermally expanding component(s) to counteract, substantially or partially, the change in the wafer gap due to chamber component temperature change is provided. The passive arrangements and techniques involve passively raising or lowering the substrate-facing component or the substrate support to counteract, substantially or partially, the gap-narrowing effect or gap-expanding effect of rising temperature, thereby reducing or eliminating the change in the wafer gap due to a change in the chamber component temperature. Cooling arrangement(s) and thermal break(s) are optionally provided to improve performance.

Abstract translation: 提供了被动晶片间隙补偿装置和方法，其依赖于热膨胀部件的温度驱动的尺寸变化以抵消，基本上或部分地由于室部件温度变化而导致的晶片间隙的变化。 被动布置和技术涉及被动地升高或降低面向基板的部件或基板支撑件，以抵消上升温度的间隙变窄效应或间隙扩大效应，从而减少或消除晶片间隙的变化 由于腔室部件温度的变化。 可选地提供冷却装置和热断裂以提高性能。

公开(公告)号：SG2014013858A

公开(公告)日：2014-07-30

申请号：SG2014013858

申请日：2008-01-24

Applicant: LAM RES CORP

Inventor： BAILEY ANDREW D III ,  SCHOEPP ALAN M ,  SEXTON GREGORY ,  KIM YUNSANG ,  KENNEDY WILLIAM S

Abstract: A device for cleaning a bevel edge of a semiconductor substrate. The device includes: a lower support having a cylindrical top portion; a lower plasma-exclusion-zone (PEZ) ring surrounding the outer edge of the top portion and adapted to support the substrate; an upper dielectric component opposing the lower support and having a cylindrical bottom portion; an upper PEZ ring surrounding the outer edge of the bottom portion and opposing the lower PEZ ring; and at least one radiofrequency (RF) power source operative to energize process gas into plasma in an annular space defined by the upper and lower PEZ rings, wherein the annular space encloses the bevel edge.

公开(公告)号：SG183269A1

公开(公告)日：2012-09-27

申请号：SG2012059408

申请日：2011-02-10

Applicant: LAM RES CORP

Inventor： SEXTON GREGORY

Abstract: A fastener assembly for parts of a plasma chamber. The fastener assembly includes a bolt with a tool engaging socket and a spring-loaded pin which fits in a through hole of the bolt. When installed, the spring-loaded pin substantially fills the space in the socket and thus prevents parasitic plasma from forming in spaces between opposed surfaces of the pin and bolt. When a tool such as a hex key is inserted into the socket, the spring-loaded pin retracts and the tool rotates the bolt to attach an upper part to a lower part by engaging threads of the bolt with a threaded hole in the lower part.

公开(公告)号：SG178006A1

公开(公告)日：2012-02-28

申请号：SG2012004982

申请日：2008-01-24

Applicant: LAM RES CORP

Inventor： BAILEY ANDREW D III ,  SCHOEPP ALAN M ,  SEXTON GREGORY ,  KENNEDY WILLIAM S

Abstract: A bevel etcher incorporating a vacuum chuck used for cleaning the bevel edge and for reducing the bending curvature of a semiconductor substrate. The bevel etcher includes a vacuum chuck and a plasma generation unit which energizes process gas into a plasma state. The vacuum chuck includes a chuck body and a support ring. The top surface of the chuck body and inner periphery of the support ring form a vacuum region enclosed by the bottom surface of a substrate mounted on the support ring. A vacuum pump evacuates the vacuum region during operation. The vacuum chuck is operative to hold the substrate in place by the pressure difference between the top and bottom surfaces of the substrate. The pressure difference also generates a bending force to reduce the bending curvature of the substrate.Figure 1A

公开(公告)号：SG178004A1

公开(公告)日：2012-02-28

申请号：SG2012004966

申请日：2008-01-24

Applicant: LAM RES CORP

Inventor： BAILEY ANDREW D III ,  SCHOEPP ALAN M ,  SEXTON GREGORY ,  KIM YUNSANG ,  KENNEDY WILLIAM S

Abstract: A device for cleaning a bevel edge of a semiconductor substrate. The device includes: a lower support having a cylindrical top portion; a lower plasma-exclusion-zone (PEZ) ring surrounding the outer edge of the top portion and adapted to support the substrate; an upper dielectric component opposing the lower support and having a cylindrical bottom portion; an upper PEZ ring surrounding the outer edge of the bottom portion and opposing the lower PEZ ring; and at least one radiofrequency (RF) power source operative to energize process gas into plasma in an annular space defined by the upper and lower PEZ rings, wherein the annular space encloses the bevel edge.Figure 3