公开(公告)号：AT434922T

公开(公告)日：2009-07-15

申请号：AT00906973

申请日：2000-01-20

Applicant: MOTOROLA INC

Inventor： LEE TIEN ,  LACH LAWRENCE ,  DUNN GREGORY

IPC: H05K1/16 ,  H01C1/01 ,  H01C7/00 ,  H01C17/06 ,  H05K3/00 ,  H05K3/46

Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).

公开(公告)号：EP1082732A4

公开(公告)日：2006-11-22

申请号：EP00906973

申请日：2000-01-20

Applicant: MOTOROLA INC

Inventor： LEE TIEN ,  LACH LAWRENCE ,  DUNN GREGORY J

IPC: H05K1/16 ,  H01C1/01 ,  H01C7/00 ,  H01C17/06 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/167 ,  H05K3/0023 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0317 ,  H05K2201/09509 ,  H05K2201/09672 ,  H05K2201/09845 ,  H05K2201/10045 ,  H05K2203/0361 ,  Y10T29/49082

Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).

公开(公告)号：DE60042438D1

公开(公告)日：2009-08-06

申请号：DE60042438

申请日：2000-01-20

Applicant: MOTOROLA INC

Inventor： LEE TIEN ,  LACH LAWRENCE ,  DUNN GREGORY J

IPC: H01C1/01 ,  H01C7/00 ,  H01C17/06 ,  H05K1/16 ,  H05K3/00 ,  H05K3/46

Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).