Abstract:
A surface protective layer or surface insulating layer of a composite oxide which is formed of silicon dioxide (SiO2) to which is added with less than 0.02 percent by weight of titanium dioxide (TiO2) stabilizes and improves the characteristics of the semiconductor device of a single layer formed of silicon oxide. The above-mentioned semiconductor device is provided by mixing small amount of gaseous organic compounds of titanium such as triisopropyl titanate with a gaseous organic compound of silicon such as tetraethoxysilane and leading the resultant gaseous mixture onto a predetermined semiconductor substrate which is heated and held at a temperature of from 300* to 500* C. to react therewith.
Abstract:
1,150,753. Brazing. MATSUSHITA ELECTRONICS CORP. 26 Sept., 1966 [28 Sept., 1965], No. 42915/66. Heading B3R. [Also in Divisions C1 and C7] A gas-tight seal is formed between a metal and a ceramic or a crystallized glass by depositing a film of W or Mo from the vapour phase by reduction of a halide or thermal decomposition of a carbonyl, while maintaining the ceramic or glass at a temperature above 500‹ C., and then brazing the metallized portion to a metal body or a metallized surface. In examples, copper tubes are silver brazed to Mo and W coated ceramic tubes.
Abstract:
In the manufacturing of a multiple layer semiconductor device, such as semiconductor laser device formed by liquid phase epitaxial growth, the following improvement is offered, that is, after forming a first epitaxial growth layer by making a semiconductor substrate contact a first semiconductor solution, and prior to forming a second epitaxial growth layer by letting said first layer contact with a second semiconductor solution, said first layer is made to contact a third semiconductor solution or liquid metal, whereby the slope of impurity concentration in the vicinity of a junction formed between the first and the second layer can be satisfactorily steepened thereby attaining a good performance.