公开(公告)号：JPH11296626A

公开(公告)日：1999-10-29

申请号：JP9430498

申请日：1998-04-07

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TOUMON MOTOJI ,  OTA KAZUNARI ,  CHIKAMURA TAKAO ,  INOUE KAZUKO

IPC: G06K17/00 ,  G06K7/00

Abstract: PROBLEM TO BE SOLVED: To improve the processing time of information data and security at the time of inputting information to an IC card. SOLUTION: A card 7, a bar code reader 8, a data form converter 15, an IC card reader-writer 3 and the IC card 4 are provided. For this information processor for which the data form converter 15 is provided with a format conversion element 16, the information data entered to the bar code of the card 7 are read by the bar code reader 8, transferred to the data form converter 15, converted into a form recordable in the IC card 4 by using the format conversion element 16, transferred to the IC card reader-writer 3 and recorded in the IC card 4.

公开(公告)号：JPH11136587A

公开(公告)日：1999-05-21

申请号：JP30149297

申请日：1997-11-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TOUMON MOTOJI ,  CHIKAMURA TAKAO ,  ITO KUNIO ,  BABA TAKAAKI ,  TAKIGAWA SHINICHI

IPC: H04N5/225 ,  H04N5/335 ,  H04N5/357 ,  H04N5/363 ,  H04N5/372 ,  H04N5/376 ,  H04N5/378

Abstract: PROBLEM TO BE SOLVED: To miniaturize an image input device by mounting a charge coupled device to which an image is inputted and a circuit which drives the charge coupled device on the same substrate as a semiconductor chip. SOLUTION: On the substrate in an image input device, a wiring board 15 where a wiring layer is formed, a CCD 16 which photodetects an image inputted from outside through a lens and coverts it into an electric signal, a CCD driving circuit which drives the CCD 16, a display element driving circuit which drives a display element, and various semiconductor chips 17 where digital electric circuits including a recording device and a processor circuit, etc., are formed are mounted. In the above constitution, the CCD 16 and semiconductor chip 17 are fixed onto the same substrate 15 with an adhesive. Further, the CCD 16, bonding pads formed on the semiconductor chips 17, and a wiring layer formed on the wiring board 15 are connected by metal thin wires such as gold wires.