公开(公告)号：US10206290B2

公开(公告)日：2019-02-12

申请号：US14906850

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K3/20 ,  H05K3/36 ,  H01L51/52 ,  H05K3/46 ,  H01L51/00

Abstract: A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.

公开(公告)号：US09872389B2

公开(公告)日：2018-01-16

申请号：US14905134

申请日：2014-07-24

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/14 ,  H01L51/52 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H01L51/00 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/14 ,  H01L51/0097 ,  H01L51/5246 ,  H05K1/028 ,  H05K1/111 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128 ,  H05K2201/10901

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09638400B2

公开(公告)日：2017-05-02

申请号：US14428226

申请日：2013-09-13

Applicant: LG DISPLAY CO., LTD.

Inventor： Minsoo Kang ,  Ducksu Oh ,  Sung-Ryun Lim ,  Dong-Hyuk Heo

IPC: H01L51/50 ,  F21V19/00 ,  H05B33/06 ,  H05B33/14 ,  H05B33/28 ,  H05K1/18 ,  H05K3/40 ,  F21K9/20 ,  H05K3/32 ,  F21Y105/00 ,  F21Y115/15

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

Abstract: The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.

公开(公告)号：US09444057B2

公开(公告)日：2016-09-13

申请号：US14360168

申请日：2013-05-31

Applicant: LG DISPLAY CO., LTD.

Inventor： Jung Hyoung Lee ,  Minsoo Kang ,  Ducksu Oh

IPC: H01L51/00 ,  H01L51/52 ,  H01L51/50 ,  H01L51/56

CPC classification number: H01L51/0072 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5228 ,  H01L51/5268 ,  H01L51/56 ,  H01L2251/5392

Abstract: The present invention relates to an organic light emitting device and a method for preparing the same, and the organic light emitting device according to the present invention comprises: a substrate; a first electrode provided on the substrate; an organic material layer provided on the first electrode; a second electrode pattern provided on the organic material layer and comprising two or more metal layers spaced apart from each other; and a fuse layer provided in an entire region of an upper surface of the second electrode pattern and gaps between the metal layers spaced apart from each other.

Abstract translation: 本发明涉及一种有机发光器件及其制备方法，并且根据本发明的有机发光器件包括：衬底; 设置在所述基板上的第一电极; 设置在所述第一电极上的有机材料层; 设置在所述有机材料层上并且包括彼此间隔开的两个或更多个金属层的第二电极图案; 以及设置在第二电极图案的上表面的整个区域中的熔丝层和彼此间隔开的金属层之间的间隙。

公开(公告)号：US10264670B2

公开(公告)日：2019-04-16

申请号：US15942913

申请日：2018-04-02

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01L27/32 ,  H05K3/32

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09907171B2

公开(公告)日：2018-02-27

申请号：US14905728

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H01L51/52 ,  H05K1/02 ,  H05K3/36 ,  H05K7/00 ,  H05K3/40

CPC classification number: H05K1/142 ,  H01L51/5203 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/0397 ,  H05K2201/05 ,  H05K2201/097 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09899627B2

公开(公告)日：2018-02-20

申请号：US14904875

申请日：2014-07-24

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu Oh ,  Minsoo Kang

IPC: H01L51/52 ,  H01L51/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32

CPC classification number: H01L51/5246 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/5203 ,  H05K1/028 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/049

Abstract: An organic light emitting diode including a structure of a flexible printed circuit board installed on a substrate is provided.

公开(公告)号：US09974164B2

公开(公告)日：2018-05-15

申请号：US14904551

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K7/00 ,  H05K1/14 ,  H01L27/32 ,  H05K3/36 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09876190B2

公开(公告)日：2018-01-23

申请号：US14891280

申请日：2014-08-21

Applicant: LG DISPLAY CO., LTD.

Inventor： Ducksu Oh ,  Minsoo Kang ,  Sung Ho Mo

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/524 ,  H01L27/3276 ,  H01L51/0023 ,  H01L51/004 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/5243 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/5392 ,  H01L2251/558 ,  H01L2251/566

Abstract: Provided are an organic light emitting diode and a method for preparing the same. In more detail, the organic light emitting diode includes a substrate; organic light emitting unit in which a first electrode, an organic material layer, and a second electrode are sequentially laminated on the substrate; and an encapsulation unit encapsulating an outside of the organic light emitting unit, in which the encapsulation unit includes a sealing layer contacting the outside of the organic light emitting unit, an insulating layer provided on the sealing layer, and a metal pattern layer provided between the sealing layer and the insulating layer.