公开(公告)号：WO1998001013A3

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K01/00

公开(公告)号：EP0852896A2

公开(公告)日：1998-07-15

申请号：EP97932159.0

申请日：1997-06-09

Applicant: MOTOROLA, INC.

Inventor： HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two of the biggest problems encountered in cellular manufacturing lines. The method and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves (606, 608) are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs (604) and v-groove (606, 608) configurations tearing, delamination are eliminated, and sagging is substantially reduced.

公开(公告)号：EP0859951A1

公开(公告)日：1998-08-26

申请号：EP97925660.0

申请日：1997-05-21

Applicant: MOTOROLA, INC.

Inventor： OH, Seajin ,  JOSEPH, Jose ,  ADAMS, Neil ,  YOUNG, Daniel, A. ,  MUI, Gary, K.

IPC: G01N25 ,  G01N33

CPC classification number: G01N33/0047 ,  G01N25/28 ,  G01N33/0016

Abstract: A selective gas sensor (10) for detecting a particular compound, or group of compounds, such as non-methane hydrocarbons, within a high temperature gas stream (12) includes an oxygen generation sytem (14) positioned over an oxygen diffusion region (15). The oxygen generation system (14) and the oxygen diffusion region (15) provide oxygen through a medial temperature control zone (20) to a sensing element (16). The temperature and flux of hydrocarbon components within the high temperature gas stream (12) are regulated by components within the high temperature control zone (20) and by an external temperature control zone (22) in thermal contact with the sensing element (16).

公开(公告)号：WO1998008074A1

公开(公告)日：1998-02-26

申请号：PCT/US1997008567

申请日：1997-05-21

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  OH, Seajin ,  JOSEPH, Jose ,  ADAMS, Neil ,  YOUNG, Daniel, A. ,  MUI, Gary, K.

IPC: G01N07/00

CPC classification number: G01N33/0047 ,  G01N25/28 ,  G01N33/0016

Abstract: A selective gas sensor (10) for detecting a particular compound, or group of compounds, such as non-methane hydrocarbons, within a high temperature gas stream (12) includes an oxygen generation sytem (14) positioned over an oxygen diffusion region (15). The oxygen generation system (14) and the oxygen diffusion region (15) provide oxygen through a medial temperature control zone (20) to a sensing element (16). The temperature and flux of hydrocarbon components within the high temperature gas stream (12) are regulated by components within the high temperature control zone (20) and by an external temperature control zone (22) in thermal contact with the sensing element (16).

Abstract translation: 用于在高温气流（12）内检测特定化合物或一组化合物（例如非甲烷烃）的选择性气体传感器（10）包括位于氧扩散区（15）上方的氧气生成系统（14） ）。 氧气产生系统（14）和氧气扩散区域（15）通过内部温度控制区（20）向感测元件（16）提供氧气。 高温气流（12）内的烃组分的温度和流量由高温控制区（20）内的组分和与感测元件（16）热接触的外部温度控制区（22）调节。

公开(公告)号：WO1998001013A2

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K00/00

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations tearing, delamination are eliminated, and sagging is substantially reduced.

Abstract translation: 在前板组装过程中，板卡分离时板材分层和板下垂是细胞生产线中遇到的两个最大问题。 本发明的方法（700）和电路板面板（600）基本上消除了用于电路板制造的组装线分层和下垂。 多个槽被冲孔以适应电路板轮廓。 沿着每个电路板轮廓通过槽切割V形槽，并且直接相对于电路板的顶部和底部。 因此，消除了切口和V形槽结构的优化，撕裂，分层，并且下垂显着降低。