公开(公告)号：WO2018105971A3

公开(公告)日：2018-06-14

申请号：PCT/KR2017/014080

申请日：2017-12-04

Applicant: LG ELECTRONICS INC.

Inventor： KIM, Gunho ,  KIM, Soohyun

IPC: H01L31/04 ,  H01L31/0224 ,  H01L31/02

Abstract: According to an aspect of the present invention, there is provided a compound semiconductor solar cell, comprising: a light absorbing layer comprising a compound semiconductor; a first electrode positioned on a front surface of the light absorption layer; a first contact layer positioned between the light absorbing layer and the first electrode; a second electrode positioned on a rear surface of the light absorbing layer and having a sheet shape; and a second contact layer positioned between the light absorbing layer and the second electrode. The second contact layer is partially formed on the rear surface of the light absorbing layer on the projection surface, and the second electrode includes a first portion in direct contact with the second contact layer and a second portion located between the first portions.

公开(公告)号：WO2018105971A2

公开(公告)日：2018-06-14

申请号：PCT/KR2017/014080

申请日：2017-12-04

Applicant: LG ELECTRONICS INC.

Inventor： KIM, Gunho ,  KIM, Soohyun

IPC: H01L31/04 ,  H01L31/0224 ,  H01L31/02

CPC classification number: H01L31/056 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/0693 ,  Y02E10/52 ,  Y02E10/544

Abstract: According to an aspect of the present invention, there is provided a compound semiconductor solar cell, comprising: a light absorbing layer comprising a compound semiconductor; a first electrode positioned on a front surface of the light absorption layer; a first contact layer positioned between the light absorbing layer and the first electrode; a second electrode positioned on a rear surface of the light absorbing layer and having a sheet shape; and a second contact layer positioned between the light absorbing layer and the second electrode. The second contact layer is partially formed on the rear surface of the light absorbing layer on the projection surface, and the second electrode includes a first portion in direct contact with the second contact layer and a second portion located between the first portions.

公开(公告)号：WO2018155938A1

公开(公告)日：2018-08-30

申请号：PCT/KR2018/002217

申请日：2018-02-22

Applicant: LG ELECTRONICS INC.

Inventor： KIM, Soohyun ,  KIM, Gunho ,  LEE, Hyun ,  CHOI, Wonseok ,  HEO, Younho

IPC: H01L31/042 ,  H01L31/0224 ,  H01L31/0236 ,  H01L31/18 ,  H01L31/0304

CPC classification number: H01L31/035281 ,  H01L31/022425 ,  H01L31/0735 ,  H01L31/184 ,  H01L31/1844 ,  H01L31/186 ,  H01L31/1892 ,  Y02E10/544 ,  Y02P70/521

Abstract: A compound semiconductor solar cell and a method of manufacturing the same are disclosed. The compound semiconductor solar cell includes a compound semiconductor layer, a front electrode positioned on a front surface of the compound semiconductor layer, a back electrode positioned on a back surfaceof the compound semiconductor layer, a defect portion disposed within the compound semiconductor layer and physically and electrically connected to the back electrode, and an isolation portion surroundingthe defect portion.

公开(公告)号：WO2018216984A1

公开(公告)日：2018-11-29

申请号：PCT/KR2018/005788

申请日：2018-05-21

Applicant: LG ELECTRONICS INC.

Inventor： CHOI, Wonseok ,  KIM, Gunho

IPC: H01L31/0224 ,  H01L31/0304

Abstract: There is provided a compound semiconductor solar cell, comprising: a top cell including a compound semiconductor layer; a front electrode located on a front surface of the top cell and including a plurality of finger electrodes; and a back electrode disposed on a back surface of the top cell, wherein the top cell including a first window layer positioned on a light receiving surface of the top cell, a first base layer containing impurities of a first conductive type and located on a back surface of the first window layer, and a first emitter layer containing impurities of a second conductive type opposite the first conductive type and located on a back surface of the first base layer to form a p-n junction with the first base layer, wherein the first base layer includes a first layer having a first electrical conductivity and a second layer having a second electrical conductivity different from the first electrical conductivity, and wherein an interval between the second layer and the first emitter layer is larger than an interval between the first layer and the first emitter layer. The second electrical conductivity of the second layer may be higher than the first electrical conductivity of the first layer.

公开(公告)号：WO2018199553A1

公开(公告)日：2018-11-01

申请号：PCT/KR2018/004569

申请日：2018-04-19

Applicant: LG ELECTRONICS INC.

Inventor： CHOI, Wonseok ,  KIM, Gunho

IPC: H01L31/18 ,  H01L31/06 ,  H01L31/0272 ,  H01L31/0304

CPC classification number: H01L31/1844 ,  H01L31/03042 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/0735 ,  Y02E10/544 ,  Y02P70/521

Abstract: Disclosed is a method of manufacturing a compound semiconductor solar cell according to an embodiment of the invention. The method of manufacturing the compound semiconductor solar cell according to the embodiment of the invention includes forming a plurality of compound semiconductor layers of at least two elements and including a base layer and an emitter layer, the base layer including a first conductivity type dopant to have a first conductivity type and the emitter layer including a second conductivity type dopant to have a second conductivity type. The forming of the plurality of compound semiconductor layers includes at least one of a process-temperature change period and a growth-rate change period.

公开(公告)号：EP4020569A1

公开(公告)日：2022-06-29

申请号：EP19943479.6

申请日：2019-09-03

Applicant: LG Electronics Inc.

Inventor： KIM, Dohee ,  KIM, Gunho ,  SHIN, Yongil ,  SHIM, Bongchu ,  CHO, Hyunwoo

IPC: H01L27/15 ,  H01L23/00 ,  H01L33/36 ,  H01L33/62

Abstract: The present disclosure relates to a display device having a structure that can utilize an assembly board that has been self-assembled as a final board and a method for manufacturing the same, and according to an embodiment of the present disclosure, there is an effect that a conductive electrode of a vertical semiconductor light emitting diode and a seed metal used as a wiring electrode can be connected by a solder portion, so that the assembly board on which the vertical semiconductor light emitting diodes are self-assembled can be capable of directly being used as a final board without an additional transfer process.

公开(公告)号：EP4322216A1

公开(公告)日：2024-02-14

申请号：EP23190446.7

申请日：2023-08-09

Applicant: LG Electronics Inc.

Inventor： KIM, Myoungsoo ,  PARK, Changseo ,  KIM, Gunho ,  KIM, Jungsub

IPC: H01L25/075 ,  H01L33/20

Abstract: Discussed is a semiconductor light emitting device package for a display pixel The semiconductor light emitting device package can include a first semiconductor light emitting device of a first color having a first material and a second semiconductor light emitting device of a second color having a second material disposed on the first semiconductor light emitting device. The first semiconductor light emitting device can include a first semiconductor light emitting structure having an inner recess, and a first-first electrode and first-second electrode layer electrically connected to a first side and a second side of the first semiconductor light emitting structure, respectively. The second semiconductor light emitting device can be disposed in the inner recess of the first semiconductor light emitting device.

公开(公告)号：EP4160661A1

公开(公告)日：2023-04-05

申请号：EP20939007.9

申请日：2020-06-01

Applicant: LG Electronics Inc.

Inventor： KO, Jisoo ,  JEON, Kiseong ,  KIM, Gunho ,  YANG, Hyeyoung

IPC: H01L21/683 ,  H01L21/52 ,  H01L25/075 ,  H01L27/15

Abstract: A display device manufacturing substrate according to the present disclosure comprises: a base part; assembly electrodes which extend in one direction and which are arranged on the base part; a dielectric layer formed on the base part to cover the assembly electrodes; a partitioning part formed on the dielectric layer; and cells which are formed in a plurality of rows and columns by means of the partitioning part, and on which semiconductor light-emitting elements are loaded, wherein the assembly electrodes extend in either the row direction or the column direction to overlap cells in the extending direction, and the assembly electrodes comprise a first assembly electrode overlapping cells that form one row or column, and a second assembly electrode simultaneously overlapping cells that form different rows or columns which are adjacent.

公开(公告)号：EP3993051A1

公开(公告)日：2022-05-04

申请号：EP20833284.1

申请日：2020-02-11

Applicant: LG Electronics Inc.

Inventor： SHIM, Bongchu ,  KIM, Jinsung ,  LEE, Hyunho ,  KIM, Gunho

IPC: H01L27/15 ,  H01L33/00 ,  H01L21/786 ,  H01L21/28 ,  H01L21/67

Abstract: The present disclosure provides an assembly board for use in a method for manufacturing a display device which allows semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field. Specifically, the assembly board includes a base portion, a plurality of assembly electrodes extending in one direction and disposed on the base portion, a dielectric layer stacked on the base portion to cover the assembly electrodes, and barrier ribs having a plurality of grooves for guiding the semiconductor light emitting diodes to the preset positions and formed on the base portion, wherein each of the grooves is arranged to overlap only one of the plurality of assembly electrodes such that an electric field is formed between the grooves adjacent to each other.

公开(公告)号：EP4075499A1

公开(公告)日：2022-10-19

申请号：EP20899844.3

申请日：2020-01-31

Applicant: LG Electronics Inc.

Inventor： CHANG, Wonjae ,  SHIM, Bongchu ,  KIM, Gunho

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/22 ,  H01L33/30

Abstract: A method for manufacturing a display device related to a micro-light-emitting diode (micro-LED) according to an embodiment of the present disclosure comprises the steps of: moving an assembly device comprising a magnetic body, while the assembly device is in contact or not in contact with an assembly substrate (a chamber filled with fluid is positioned below the assembly device and the assembly substrate, wherein a plurality of specific semiconductor light-emitting diodes are included in the chamber); on the basis of a magnetic field generated by the assembly device, moving the plurality of specific semiconductor light-emitting diodes in the chamber in a direction in which the assembly substrate is positioned; arranging, in firsttype assembly grooves in the assembly substrate, a first group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes; and arranging, in second-type assembly grooves in the assembly substrate, a second group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes.