公开(公告)号：US20170003319A1

公开(公告)日：2017-01-05

申请号：US15172931

申请日：2016-06-03

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  HAO WEI ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: G01R1/073 ,  G01R1/04

CPC classification number: G01R1/07378 ,  G01R31/2889 ,  G01R31/31716 ,  G01R31/31905

Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.

Abstract translation: 支持环回测试并在PCB和DUT之间提供的探头模块包括适配器，两个探头，在适配器处提供的两个感应元件以及电容元件。 适配器有两个连接电路。 每个探针的一端连接到一个连接电路，而另一端是尖端，与DUT接触。 每个感应部件具有电连接到一个连接电路的端部，另一端通过设置在适配器处的导电部件电连接到PCB，其中电容部件的两端电连接到 连接电路。 由此信号路径由信号频率之间的差异改变，高频信号的传输路径被有效缩短。

公开(公告)号：US20170150592A1

公开(公告)日：2017-05-25

申请号：US15423584

申请日：2017-02-03

Applicant: MPI corporation

Inventor： WEI-CHENG KU ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/18 ,  H05K3/421 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/09545 ,  H05K2203/0369 ,  H05K2203/1461

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

公开(公告)号：US20170115326A1

公开(公告)日：2017-04-27

申请号：US15333400

申请日：2016-10-25

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  CHIH-HAO HO ,  HAO WEI

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06794 ,  G01R1/07342 ,  G01R31/2889

Abstract: A probe module includes a base adapted to be fixed to a tester, an engaging seat engaged with the base, a signal connector, an electrical signal transmitting member, and two probes located below the engaging seat. The engaging seat has an engaging opening and a first end surface. The signal connector is provided in the engaging opening, and has a signal conductive portion and a conductive ground. A signal wire and a ground layer of the electrical signal transmitting member are electrically connected to the signal conductive portion and the conductive ground, respectively. The probes are electrically connected to the signal wire and the ground layer, respectively. The probes extend out of a first extending reference plane of the first end surface. Alternatively, a reflector is used to reflect an image of the probes upward. Whereby, a length of the electrical signal transmitting member can be further shortened.

公开(公告)号：US20160143141A1

公开(公告)日：2016-05-19

申请号：US14619944

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0268 ,  H05K1/113 ,  H05K2201/10265 ,  H05K2201/10295

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate first substrate a first pad, and a first circuit, wherein the first circuit is embedded in the first substrate, and the first pad is electrically connected to the first circuit. The second substrate has a first through hole, a second pad, and a second circuit, wherein the first through hole is opened at both sides of the second substrate, and the first pad of the first substrate is in the first through hole; the second circuit is embedded in the second substrate, and the second pad is electrically connected to the second circuit. The pads on each substrate are exposed by the through hole(s) of the above substrate(s) to shorten the null sections of the interconnectors and reduce the interference from the null sections.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一衬底第一衬底是第一衬垫和第一电路，其中第一电路嵌入在第一衬底中，并且第一衬垫电连接到第一电路。 第二基板具有第一通孔，第二焊盘和第二电路，其中第一通孔在第二基板的两侧开口，第一基板的第一焊盘位于第一通孔中; 第二电路嵌入第二衬底中，第二衬垫电连接到第二电路。 每个衬底上的焊盘由上述衬底的通孔暴露，以缩短互连器的零部分，并减少无效部分的干扰。

公开(公告)号：US20150204906A1

公开(公告)日：2015-07-23

申请号：US14558302

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  HAO WEI ,  CHIA-NAN CHOU ,  CHIH-HAO HO

IPC: G01R1/04 ,  G01R31/04

CPC classification number: G01R31/041 ,  G01R1/0466

Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.

Abstract translation: 测试夹具包括基板和多个导电弹性件，其中所述基板具有凹部和多个电路; 凹部位于基板的顶表面上，而电路设置在基板的顶表面上。 导电弹性片设置在基板上，分别电连接到电路。 每个导电弹性片具有位于凹部的正投影范围内的接触部分，其中每个接触部分接触DUT的焊盘。 由此，通过使用导电弹性片传输测试信号，可以有效地降低传输高频测试信号的衰减。

公开(公告)号：US20160139179A1

公开(公告)日：2016-05-19

申请号：US14619597

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  HAO WEI ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/06727 ,  G01R1/06772

Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.

Abstract translation: 高频悬臂式探针卡包括基板，设置在基板上的探针基座，两个探针和具有与探针分别电连接的相对端的电容器。 探针基座由绝缘材料制成，探针由导电材料制成。 每个探针具有臂和尖端，其中臂连接到探针基座，并且尖端适于接触DUT的焊盘。 当DUT产生高频测试信号时，测试信号按顺序传输到探头之一，电容器和另一个探头，然后传送回DUT。

公开(公告)号：US20160128176A1

公开(公告)日：2016-05-05

申请号：US14620015

申请日：2015-02-11

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/18 ,  H05K3/421 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/09545 ,  H05K2203/0369 ,  H05K2203/1461

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Abstract translation: 多层电路板包括第一衬底和堆叠中的第二衬底。 第一基板设置有第一焊盘，第二焊盘和第一子电路。 第一焊盘和第二焊盘电连接到第一子电路。 第二基板具有顶表面，底表面和开口。 第二基板的底表面附接到第一基板的顶表面。 开口从第二基板的顶表面延伸到底表面。 第一基板的第一焊盘在第二基板的开口中; 第一衬底的第二衬垫不被第二衬底覆盖。 第二基板还在顶表面上设置有焊盘，并且电连接到第二基板的焊盘的第二子电路。

公开(公告)号：US20160018439A1

公开(公告)日：2016-01-21

申请号：US14797626

申请日：2015-07-13

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  HAO WEI ,  JUN-LIANG LAI ,  CHIH-HAO HO

IPC: G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0416 ,  G01R1/06794 ,  G01R31/02 ,  G01R31/2889

Abstract: A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.

Abstract translation: 探针卡包括连接电路板，连接器和探头。 连接电路板包括具有信号通路和多个接地通孔的基板，设置在基板上的信号馈送结构以及设置有连接器的连接层。 信号馈送结构包括信号馈送焊盘和接地焊盘，其连接到接地通孔，并且具有匹配的补偿开口，其具有比第一侧宽的第一侧和第二侧。 信号馈送垫不接触接地垫，并且具有比第一端更宽的第一端和第二端。 第二端连接到信号通道。 连接层具有连接到信号通孔的信号连接部分和连接到接地通路的接地连接部分。 探头连接到第一端。

公开(公告)号：US20150204962A1

公开(公告)日：2015-07-23

申请号：US14557181

申请日：2014-12-01

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  SHAO-WEI LU ,  HAO WEI ,  YU-TSE WANG

IPC: G01R35/00 ,  G01R31/04

CPC classification number: G01R31/2891 ,  G01R35/005

Abstract: A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests.

Abstract translation: 提供了一种操作测试系统的方法，其中所述测试系统具有测试机器和探针模块，所述测试机器和探针模块具有第一探针组和第二探针组。 第一个探针组和第二个探针组之一可以连接到测试机。 该方法包括以下步骤：连接测试机和第一个探头组; 校准测试系统; 将第一个探测器对准DUT进行电气测试; 断开第一个探针组和DUT; 断开测试机和第一个探头组; 连接测试机和第二个探头组; 再次校准测试系统; 将第二个探测器对准DUT，进行电气测试。

公开(公告)号：US20150204905A1

公开(公告)日：2015-07-23

申请号：US14557879

申请日：2014-12-02

Applicant: MPI CORPORATION

Inventor： WEI-CHENG KU ,  HAO WEI ,  CHIA-NAN CHOU ,  CHIH-HAO HO

IPC: G01R1/04 ,  G01R31/04

CPC classification number: G01R1/0466

Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.

Abstract translation: 测试夹具包括衬底，设置在衬底上的载体，由导电材料制成的两个导电构件和由导电材料制成的补偿构件。 衬底上具有信号电路和接地电路。 载体具有由绝缘材料制成的基板和设置在其上的由导电材料制成的导电电路。 基板具有与信号电路对准的信号穿孔，与接地电路对准的接地穿孔，以及多个补偿孔。 导电构件都具有暴露在载体外的端部，并且分别装配在信号穿孔和接地穿孔中，以使另一端与信号电路或接地电路接触。 补偿部件安装在一个补偿孔中，以通过导电电路与接地穿孔中的导电部件电连接。