公开(公告)号：EP0427151A3

公开(公告)日：1992-03-11

申请号：EP90121068.2

申请日：1990-11-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth,Warren M.

IPC: H05K3/30 ,  H01L23/495

CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly af fixing the package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins (12) having fish-hook-type barbs (20) which lock against the under side of the board (13) when the pins are inserted through holes (15) in the board; a second embodiment utilizes anchoring pins (54) which are adhesively bonded in recesses (52) that have been drilled or molded into the board (52); a third embodiment utilizes anchoring pins (62), the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board (63); and a fourth utilizes tapered anchoring pin (74) which may be inserted with an interference fit into holes (75) in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

公开(公告)号：EP0427151A2

公开(公告)日：1991-05-15

申请号：EP90121068.2

申请日：1990-11-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth,Warren M.

IPC: H05K3/30 ,  H01L23/495

CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K3/303 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly af fixing the package to a circuit board such that each lead is in compressive contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins (12) having fish-hook-type barbs (20) which lock against the under side of the board (13) when the pins are inserted through holes (15) in the board; a second embodiment utilizes anchoring pins (54) which are adhesively bonded in recesses (52) that have been drilled or molded into the board (52); a third embodiment utilizes anchoring pins (62), the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board (63); and a fourth utilizes tapered anchoring pin (74) which may be inserted with an interference fit into holes (75) in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

Abstract translation: 具有鸥翼的半导体封装，锯齿形，直列导线结构和锚定装置用于刚性地自动对焦封装固定于电路板检查确实每个引线是与在其相关联的安装垫压缩接触包结束 板。 的第一实施例包括锚定销锚定装置（12），其具有鱼钩型倒钩（20），当该销被穿过板中的孔（15）插入抵靠板（13）的下侧哪个锁; 实施例二使用锚固销（54），其被粘结到凹部（52）并已被钻出或模制到板（52）; 第三实施例利用锚定销（62），其端部可以被直接结合到平面PEG-接合区域的板（63）的表面上; 和第四利用其可与过盈配合插入到间到在所述板中的孔（75）渐缩的锚定销（74）。 本发明消除了用于在电路板装配和维修过程中使用的焊料回流操作机械支撑包装的需要。