Chemical vapor deposition devices and methods

    公开(公告)号:AU2002249829A1

    公开(公告)日:2002-08-12

    申请号:AU2002249829

    申请日:2001-12-27

    Abstract: Apparatus is described for rapidly coating a large area, or for rapidly producing a powder. In one embodiment, a liquid having a coating chemical is pumped from a liquid reservoir to a distribution manifold. From the distribution manifold, the liquid is carried under pressure to a geometric array, e.g., linear, of atomization nozzles. Flow equalization means are provided for equalizing the flow of the liquid delivered to each nozzle, and, preferably, means are provided for equalizing the temperature of the liquid delivered to each nozzle. The liquid, upon exiting the nozzles with the attendant pressure drop atomizes. The atomized liquid coats a substrate either in non-reacted or reacted form, or forms a powder. In a preferred embodiment, a solution of precursor chemical is reacted in a geometric array of flames produced at the nozzles, and a coating material produced in the flame coats the substrate, or a powder is formed. In another embodiment, vaporized precursor and vaporized are fed to a burner chamber having a linear exit slit. The vapor exiting the slit is burned, and material produced in a flame reaction are deposited on a substrate, or the powder formed is collected.

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