Abstract:
The invention relates to a device (20), comprising: • - a liquid container (21) for containing a liquid; • - a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary- stop valve (22); • - a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; • - a second electrode (2) that is spaced apart from said capillary- stop valve by an electrically insulating medium gap (24), and • - a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary- stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.
Abstract:
The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2nm, preferably less than 1 nm, more preferably less than 0.5 nm, and in that in step (d) said first surface of said first substrate and said first surface of said second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
Abstract:
The invention relates to a device for measuring a volume of a liquid, said device comprising: - a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and - a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein: - the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and - a length of a liquid slug in the capillary channel is a measure for said volume. The invention further relates to a method for measuring a volume of a liquid using such a device, a method for calibrating a liquid dispensing system using such a device, a calibrating system for calibrating a liquid dispensing system using such a device and a support for supporting a plurality of such devices.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic,aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract:
A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
Abstract:
The invention relates to a channel for trapping particles to be fed to said channel with a fluid, said channel having a bottom and opposite sidewalls, the sidewalls defining a width of the channel, said channel further comprising: - a first channel part; - a second channel part in fluid through flow connection with said first channel part and downstream of said first channel part; - an elevated structure provided in said channel that divides said channel in said first channel part and said second channel part and for trapping particles in said first channel part; - at least one flow gap provided by said elevated structure for providing said fluid through flow connection between the first channel part and the second channel part for allowing, in use, at least some fluid to flow past said elevated structure into said second channel part while trapping said particles in said first channel part; wherein said elevated structure is substantially U-shaped and has a base extending substantially between the opposite sidewalls of the channel and two legs extending from the base in an upstream direction, wherein at least part of said U-shaped elevated structure defines at least part of a particle trapping area for trapping the particles to be fed to said channel. The invention further relates to a flow cell comprising such a channel. The invention also relates to an assembly comprising such a flow cell and a detection means. The invention also relates to a method for trapping particles in such a channel. And finally, the invention relates to a method for analyzing a sample using such an assembly.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon or ceramic, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon or ceramic, and an intermediate thin film metal layer.
Abstract:
The invention relates to method for bonding at least two substrates, for example made from glass, silicon or ceramic, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon or ceramic, and an intermediate thin film metal layer.
Abstract:
The invention relates to a device for measuring a volume of a liquid, said device comprising: - a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and - a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein: - the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and - a length of a liquid slug in the capillary channel is a measure for said volume. The invention further relates to a method for measuring a volume of a liquid using such a device, a method for calibrating a liquid dispensing system using such a device, a calibrating system for calibrating a liquid dispensing system using such a device and a support for supporting a plurality of such devices.
Abstract:
The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.