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公开(公告)号:AU2003297325A8
公开(公告)日:2004-07-29
申请号:AU2003297325
申请日:2003-12-18
Applicant: MOTOROLA INC
Inventor: KINGON ANGUS IAN , TUNGARE AROON , SAVIC JOVICA , MARIA JON-PAUL , KIM TAEYUN , CROSWELL ROBERT
Abstract: Thin film ceramic foil capacitors are mass-produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor. The entire process or portions of the process is performed in-line such that one or more of the steps are simultaneously performed on different portions of the foil at the same time, or such that, after any one step, the foil is advanced and the step repeated at a new location on the foil.
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公开(公告)号:AU2003297325A1
公开(公告)日:2004-07-29
申请号:AU2003297325
申请日:2003-12-18
Applicant: MOTOROLA INC
Inventor: CROSWELL ROBERT , SAVIC JOVICA , TUNGARE AROON , KIM TAEYUN , KINGON ANGUS IAN , MARIA JON-PAUL
Abstract: Thin film ceramic foil capacitors are mass-produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor. The entire process or portions of the process is performed in-line such that one or more of the steps are simultaneously performed on different portions of the foil at the same time, or such that, after any one step, the foil is advanced and the step repeated at a new location on the foil.
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公开(公告)号:WO2010027570A3
公开(公告)日:2010-04-22
申请号:PCT/US2009051386
申请日:2009-07-22
Applicant: MOTOROLA INC , DAI XUNHU , CROSWELL ROBERT , PETSINGER JEFFREY , SADLER DANIEL J , DUNN GREGORY J
Inventor: DAI XUNHU , CROSWELL ROBERT , PETSINGER JEFFREY , SADLER DANIEL J , DUNN GREGORY J
CPC classification number: G06F3/016 , G06F3/0202 , H03K17/9622 , H03K2217/96062
Abstract: Touch sensors with one or more piezoelectric elements and devices containing such touch sensors are presented. The touch sensor contains keys that are independently actuated. Contact with a key provides tactile feedback through the piezoelectric element to the user. Each key provides an individual tactile feedback pattern that is dependent on the particular key contacted as well as the function of the key at the time of contact. Actuation of the key provides a different tactile feedback pattern. The piezoelectric element is bonded directly to a printed circuit board, on which electronic components are also mounted.
Abstract translation: 提供具有一个或多个压电元件的触摸传感器和包含这种触摸传感器的装置。 触摸传感器包含独立启动的按键。 与键的接触通过压电元件向使用者提供触觉反馈。 每个键提供一个独立的触觉反馈模式,这取决于所联系的特定键以及键的功能。 钥匙的启动提供了不同的触觉反馈模式。 压电元件直接结合到印刷电路板上,电子元件也安装在印刷电路板上。
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公开(公告)号:WO2004061905A2
公开(公告)日:2004-07-22
申请号:PCT/US0340351
申请日:2003-12-18
Applicant: MOTOROLA INC
Inventor: CROSWELL ROBERT , SAVIC JOVICA , TUNGARE AROON , KIM TAEYUN , KINGON ANGUS IAN , MARIA JON-PAUL
CPC classification number: H01G4/018 , C23C26/00 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , H01G4/12 , H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0355 , H05K2203/1545
Abstract: Thin film ceramic foil capacitors are produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor
Abstract translation: 薄膜陶瓷箔电容器使用在线卷轴到卷轴处理技术制造,通过以一定长度的铜箔起始(100),该铜箔用作电容器的一个板,然后在陶瓷前体的一部分上沉积(120)一层陶瓷前体 在第一站的铜箔的一侧。 箔片先进(117,127,137,147)到陶瓷前体和铜箔被加热(130)的下一个工位,以除去任何载体溶剂或载体,然后热解(140)以除去任何残留的有机材料。 然后在高温下烧结(150)以将陶瓷转化为多晶陶瓷。 然后将最终的顶部金属层沉积(160)在多晶陶瓷上以形成电容器的另一个板
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公开(公告)号:EP1578543A4
公开(公告)日:2008-10-01
申请号:EP03814859
申请日:2003-12-18
Applicant: MOTOROLA INC
Inventor: CROSWELL ROBERT , SAVIC JOVICA , TUNGARE AROON , KIM TAEYUN , KINGON ANGUS IAN , MARIA JON-PAUL
CPC classification number: H01G4/018 , C23C26/00 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , H01G4/12 , H05K1/162 , H05K3/388 , H05K2201/0175 , H05K2201/0355 , H05K2203/1545
Abstract: Thin film ceramic foil capacitors are produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor
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