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    IMMERSION COOLING TEMPERATURE CONTROL METHOD, SYSTEM, AND APPARATUS
    1.
    发明申请
    IMMERSION COOLING TEMPERATURE CONTROL METHOD, SYSTEM, AND APPARATUS 审中-公开

    公开(公告)号：WO2019173051A1

    公开(公告)日：2019-09-12

    申请号：PCT/US2019/018766

    申请日：2019-02-20

    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

    Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, Harlan Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

    IPC: H05K7/20

    Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.

    CIRCUIT CARD ASSEMBLY AND METHOD OF PROVIDING SAME
    2.
    发明申请
    CIRCUIT CARD ASSEMBLY AND METHOD OF PROVIDING SAME 审中-公开
    电路卡组件及其提供方法

    公开(公告)号：WO2017087093A1

    公开(公告)日：2017-05-26

    申请号：PCT/US2016/056446

    申请日：2016-10-11

    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

    Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, H. Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

    IPC: H05K1/02 ,  H01L39/22 ,  H05K1/03

    CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/303 ,  H05K3/46 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09763

    Abstract: A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials. The first material is preferably copper and the second material is preferably niobium.

    Abstract translation: 电路卡组件包括具有纵向间隔开的第一和第二基板端部边缘以及横向间隔开的顶部和底部基板表面的基板。 顶部和/或底部衬底表面具有第一，第二和第三衬底区域。 第一基板区域直接侧向邻近第一基板侧边缘。 第三衬底区域直接侧向邻近第二衬底侧边缘。 第二衬底区域位于第一和第三衬底区域之间。 至少一个电路迹线位于所选衬底表面上。 第一衬底区域中的电路迹线的部分仅由第一材料制成。 第三衬底区域中的电路迹线的部分仅由第二材料制成。 第二衬底区域中的电路迹线部分由第一和第二材料制成。 第一种材料最好是铜，第二种材料最好是铌。

    APPARATUS AND METHOD FOR PROVIDING A TEMPERATURE-DIFFERENTIAL CIRCUIT CARD ENVIRONMENT
    3.
    发明申请
    APPARATUS AND METHOD FOR PROVIDING A TEMPERATURE-DIFFERENTIAL CIRCUIT CARD ENVIRONMENT 审中-公开
    提供温差电路卡环境的装置和方法

    公开(公告)号：WO2017087092A1

    公开(公告)日：2017-05-26

    申请号：PCT/US2016/056444

    申请日：2016-10-11

    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

    Inventor： CHRISTIANSEN, Martin Brokner ,  CHOROSINSKI, Leonard George ,  HEFFNER, H. Craig ,  WAKAMIYA, Stanley Katsuyoshi ,  KIRKWOOD, Keith R.

    IPC: H05K5/02 ,  H01L23/44

    CPC classification number: H05K1/0204 ,  H01L23/445 ,  H05K5/0213 ,  H05K13/0023

    Abstract: An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.

    Abstract translation: 用于提供期望的温差电路卡环境的装置和方法包括多个卡单元。 每个卡单元包括第一热板，该第一热板具有在横向纵向平面中取向的前和后第一板侧，第一热板在第一板温度下操作。 第二热板具有在横向纵向平面中取向的前和后第二板侧，第二热板在第二板温度下操作。 耦合器在横向纵向平面内取向，并且连接到第一板的正面和/或背面以及第二板的正面和/或背面以形成卡单元。 卡单元布置成横向定向的堆叠，第二卡单元的前部第一和第二板侧直接与第一卡单元的后部第一和第二板侧相邻。

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