公开(公告)号：WO1998001013A2

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K00/00

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations tearing, delamination are eliminated, and sagging is substantially reduced.

Abstract translation: 在前板组装过程中，板卡分离时板材分层和板下垂是细胞生产线中遇到的两个最大问题。 本发明的方法（700）和电路板面板（600）基本上消除了用于电路板制造的组装线分层和下垂。 多个槽被冲孔以适应电路板轮廓。 沿着每个电路板轮廓通过槽切割V形槽，并且直接相对于电路板的顶部和底部。 因此，消除了切口和V形槽结构的优化，撕裂，分层，并且下垂显着降低。

公开(公告)号：WO1998001013A3

公开(公告)日：1998-01-08

申请号：PCT/US1997009974

申请日：1997-06-09

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K01/00

公开(公告)号：EP0852896A2

公开(公告)日：1998-07-15

申请号：EP97932159.0

申请日：1997-06-09

Applicant: MOTOROLA, INC.

Inventor： HU, Kai, X. ,  DOU, Xinyu ,  YEH, Chao-Pin ,  DILLARD, Don ,  JUAREZ, Delbert ,  MUI, Gary, K. ,  BREY, Thomas ,  DLESK, Richard ,  WYATT, Karl ,  ROLLER, Dave

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09827 ,  Y10T29/49155

Abstract: Board delamination during the singulation from a board panel and board sagging during front-end assembly are two of the biggest problems encountered in cellular manufacturing lines. The method and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves (606, 608) are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs (604) and v-groove (606, 608) configurations tearing, delamination are eliminated, and sagging is substantially reduced.

公开(公告)号：EP0859947A1

公开(公告)日：1998-08-26

申请号：EP97934097.0

申请日：1997-07-11

Applicant: MOTOROLA, INC.

Inventor： YEH, Jang-Hun, (James) ,  HARTON, Austin, V. ,  JIANG, Wenbin ,  LEBBY, Michael ,  LUREY, Daniel, M. ,  MORIKUNI, James, J. ,  WYATT, Karl

IPC: G01J1 ,  G06K7 ,  H01L33 ,  H01S5

CPC classification number: G06K7/10851 ,  G06K2207/1015 ,  G06K2207/1018 ,  H01S5/02212 ,  H01S5/02296 ,  H01S5/0264 ,  H01S5/0683 ,  H01S5/183

Abstract: The present invention provides a device (200, 300) and a method (100) for providing optical feedback for an optical package. The device includes: an optical emitter (202), responsive to an electrical input current (208), for generating a beam of light; a partially reflective holographic optical element/reflector (204), arranged to allow a first predetermined portion of the beam to exit the partially reflective holographic optical element/reflector and to diffract a second predetermined portion of the beam to an optical sensing unit (206); and the optical sensing unit, arranged to receive the second predetermined portion of the beam, for generating feedback for adjusting the electrical input current to the optical emitter based on a received optical power of the second predetermined portion of the beam.

公开(公告)号：WO1998002719A1

公开(公告)日：1998-01-22

申请号：PCT/US1997012023

申请日：1997-07-11

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  YEH, Jang-Hun, (James) ,  HARTON, Austin, V. ,  JIANG, Wenbin ,  LEBBY, Michael ,  LUREY, Daniel, M. ,  MORIKUNI, James, J. ,  WYATT, Karl

IPC: G01J01/32

CPC classification number: G06K7/10851 ,  G06K2207/1015 ,  G06K2207/1018 ,  H01S5/02212 ,  H01S5/02296 ,  H01S5/0264 ,  H01S5/0683 ,  H01S5/183

Abstract: The present invention provides a device (200, 300) and a method (100) for providing optical feedback for an optical package. The device includes: an optical emitter (202), responsive to an electrical input current (208), for generating a beam of light; a partially reflective holographic optical element/reflector (204), arranged to allow a first predetermined portion of the beam to exit the partially reflective holographic optical element/reflector and to diffract a second predetermined portion of the beam to an optical sensing unit (206); and the optical sensing unit, arranged to receive the second predetermined portion of the beam, for generating feedback for adjusting the electrical input current to the optical emitter based on a received optical power of the second predetermined portion of the beam.

Abstract translation: 本发明提供了一种用于为光学封装提供光学反馈的装置（200,300）和方法（100）。 该装置包括：响应于电输入电流（208）的光发射器（202），用于产生光束; 布置成允许光束的第一预定部分离开部分反射全息光学元件/反射器并将光束的第二预定部分衍射到光学感测单元（206）的部分反射全息光学元件/反射器（204） ; 以及所述光学感测单元，布置成接收所述光束的第二预定部分，用于基于所述光束的所述第二预定部分的接收光功率产生用于调整到所述光发射器的电输入电流的反馈。