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公开(公告)号：JP2000124388A
公开(公告)日：2000-04-28
申请号：JP33880099
申请日：1999-11-29
Applicant: MICROCHIP TECH INC
Inventor： FUREY LEE , FERNANDEZ JOSEPH
IPC: H01L23/12 , G06K19/077 , H01L23/495 , H01L23/50 , H01L25/00
Abstract: PROBLEM TO BE SOLVED: To function an induction coil as an antenna of a chip by a method wherein a lead frame having a coil structure and an integrated circuit semiconductor chip are combined within a single lead frame package, and the chip is electrically connected to a part of the coil structure of the lead frame. SOLUTION: A package 10 contains a plastic sealing envelope 12, and a lead frame structure 14 of an induction coil shape/structure is housed in the plastic sealing envelope 12. Two terminal pads 26, 28 of an integrated circuit semiconductor chip 24 are connected to an outside end part 30 and an inside end part 32 of an induction coil 14 via conductive wire bonds 34, 36. When the chip 24 is a transmitter type integrated circuit semiconductor chip, generated electric signals are transmitted to the induction coil 14 functioning as a transmission antenna. Furthermore, when the chip 24 is a receiver type integrated circuit semiconductor chip, electric signals are received by the induction coil 14 functioning as a reception antenna.
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公开(公告)号：JPH11243350A
公开(公告)日：1999-09-07
申请号：JP28566998
申请日：1998-10-07
Applicant: MICROCHIP TECH INC
Inventor： ALEXANDER SAM , FUREY LEE
Abstract: PROBLEM TO BE SOLVED: To enable a reader to detect gap in an electromagnetic field regardless of a chip ground signal by providing a detecting means that detects a time when the voltage of each end part of a coil is almost equal over a certain period. SOLUTION: A tag 10 includes a single package that seals an IC semiconductor chip, a coil 14 that is selectively exposed to an electromagnetic field 12 in the package and a detecting part which exists on the IC semiconductor chip, is connected to each end part of the coil 14 and detects voltage when the voltage of each end part of the coil 14 is almost equal over a prescribed period. A reader is designed to transmit the field 12 and to pass through the coil 14 and selective interruption or gap in transmission in the field 12 is detected by the tag 10. Coil voltage having a resonance frequency that is the result of the inductance value of the coil 14 and the capacitive value of a capacitor 16 is introduced by such a manner that the field 12 passes through the coil 14.
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公开(公告)号：JPH11177027A
公开(公告)日：1999-07-02
申请号：JP26053198
申请日：1998-09-14
Applicant: MICROCHIP TECH INC
Inventor： FERNANDEZ JOSEPH , FUREY LEE
IPC: H01L21/822 , G06K19/077 , H01L23/64 , H01L27/04
Abstract: PROBLEM TO BE SOLVED: To obtain a substrate having excellent deposition and adhesive characteristics of a gold-flash evaporated layer forming an inductive coil by installing the single substrate, the inductive coil placed on one surface of the single substrate and at least one terminal pad electrically connected to at least a part of the inductive coil in a single-sided package. SOLUTION: A gold flash layer having gold in thickness of 7 μ inch is evaporated through a mask, and the coil 10 is formed onto the top face of the substrate 12. The substrate 12 is formed of an epoxy glass plate type material known as an FR4 epoxy glass plate. The chip 14 is mounted on the inside of the inductive coil 10 as the same side as the inductive coil 10 of the substrate 12, and a wire-bonding electrical- connection wiring 18 is formed to sections up to an inductive spot 22 on the substrate 12 from the end section 20 of the outer circumferential turn of the inductive coil 10 and further sections up to the terminal pad 24 of the chip 14 by using a wire bonding technique. Another inductive wire bonding 26 is mounted for connecting the end section 28 of the inner circumferential turn of the inductive coil 10 to the terminal pad 30 of the chip 14.
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公开(公告)号：JPH11154727A
公开(公告)日：1999-06-08
申请号：JP26214998
申请日：1998-09-16
Applicant: MICROCHIP TECH INC
Inventor： FUREY LEE , FERNANDEZ JOSEPH
IPC: H01L23/12 , G06K19/077 , H01L23/495 , H01L23/50 , H01L25/00
Abstract: PROBLEM TO BE SOLVED: To bond an integrated circuit semiconductor chip and a passive element to a single lead frame package, by combining a lead frame arranged in a horizontal plane with the integrated circuit semiconductor chip having terminal pads electrically connected to the coil structure portion of the lead frame. SOLUTION: A package 10 includes a plastic sealing envelope 12 receiving a lead frame structure 14 shaped like an induction coil. The lead frame structure 14 has three tie members 16, for example, which are cut off from the neighboring tie member of a coil-shaped lead frame having the same structure. The tie bar 16 has a function of holding a die paddle in the same plane as a coil 14. Two terminal pads 26, 28 of an integrated circuit semiconductor chip 24 are connected to an outer end portion 30 and an inner end portion 32 of the induction coil 14 by conductive wire bondings 34, 36, respectively.
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公开(公告)号：AT302422T
公开(公告)日：2005-09-15
申请号：AT00918454
申请日：2000-03-28
Applicant: MICROCHIP TECH INC
Inventor： SORRELLS PETER , ALEXANDER SAM E , FUREY LEE , POULIN SHANNON
Abstract: A radio frequency identification tag device having a sensor input which modifies a tag data word bitstream read by an interrogator/tag detector. The sensor input may be a switch contact(s), digital and/or analog. The sensor input may be voltage, current, pressure, temperature, resistance, acceleration, moisture, gas and the like. Power from the radio frequency interrogator/tag reader may be used to power the circuits of the radio frequency tag device, which in turn may supply power to any sensor connected thereto.
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Patent Agency Ranking
公开(公告)号：AU7182301A
公开(公告)日：2002-01-21
申请号：AU7182301
申请日：2001-07-05
Applicant: MICROCHIP TECH INC , CHECKPOINT SYSTEMS INC
Inventor： YOUBOK LEE PHD DR , FUREY LEE , GALLAGHER WILLIAM , SALESKY RONALD D , ALEXANDER SAMUEL E , SHINICHIRO INUI
IPC: H04L25/49
Abstract: A radio frequency identification (RFID) tag device having a pulse position modulation (PPM) decoder circuit which calculates a relative frequency relationship between an internal clock-oscillator of the RFID tag device and an external PPM source such as a RFID tag reader, and then synchronizes the RFID tag device PPM decoder circuit to the required precision for reliable PPM symbol decoding. The PPM decoder is synchronized by measuring the "counts per pulse" (CPP) from a calibration cycle having a plurality of pulses in a single symbol frame.
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公开(公告)号：DE60021971D1
公开(公告)日：2005-09-22
申请号：DE60021971
申请日：2000-03-28
Applicant: MICROCHIP TECH INC
Inventor： SORRELLS PETER , ALEXANDER E , FUREY LEE , POULIN SHANNON
Abstract: A radio frequency identification tag device having a sensor input which modifies a tag data word bitstream read by an interrogator/tag detector. The sensor input may be a switch contact(s), digital and/or analog. The sensor input may be voltage, current, pressure, temperature, resistance, acceleration, moisture, gas and the like. Power from the radio frequency interrogator/tag reader may be used to power the circuits of the radio frequency tag device, which in turn may supply power to any sensor connected thereto.
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公开(公告)号：AU2002239513A1
公开(公告)日：2002-07-24
申请号：AU2002239513
申请日：2001-12-03
Applicant: MICROCHIP TECH INC
Inventor： LEE YOUBOK , FUREY LEE , AMAND ROGER ST
IPC: G06K19/077
Abstract: A radio frequency identification (RFID) tag on a single layer substrate comprises a semiconductor integrated circuit RFID tag device and antenna circuit. A connection jumper may be used to bridge over the antenna circuit coil turns. The RFID tag device is located on the same side as an inductor coil and capacitor which forms a parallel resonant antenna circuit. The inductor coil has an inner end and an outer end. The inner or outer end may be connected directly to the RFID tag device and the outer or inner end be may connected to the RFID tag device with a jumper over the inductor coil turns, or the RFID tag device may bridge the inductor coil turns when being connected to both the inner and outer ends. An encapsulation (glop top) may be used to seal the RFID tag device and jumper, and an insulated coating may be used to cover the entire surface of the substrate to create an inexpensive "chip-on-tag." The encapsulation may be epoxy, plastic or any protective material known to one of ordinary skill in the art of electronic circuit encapsulation. The insulated coating may be of any type suitable for the application of use of the RFID tag.
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公开(公告)号：AT425504T
公开(公告)日：2009-03-15
申请号：AT00979184
申请日：2000-11-16
Applicant: CHECKPOINT SYSTEMS INC , MICROCHIP TECH INC
Inventor： GALLAGHER WILLIAM , SALESKY RONALD , INUI SHINICHIRO , BENEDETTI RICCARDO , ALEXANDER SAM , FUREY LEE , LEE YOUBOK
IPC: G06K7/00
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公开(公告)号：DE60021971T2
公开(公告)日：2006-05-18
申请号：DE60021971
申请日：2000-03-28
Applicant: MICROCHIP TECH INC
Inventor： SORRELLS PETER , ALEXANDER E , FUREY LEE , POULIN SHANNON
Abstract: A radio frequency identification tag device having a sensor input which modifies a tag data word bitstream read by an interrogator/tag detector. The sensor input may be a switch contact(s), digital and/or analog. The sensor input may be voltage, current, pressure, temperature, resistance, acceleration, moisture, gas and the like. Power from the radio frequency interrogator/tag reader may be used to power the circuits of the radio frequency tag device, which in turn may supply power to any sensor connected thereto.
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