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    EPITAXIAL THIN FILMS
    3.
    发明专利
    EPITAXIAL THIN FILMS 未知

    公开(公告)号：CA2359710A1

    公开(公告)日：2000-07-20

    申请号：CA2359710

    申请日：2000-01-12

    Applicant: MICROCOATING TECHNOLOGIES INC

    Inventor： HWANG TZYY-JIUAN JAN ,  SHOUP SHARA S ,  LIN WEN-YI ,  DESHPANDE GIRISH ,  COUSINS DONALD H ,  HUNT ANDREW T

    IPC: C30B29/22 ,  B01D71/02 ,  H01B20060101 ,  H01B1/00 ,  H01G4/06 ,  H01G4/33 ,  H01L21/20 ,  H01L39/24 ,  H01L49/02 ,  H01M8/02

    Abstract: Epitaxial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separati on membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin fil ms for electrolytes and electrode formation in SOFCs results in densification f or pore-free and ideal grain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. Thes e semipermeable membranes are formed by high-quality, dense, gas-tight, pinhol e free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are al so taught herein. Capacitors are utilized according to their capacitance values which are dependent on their physical structure and dielectric permittivity. The epitaxial thin films of the current invention form low-loss dielectric layers with extremely high permittivity. This high permittivity allows for t he formation of capacitors that can have their capacitance adjusted by applying a DC bias between their electrodes.

    EPITAXIAL THIN FILMS
    8.
    发明专利
    EPITAXIAL THIN FILMS 未知

    公开(公告)号：CA2359710C

    公开(公告)日：2008-09-02

    申请号：CA2359710

    申请日：2000-01-12

    Applicant: MICROCOATING TECHNOLOGIES INC

    Inventor： HWANG TZYY-JIUAN JAN ,  DESHPANDE GIRISH ,  HUNT ANDREW T ,  COUSINS DONALD H ,  LIN WEN-YI ,  SHOUP SHARA S

    IPC: C30B29/22 ,  H01L49/02 ,  B01D71/02 ,  C30B29/32 ,  H01B20060101 ,  H01B1/00 ,  H01G4/06 ,  H01G4/33 ,  H01L21/20 ,  H01L39/24 ,  H01M8/02 ,  H01M8/10

    Abstract: Epitaxial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal grain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed by high-quality, dense, gas-tight, pinhole free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein. Capacitors are utilized according to their capacitance values which are dependent on their physical structure and dielectric permittivity. The epitaxial thin films of the current invention form low-loss dielectric layers with extremely high permittivity. This high permittivity allows for the formation of capacitors that can have their capacitance adjusted by applying a DC bias between their electrodes.

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