公开(公告)号：JP2001185654A

公开(公告)日：2001-07-06

申请号：JP2000335300

申请日：2000-11-02

Applicant: LUCENT TECHNOLOGIES INC

Inventor： LOW YEE LENG

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/66

Abstract: PROBLEM TO BE SOLVED: To obtain an electronic package assembly having an integrated filter more effectively using a space by obtaining a filter for removing an unnecessary frequency effect in the assembly and necessarily suppressing an increase in its cost in a mass production of the assembly. SOLUTION: The electronic package 100 comprises a substrate 105 for supporting at least one electronic device 110. In this case, the substrate 105 has a transmission line base integrated filter having at least one conductive layers 165, 175, 170 and 180 coupled to the device 110 and integrally formed in or on the substrate. Thus, a band-pass filter is created according to the volume of a conductive trace, the shape of a conductive element 115 and further the shape and the dielectric constant of the package substrate 105.

公开(公告)号：JP2001135775A

公开(公告)日：2001-05-18

申请号：JP2000284630

申请日：2000-09-20

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS D ,  KOSSIVES DEAN PAUL ,  LOW YEE LENG

IPC: H05K9/00 ,  H01L23/00 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L23/498 ,  H01L23/552 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a recessed chip MCM package integrally equipped with an electromagnetic shield. SOLUTION: A surface of a cavity for housing an IC device is coated with a metal. The exposed upper surface and side surface of a multichip module(MCM) package are also metallized. A PCB(printed circuit board) for connection is provided with a solder wall, which seals a gap between an MCM tile and a PCB for connection. A solder wall is formed by using a standard solder bump technique. The seal between the MCM and PCB is formed during the same reflow operation used to flip-chip bond the MCM tile to the PCB.

公开(公告)号：JP2003110087A

公开(公告)日：2003-04-11

申请号：JP2002231207

申请日：2002-08-08

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  LOW YEE LENG ,  O'CONNOR KEVIN JOHN

IPC: H01L25/18 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To provide a multilevel mutual connection assembly of low cost whose structure is simple. SOLUTION: At least a part of an interchip mutual connection circuit is shifted to a smaller (upper part) chip. When a plurality of upper part chips exist, an interchip circuit is designed as if mutual connection circuits on two chips contain a common mutual connection level, i.e., in such a manner that mutual connection to one chip out of upper chips contains a runner on another upper chip. The feature of constitution of this invention is that a gap which has been existed in chip-on-chip bonding is used for providing air insulation type crossover connection.

公开(公告)号：JPH11195746A

公开(公告)日：1999-07-21

申请号：JP28571498

申请日：1998-10-07

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  LOW YEE LENG ,  O'CONNOR KEVIN JOHN

IPC: H01L25/18 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

Abstract: PROBLEM TO BE SOLVED: To assemble an inexpensive multi-level mutual connection with a simple structure by shifting at lest a part of an inter-chip mutual connecting circuit to a more smaller upper chip and including a runner on the other upper chip in the mutual connection to one of the upper chips. SOLUTION: A metal layer at a certain level is formed on a support chip. An upper chip 41 has a contact-point pad 62. A mutual connecting circuit at the single level is indicated by runners 63-65. An upper chip 67 undergoes flip- chip connection to a support-chip substrate 61 with solder bumps 68 and 69. An under-bump metablized layer 71 is ranged between the solder bump and the chip surface. In the metallic mutually connecting structure at the single level, runners 72-74 are formed on the upper chip 67. The runner 73 on the surface of the upper chip crosses the runner 64 on the surface of the support chip supported by the solder bumps 68 and 69. This cross-over is insulated with air by a gap 75.

公开(公告)号：DE60037990T2

公开(公告)日：2009-02-05

申请号：DE60037990

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  KOSSIVES DEAN PAUL ,  LOW YEE LENG

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization (27). The normally exposed top and side surfaces of the MCM package are also metallized (21). A solder wall (25) is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.

公开(公告)号：DE60018121D1

公开(公告)日：2005-03-24

申请号：DE60018121

申请日：2000-02-28

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  LOW YEE LENG ,  TAI KING LIEN

IPC: H01P11/00 ,  H05K3/24 ,  H01P3/08

Abstract: The specification describes a method for improving the edge acuity of conductive metal strips formed by thick film paste techniques. The advantages of the bulk properties of strips formed using thick film technology are realized while the drawback of poor edge definition is overcome using a thin film trim strip (42) at the edge of the conductive strip (17).

公开(公告)号：DE60037990D1

公开(公告)日：2008-03-27

申请号：DE60037990

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DUDDERAR THOMAS DIXON ,  KOSSIVES DEAN PAUL ,  LOW YEE LENG

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L23/498 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization (27). The normally exposed top and side surfaces of the MCM package are also metallized (21). A solder wall (25) is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.

公开(公告)号：DE60018121T2

公开(公告)日：2006-01-05

申请号：DE60018121

申请日：2000-02-28

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  LOW YEE LENG ,  TAI KING LIEN

IPC: H01P11/00 ,  H01P3/08 ,  H05K3/24

Abstract: The specification describes a method for improving the edge acuity of conductive metal strips formed by thick film paste techniques. The advantages of the bulk properties of strips formed using thick film technology are realized while the drawback of poor edge definition is overcome using a thin film trim strip (42) at the edge of the conductive strip (17).