公开(公告)号：DE102006059127A1

公开(公告)日：2008-03-27

申请号：DE102006059127

申请日：2006-12-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： KIRSCH MARKUS ,  SEWALD RAINER

IPC: H05K1/18 ,  H01L27/15

Abstract: The method involves manufacturing two attachment areas (2) on a connection carrier (1) and bringing soldering material into the attachment areas. Another connection carrier is applied on the attachment areas and is dispersed on the former connection carrier with the soldering material within the attachment areas. The attachment area is manufactured by producing a recess in the former connection carrier and a metallization is applied on the former connection carrier. An independent claim is also included for an arrangement of optoelectronic components comprising a connector carrier, which has two attachment areas.

公开(公告)号：DE10308917A1

公开(公告)日：2004-09-16

申请号：DE10308917

申请日：2003-02-28

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HOEFER THOMAS ,  BRUNNER HERBERT ,  MOELLMER FRANK ,  WAITL GUENTER ,  SEWALD RAINER ,  ZEILER MARKUS

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00

Abstract: The opto electronic chip [50], eg a light emitting diode, is set at the centre of a dish shaped recess [12] formed in an insulating material. The surface is coated with a metallic reflective material. An isolating section [2] is used to form two reflective regions [16,18]. Connections are made with bond wires [35,52].

公开(公告)号：WO2008040307A3

公开(公告)日：2008-06-19

申请号：PCT/DE2007001714

申请日：2007-09-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  SEWALD RAINER ,  KIRSCH MARKUS

Inventor： SEWALD RAINER ,  KIRSCH MARKUS

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10121 ,  H05K2201/10977 ,  Y10T29/4913

Abstract: A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).

Abstract translation: 本发明涉及一种用于制造光电子部件（10）的布置的方法，其具有以下步骤：在第一连接载体（1）上产生至少两个紧固区域（2）; 将焊料（3）引入附接区域（2）; 将第二连接载体（4）施加到附接区域（2）; 以及在连接区域（2）中利用焊料材料（3）将第二连接载体（4）焊接到第一连接载体（1）上。