公开(公告)号：WO1998001013A2

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K00/00

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations tearing, delamination are eliminated, and sagging is substantially reduced.

Abstract translation: 在前板组装过程中，板卡分离时板材分层和板下垂是细胞生产线中遇到的两个最大问题。 本发明的方法（700）和电路板面板（600）基本上消除了用于电路板制造的组装线分层和下垂。 多个槽被冲孔以适应电路板轮廓。 沿着每个电路板轮廓通过槽切割V形槽，并且直接相对于电路板的顶部和底部。 因此，消除了切口和V形槽结构的优化，撕裂，分层，并且下垂显着降低。

公开(公告)号：WO1998001013A3

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K01/00

公开(公告)号：EP0852896A2

公开(公告)日：1998-07-15

申请号：EP97932159.0

申请日：1997-06-09

Applicant: MOTOROLA, INC.

Inventor： HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two of the biggest problems encountered in cellular manufacturing lines. The method and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves (606, 608) are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs (604) and v-groove (606, 608) configurations tearing, delamination are eliminated, and sagging is substantially reduced.