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    OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE
    1.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：WO2019020189A1

    公开(公告)日：2019-01-31

    申请号：PCT/EP2017/069065

    申请日：2017-07-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： NG, Kok Eng ,  CHEW, Ivan Ken Yoong

    IPC: H01L25/16

    CPC classification number: H01L25/167

    Abstract: In one embodiment the optoelectronic semiconductor device (1) comprises a light source (2) having a plurality of optoelectronic semiconductor chips (21, 22, 23, 24) to produce light of different colors. Further, the semiconductor device (1) comprises a control unit (3) to control and to drive the optoelectronic semiconductor chips (21, 22, 23, 24) and also comprises a multi-channel micro-spectrometer (4) and a common housing (5). The light source (2), the control unit (3) and the multi-channel micro-spectrometer (4) are firmly connected with each other and mechanically permanently integrated in the common housing (5). An emission spectrum of the light source (2) is controlled by means of optical measurements of the multi-channel micro-spectrometer (4).

    LED-FILAMENT
    2.
    发明申请
    LED-FILAMENT 审中-公开

    公开(公告)号：WO2018224183A1

    公开(公告)日：2018-12-13

    申请号：PCT/EP2018/000300

    申请日：2018-06-08

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： LEE, Ee Lian ,  ECKERT, Tilman ,  BERTRAM, Ralph ,  NG, Kok Eng ,  MAT NAZRI, Anuarul Ikhwan

    IPC: F21K9/232 ,  F21K9/90 ,  H01L25/075 ,  H01L33/50 ,  F21Y103/10 ,  F21Y115/10

    Abstract: LED-Filament (1) mit einem Träger (2), wobei zwei elektrische Anschlüsse am Träger (2) ausgebildet sind, wobei auf dem Träger (2) wenigstens zwei Strahlungsemittierende Halbleiterchips angeordnet sind, wobei die Halbleiterchips elektrisch leitend mit den elektrischen Anschlüssen verbunden sind, wobei der Träger (2) aus einem für elektromagnetische Strahlung transparenten Material gebildet ist, wobei Unterseiten der Halbleiterchips über eine Klebeschicht (14) mit dem Träger (2) verbunden sind, wobei die Klebeschichten (14) Konversionsmaterial (15) aufweisen, wobei das Konversionsmaterial (15) ausgebildet ist, um wenigstens einen Teil der Wellenlänge der Strahlung der Halbleiterchips zu verschieben, und wobei die Halbleiterchips auf Oberseiten (16) und Seitenflächen (17) eine Konversionsschicht (18) aufweisen, wobei die Konversionsschichten (18) ausgebildet sind, um wenigstens einen Teil der Wellenlänge der Strahlung der Halbleiterchips zu verschieben.

    COMPONENT CARRIER ASSEMBLAGE FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENTS
    3.
    发明申请
    COMPONENT CARRIER ASSEMBLAGE FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENTS 审中-公开
    光电半导体元件的组件载体组装

    公开(公告)号：WO2015014408A1

    公开(公告)日：2015-02-05

    申请号：PCT/EP2013/066282

    申请日：2013-08-02

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： NG, Kok Eng ,  ONG, Eu Liong ,  YAP, Boon Liang ,  LOK, Kean Seong

    IPC: H05K1/02 ,  H05K3/00 ,  G01R31/26 ,  H01L21/782

    CPC classification number: H05K1/0268 ,  G01R1/0408 ,  G01R31/2635 ,  H01L25/0753 ,  H01L2224/48137 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0909 ,  H05K2201/10106

    Abstract: The invention relates to a component carrier assemblage for optoelectronic semiconductor components. The component carrier assemblage comprises a number of component carriers for arranging optoelectronic semiconductor components. Each component carrier comprises a first contact structure and a second contact structure to which optoelectronic semiconductor components may be electrically connected. The component carrier assemblage further comprises a first universal contact which is electrically connected to the first contact structures of the number of component carriers. The component carrier assemblage further comprises a second universal contact which is electrically connected to the second contact structures of the number of component carriers. The invention furthermore relates to a method of producing optoelectronic devices.

    Abstract translation: 本发明涉及一种用于光电半导体元件的元件载体组件。 分量载体组合包括用于布置光电子半导体组件的多个分量载波。 每个分量载体包括第一接触结构和第二接触结构，光电子半导体部件可以电连接到该第一接触结构和第二接触结构。 部件载体组合还包括电连接到多个分量载体的第一接触结构的第一通用接触件。 分量载体组合还包括第二通用接触件，其电连接到多个分量载体的第二接触结构。 本发明还涉及一种制造光电器件的方法。

    STRAHLUNGSEMITTIERENDES FILAMENT
    4.
    发明申请
    STRAHLUNGSEMITTIERENDES FILAMENT 审中-公开

    公开(公告)号：WO2018141861A1

    公开(公告)日：2018-08-09

    申请号：PCT/EP2018/052546

    申请日：2018-02-01

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： LEE, Ee Lian ,  ECKERT, Tilman ,  BERTRAM, Ralph Peter ,  NG, Kok Eng ,  MAT NAZRI, Anuarul Ikhwan

    IPC: H01L33/50 ,  H01L33/54

    CPC classification number: H01L33/54 ,  H01L33/50

    Abstract: Strahlungsemittierendes Filament (100) mit einem Träger (110), wobei auf dem Träger (110) wenigstens zwei Leuchtchips (120) angeordnet sind, wobei der Träger (110) an gegenüberliegenden Enden jeweils einen elektrischen Kontakt (130, 140) aufweist, wobei die Leuchtchips (120) mit den Kontakten (130, 140) elektrisch leitend verbunden sind, wobei der Träger (110) wenigstens im Bereich der Leuchtchips (120) von einer optischen Schicht (170) umgeben ist, wobei die optische Schicht (170) wenigstens drei Außenflächen (180, 190, 200) aufweist, wobei jede Außenfläche (180, 190, 200) in einer Ebene quer zur Längsachse als plane Fläche ausgebildet ist, und wobei die drei planen Außenflächen (180, 190, 200) in einem vorgegebenen Winkel zueinander angeordnet sind.

    WARNDREIECK FÜR EIN KRAFTFAHRZEUG
    6.
    发明申请
    WARNDREIECK FÜR EIN KRAFTFAHRZEUG 审中-公开
    三角警示牌用于机动车

    公开(公告)号：WO2012000947A1

    公开(公告)日：2012-01-05

    申请号：PCT/EP2011/060743

    申请日：2011-06-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  NG, Kok Eng ,  CHANG, Chee Jia

    Inventor： NG, Kok Eng ,  CHANG, Chee Jia

    IPC: B60Q7/00

    CPC classification number: B60Q7/00 ,  G09F13/16 ,  G09F13/22 ,  G09F2013/222

    Abstract: Es wird ein Warndreieck für ein Kraftfahrzeug angegeben, das mindestens eine Leuchtdiode (7, 1') umfasst, die im Betrieb Licht aussendet, und weiterhin einen Lichtleiter (8) aufweist, der das von der Leuchtdiode (7, 1') ausgesandte Licht zu einer Vorderseite (2) des Warndreiecks und zu einer Rückseite (3) des Warndreiecks leitet.

    Abstract translation: 提供了一种用于机动车辆的警告三角形，所述至少一个发光二极管（7,1“），其在操作期间发射光，并且还包括：光导（8），该发光二极管（7，1”）发射的光，以 警告三角形的前侧（2）和导向警告三角形的后侧（3）。

    ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：WO2017020958A1

    公开(公告)日：2017-02-09

    申请号：PCT/EP2015/068158

    申请日：2015-08-06

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： NG, Kok Eng ,  CHEW, Wui Chai ,  LIM, Choo Kean ,  KHALID, Mardiana

    IPC: H01L23/373

    CPC classification number: H01L23/3735 ,  H01L23/49811 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099

    Abstract: The invention relates to an electronic device comprising a carrier and a semiconductor chip. The carrier comprises a first dielectric layer and a second dielectric layer. A thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer. The second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer. The semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer. The carrier comprises a solder terminal for electrical contacting. The solder terminal is arranged on the second dielectric layer. The invention further relates to a method for producing an electronic device.

    Abstract translation: 本发明涉及一种包括载体和半导体芯片的电子设备。 载体包括第一介电层和第二介电层。 第一电介质层的导热率超过第二电介质层的热导率。 第二电介质层布置在第一电介质层上并部分地覆盖第一电介质层。 半导体芯片布置在载体上的第一介电层未被第二介电层覆盖的安装区域中。 载体包括用于电接触的焊接端子。 焊接端子布置在第二介质层上。 本发明还涉及一种电子设备的制造方法。

    LED MODULE AND LIGHTING SYSTEM
    8.
    发明申请
    LED MODULE AND LIGHTING SYSTEM 审中-公开
    LED模块和照明系统

    公开(公告)号：WO2015081974A1

    公开(公告)日：2015-06-11

    申请号：PCT/EP2013/075259

    申请日：2013-12-02

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： NG, Kok Eng ,  HAYAZI, Abdul Fakhir

    IPC: B60Q1/26 ,  F21S8/10 ,  B60Q1/34

    CPC classification number: B60Q1/2607 ,  B60Q1/34 ,  B60Q2400/20 ,  B60Q2400/30 ,  F21S43/14

    Abstract: The invention relates to an LED module (101, 102, 103) for a headlamp (150) of a vehicle. The LED module (101, 102, 103) comprises a carrier (105) and at least one first LED (110) and at least one second LED (120) arranged on the carrier. The at least one first LED (110) is configured to generate white light radiation. The at least one second LED (120) is configured to generate yellow light radiation. The LED module (101, 102, 103) is configured in such a way that the at least one first LED (110) and the at least one second LED (120) are independently operable. The invention further relates to a lighting system for a vehicle comprising an LED module (101, 102, 103).

    Abstract translation: 本发明涉及一种用于车辆前照灯（150）的LED模块（101,102,103）。 LED模块（101,102,103）包括载体（105）和布置在载体上的至少一个第一LED（110）和至少一个第二LED（120）。 所述至少一个第一LED（110）被配置为产生白光辐射。 至少一个第二LED（120）被配置为产生黄光辐射。 LED模块（101,102,103）被配置成使得至少一个第一LED（110）和至少一个第二LED（120）可独立操作。 本发明还涉及一种用于车辆的照明系统，其包括LED模块（101,102,103）。

    OPTOELECTRONIC PACKAGE
    10.
    发明申请
    OPTOELECTRONIC PACKAGE 审中-公开

    公开(公告)号：WO2019120482A1

    公开(公告)日：2019-06-27

    申请号：PCT/EP2017/083530

    申请日：2017-12-19

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： NG, Kok Eng ,  LIM, Choo Kean ,  MAT NAZRI, Anuarul Ikhwan

    IPC: H01L33/62 ,  H01L25/16

    CPC classification number: H01L33/62 ,  H01L25/167

    Abstract: The invention refers to an optoelectronic package comprising a carrier with a first conductive section, a second conductive section, a third conductive section and a fourth conductive section and a first insulating material arranged between the conductive sections. An optoelectronic semiconductor chip is arranged on a first top side of the first conductive section and electrically connected to a second top side of the second conductive section and a third top side of the third conductive section. The second conductive section and the third conductive section are arranged on opposite sides of the first conductive section. The fourth conductive section is arranged besides the third conductive section. A passive component is arranged electrically connected to the third conductive section and the fourth conductive section. The first insulating material is arranged between the conductive sections in a way that the first conductive section is electrically isolated from the second conductive section, from the third conductive section and from the fourth conductive section, and in a way that the third conductive section is electrically isolated from the second conductive section and from the fourth conductive section. A conductive material electrically connects the second conductive section and the fourth conductive section.

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