公开(公告)号：WO2010027570A2

公开(公告)日：2010-03-11

申请号：PCT/US2009/051386

申请日：2009-07-22

Applicant: MOTOROLA, INC. ,  DAI, Xunhu ,  CROSWELL, Robert ,  PETSINGER, Jeffrey ,  SADLER, Daniel, J. ,  DUNN, Gregory, J.

Inventor： DAI, Xunhu ,  CROSWELL, Robert ,  PETSINGER, Jeffrey ,  SADLER, Daniel, J. ,  DUNN, Gregory, J.

IPC: G06F3/041 ,  G06F3/01 ,  H03K17/96

CPC classification number: G06F3/016 ,  G06F3/0202 ,  H03K17/9622 ,  H03K2217/96062

Abstract: Touch sensors with one or more piezoelectric elements and devices containing such touch sensors are presented. The touch sensor contains keys that are independently actuated. Contact with a key provides tactile feedback through the piezoelectric element to the user. Each key provides an individual tactile feedback pattern that is dependent on the particular key contacted as well as the function of the key at the time of contact. Actuation of the key provides a different tactile feedback pattern. The piezoelectric element is bonded directly to a printed circuit board, on which electronic components are also mounted.

Abstract translation: 介绍了带有一个或多个压电元件的触摸传感器以及包含这种触摸传感器的设备。 触摸传感器包含独立启动的按键。 与钥匙接触通过压电元件向用户提供触觉反馈。 每个按键都提供一个独立的触觉反馈模式，该模式取决于所接触的特定按键以及按键在接触时的功能。 钥匙的启动提供了不同的触觉反馈模式。 压电元件直接粘合到印刷电路板上，电子元件也安装在该印刷电路板上。

公开(公告)号：WO2007075714A2

公开(公告)日：2007-07-05

申请号：PCT/US2006/048472

申请日：2006-12-19

Applicant: MOTOROLA, INC. ,  KEMET ELECTRONICS CORPORATION ,  DUNN, Gregory J., ,  CHELINI, Remy J., ,  CROSWELL, Robert T., ,  LESSNER, Philip M., ,  PREVALLET, Michael D., ,  PRYMAK, John D.,

Inventor： DUNN, Gregory J., ,  CHELINI, Remy J., ,  CROSWELL, Robert T., ,  LESSNER, Philip M., ,  PREVALLET, Michael D., ,  PRYMAK, John D.,

IPC: H01G9/00

CPC classification number: H01G9/045 ,  H01G9/0032 ,  H01G9/055 ,  H01G9/15 ,  H05K1/162 ,  H05K3/383 ,  H05K3/429 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2203/0315

Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymer layer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.

Abstract translation: 嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。 铝层具有与第一铜层相邻的光滑侧和与第一铜层相对的高表面积纹理侧（215）。 双金属箔进一步包括位于铝层的高表面积纹理侧上的氧化铝层（305），位于氧化铝层上的导电聚合物层（420）以及位于氧化铝层上的第二铜层（535） 。 双金属箔可嵌入电路板（700）中以形成高价值的嵌入式电容器。

公开(公告)号：WO2007075714A3

公开(公告)日：2007-12-21

申请号：PCT/US2006048472

申请日：2006-12-19

Applicant: MOTOROLA INC ,  KEMET ELECTRONICS CORP ,  DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  LESSNER PHILIP M ,  PREVALLET MICHAEL D ,  PRYMAK JOHN D

Inventor： DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  LESSNER PHILIP M ,  PREVALLET MICHAEL D ,  PRYMAK JOHN D

IPC: H01G9/00

CPC classification number: H01G9/045 ,  H01G9/0032 ,  H01G9/055 ,  H01G9/15 ,  H05K1/162 ,  H05K3/383 ,  H05K3/429 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2203/0315

Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymer layer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.

Abstract translation: 嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。 铝层具有邻近第一铜层的平滑侧面和与第一铜层相对的高表面积纹理化侧面（215）。 双金属箔还包括在铝层的高表面积纹理化侧的氧化铝层（305），氧化铝层上的导电聚合物层（420）和覆盖氧化铝层的第二铜层（535） 。 双金属箔可以嵌入在电路板（700）中以形成高价值的嵌入式电容器。

公开(公告)号：WO2006101638A2

公开(公告)日：2006-09-28

申请号：PCT/US2006005839

申请日：2006-02-17

Applicant: MOTOROLA INC ,  DUNN GREGORY J ,  CROSWELL ROBERT T ,  MAGERA JAROSLAW A ,  SAVIC JOVICA ,  TUNGARE AROON V

Inventor： DUNN GREGORY J ,  CROSWELL ROBERT T ,  MAGERA JAROSLAW A ,  SAVIC JOVICA ,  TUNGARE AROON V

IPC: B44C1/22 ,  C23F1/00

CPC classification number: C23F1/40 ,  C23F1/02 ,  C23F1/32 ,  C23F1/34 ,  H05K1/162 ,  H05K3/0044 ,  H05K3/025 ,  H05K3/06 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0746

Abstract: A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.

Abstract translation: 公开了一种用于制造图案化的嵌入式电容层的方法。 该方法包括制造覆盖在印刷电路衬底（505）上的导电金属层（515）上的陶瓷氧化物层（510），在区域（705）内穿孔（1320）陶瓷氧化物层，以及去除 （1325）通过化学蚀刻导电金属层的区域中的陶瓷氧化物层和导电金属层。 陶瓷氧化物层可以小于1微米厚。

公开(公告)号：WO2008109283A1

公开(公告)日：2008-09-12

申请号：PCT/US2008/054906

申请日：2008-02-25

Applicant: KEMET ELECTRONICS CORPORATION ,  MOTOROLA, INC. ,  PRYMAK, John, D. ,  STOLARSKI, Chris ,  JACOBS, David ,  WAYNE, Chris ,  LESSNER, Philip ,  KINARD, John, T. ,  MELODY, Alethia ,  DUNN, Gregory ,  CROSWELL, Robert, T. ,  CHELINI, Remy, J.

Inventor： PRYMAK, John, D. ,  STOLARSKI, Chris ,  JACOBS, David ,  WAYNE, Chris ,  LESSNER, Philip ,  KINARD, John, T. ,  MELODY, Alethia ,  DUNN, Gregory ,  CROSWELL, Robert, T. ,  CHELINI, Remy, J.

IPC: H01G9/004 ,  H01G9/00

CPC classification number: H01G9/0029 ,  H01G9/012 ,  H01G9/0425 ,  H01G9/055 ,  H01G9/15 ,  H05K1/185 ,  Y10T29/417

Abstract: An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

Abstract translation: 一种形成电容器的改进方法。 该方法包括以下步骤：提供金属箔; 在金属箔上形成电介质; 将非导电聚合物坝施加在电介质上以隔离电介质的离散区域; 在电介质上的离散区域的至少一个离散区域中形成阴极; 并且在非导电聚合物阻挡件处切割金属箔以将包括一个阴极，电介质的一个离散区域和金属箔的一部分的至少一个电容器与电介质的离散区域隔离。

公开(公告)号：WO2007075713A2

公开(公告)日：2007-07-05

申请号：PCT/US2006/048471

申请日：2006-12-19

Applicant: MOTOROLA, INC. ,  DUNN, Gregory, J. ,  CROSWELL, Robert, T. ,  KUMPF, George, H. ,  SVIGELJ, John, A.

Inventor： DUNN, Gregory, J. ,  CROSWELL, Robert, T. ,  KUMPF, George, H. ,  SVIGELJ, John, A.

IPC: H01Q15/24

CPC classification number: H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）电耦合在两个导电板（318）之间的至少一个电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）和（b）嵌入印刷电路板（302）内的夹层电容器中的至少一个。

公开(公告)号：WO2005062803A3

公开(公告)日：2006-02-16

申请号：PCT/US2004042529

申请日：2004-12-17

Applicant: MOTOROLA INC ,  DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  DEAN TIMOTHY B ,  GAMBOA CLAUDIA V ,  SAVIC JOVICA

Inventor： DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  DEAN TIMOTHY B ,  GAMBOA CLAUDIA V ,  SAVIC JOVICA

IPC: H05K1/16 ,  H05K3/02 ,  H05K3/42 ,  B32B9/00

CPC classification number: H05K1/162 ,  H05K3/025 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

Abstract: A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (> 1000 pf/mm²).

Abstract translation: 电介质电路板箔（400,600）包括导电金属箔层（210,660），邻近导电金属箔层的第一表面设置的结晶介电氧化物层（405,655），镍酸镧层（414） ，664）和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层（415,665）。 箔（400,600）可以粘附到印刷电路板子结构（700）上，并用于经济地制造多个嵌入式电容器，包括具有大电容密度（> 1000pf / mm 2）的隔离电容器。

公开(公告)号：WO2010117583A3

公开(公告)日：2010-10-14

申请号：PCT/US2010/027745

申请日：2010-03-18

Applicant: MOTOROLA, INC. ,  TAYLOR, Brent A., ,  CROSWELL, Robert T., ,  DUNN, Gregory J.,

Inventor： TAYLOR, Brent A., ,  CROSWELL, Robert T., ,  DUNN, Gregory J.,

IPC: G06Q50/00

Abstract: A method of presenting content from a remote device is provided. Limited bandwidth content, transmitted from a remote device, is received at a local device. The limited bandwidth content is superimposed on enhanced content retrieved by the local device. The limited bandwidth content overlaps with the enhanced content such that the limited bandwidth content is a subset of what is represented by the enhanced content. The limited bandwidth or enhanced content may either be still images or video that is stitched together and displayed at the local device.

公开(公告)号：WO2010117583A2

公开(公告)日：2010-10-14

申请号：PCT/US2010027745

申请日：2010-03-18

Applicant: MOTOROLA INC ,  TAYLOR BRENT A ,  CROSWELL ROBERT T ,  DUNN GREGORY J

Inventor： TAYLOR BRENT A ,  CROSWELL ROBERT T ,  DUNN GREGORY J

IPC: G06Q50/00

CPC classification number: H04N7/163 ,  H04N21/44012 ,  H04N21/458

Abstract: A method of presenting content from a remote device is provided. Limited bandwidth content, transmitted from a remote device, is received at a local device. The limited bandwidth content is superimposed on enhanced content retrieved by the local device. The limited bandwidth content overlaps with the enhanced content such that the limited bandwidth content is a subset of what is represented by the enhanced content. The limited bandwidth or enhanced content may either be still images or video that is stitched together and displayed at the local device.

Abstract translation: 提供了一种从远程设备呈现内容的方法。 在本地设备接收到从远程设备发送的有限带宽内容。 有限带宽内容叠加在由本地设备检索的增强内容上。 有限带宽内容与增强内容重叠，使得有限带宽内容是由增强内容表示的内容的子集。 有限带宽或增强内容可以是拼接在一起并显示在本地设备上的静止图像或视频。

公开(公告)号：WO2007075713A3

公开(公告)日：2008-10-02

申请号：PCT/US2006048471

申请日：2006-12-19

Applicant: MOTOROLA INC ,  DUNN GREGORY J ,  CROSWELL ROBERT T ,  KUMPF GEORGE H ,  SVIGELJ JOHN A

Inventor： DUNN GREGORY J ,  CROSWELL ROBERT T ,  KUMPF GEORGE H ,  SVIGELJ JOHN A

IPC: H05K1/16 ,  H01L29/76

CPC classification number: H01Q15/006 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09609

Abstract: A high impedance surface (300) has a printed circuit board (302) with a first surface (314) and a second surface (316), and a continuous electrically conductive plate (319) disposed on the second surface (316) of the printed circuit board (302). A plurality of electrically conductive plates (318) is disposed on the first surface (314) of the printed circuit board (302), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor (330, 331) electrically coupled between at least two of the electrically conductive plates (318) and embedded within the printed circuit board (302), and (2) at least one capacitor (320) electrically coupled between two of the electrically conductive plates (318). The capacitor (320) comprises at least one of (a) a dielectric material (328) disposed between adjacent electrically conductive plates, and (b) a mezzanine capacitor embedded within the printed circuit board (302).

Abstract translation: 高阻抗表面（300）具有带有第一表面（314）和第二表面（316）的印刷电路板（302）和设置在印刷的第二表面（316）上的连续导电板（319） 电路板（302）。 多个导电板（318）设置在印刷电路板（302）的第一表面（314）上，同时还提供多个元件。 每个元件包括（1）至少一个电耦合在至少两个导电板（318）之间并嵌入印刷电路板（302）内的多层电感器（330,331）中的至少一个，和（2 ）电耦合在两个导电板（318）之间的至少一个电容器（320）。 电容器（320）包括设置在相邻导电板之间的（a）介电材料（328）和（b）嵌入印刷电路板（302）内的夹层电容器中的至少一个。