Abstract:
A thin film of ferroelectric layered superlattice material in a flat panel display device is energized to selectively influence the display image. In one embodiment, a voltage pulse causes the layered superlattice material to emit electrons that impinge upon a phosphor, causing the phosphor to emit light. In another embodiment, an electric potential creates a remanent polarization in the layered superlattice material, which exerts an electric field in liquid crystal layer, thereby influencing the transmissivity of light through the liquid crystal. The layered superlattice material is a metal oxide formed using an inventive liquid precursor containing an alkoxycarbolyxate. The thin film thickness is preferably in the range of 50-140 nm, so that polarizability and transparency of the thin film is enhanced. A display element may comprise a varistor device to prevent cross-talk between pixels and to enable sudden polarization switching. A functional gradient in the ferroelectric thin film enhances electron emission. Two ferroelectric elements, one on either side of the phosphor may be used to enhance luminescence. A phosphor can be sandwiched between a dielectric and a ferroelectric layer to enhance emission.
Abstract:
In a semiconductor device with a four-layer structure having the so-called thyristor characteristic, when the control electrode for controlling its breakover voltage is constructed by the Schottky barrier and a means to apply a stress to the barrier, the breakover voltage of the said semiconductor device can be controlled by the stress. If this device is assembled in a circuit system, the circuit system can be set to either the ''''off'''' or ''''on'''' state, corresponding to the applied stress.
Abstract:
In a semiconductor device a metal electrode film formed by an evaporated gold-chromium alloy containing 3 percent to 13 percent by weight of chromium can not only make low ohmic contact with the semiconductor substrate but can be connected to it mechanically firmly. The lead-tin eutectic alloy can be soldered satisfactorily to the metal electrode film without causing erosion even if the electrode film is dipped in a fused solder solution. The semiconductor device with such a gold-chromium alloy film has great industrial merit since the manufacturing steps, particularly the connection of external electrode lead wires, are greatly simplified.
Abstract:
1,150,753. Brazing. MATSUSHITA ELECTRONICS CORP. 26 Sept., 1966 [28 Sept., 1965], No. 42915/66. Heading B3R. [Also in Divisions C1 and C7] A gas-tight seal is formed between a metal and a ceramic or a crystallized glass by depositing a film of W or Mo from the vapour phase by reduction of a halide or thermal decomposition of a carbonyl, while maintaining the ceramic or glass at a temperature above 500‹ C., and then brazing the metallized portion to a metal body or a metallized surface. In examples, copper tubes are silver brazed to Mo and W coated ceramic tubes.