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公开(公告)号:DE102005019115B4
公开(公告)日:2010-04-08
申请号:DE102005019115
申请日:2005-04-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: BEHRINGER MARTIN , MOELLMER FRANK , HOEFER THOMAS , WAITL GUENTER
Abstract: The component has a lead frame (4), a carrier (6) with a chip mounting surface and a base surface opposite to the chip mounting surface. A side surface runs from the chip mounting surface to the base surface. A laser bars chip (3) is arranged on the chip mounting surface of the carrier. The lead frame is connected to the side surface and is designed as a heat sink. The chip is bonded with hard solder e.g. gold-tin solder.
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公开(公告)号:DE10306274B4
公开(公告)日:2007-04-12
申请号:DE10306274
申请日:2003-02-14
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: MOELLMER FRANK , HAUSHALTER MARTIN
IPC: B41J2/125 , B41J2/21 , B41J29/393 , G01N21/956
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公开(公告)号:DE19963809C2
公开(公告)日:2002-01-17
申请号:DE19963809
申请日:1999-12-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: STEEGMUELLER ULRICH , GROISS STEFAN , MOELLMER FRANK
Abstract: The present invention relates to an optical encoder for measuring the speed and direction of a moving raster. The raster may be moving linearly or angularly and may further be connected to a moving element, such as a spinning shaft, of which speed and orientation measurement Is sought. The raster may comprise a slit plate or the like and include many formations in sequence. The formations may be successively opaque and transparent to light. The raster modulates light from a light source and the modulated light is detected by at least one set of three photodetectors. Output of the photodetectors is then used to generate a reference signal to which individual outputs are compared. The results of the comparisons are indicative of the speed and direction of the raster and moving element to which the raster is attached. The at least one set of three photodetectors are oriented such that the combined lengths of the light receiving areas of the set of three photodetectors is between one half and one period of the raster. The photodetectors and evaluating circuitry used to process their output may be semiconductor components on a single substrate.
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公开(公告)号:DE102010012712A1
公开(公告)日:2011-09-29
申请号:DE102010012712
申请日:2010-03-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: MOELLMER FRANK , HAUSHALTER MARTIN
Abstract: Es wird ein Licht emittierendes Halbleiterbauteil (1) angegeben, mit – zumindest einem Leuchtdiodenchip (2), der im Betrieb Licht (3) erzeugt, und – einer gezielt eingestellten schiefen Abstrahlcharakteristik des vom Licht emittierenden Halbleiterbauteil im Betrieb abgestrahlten Lichts.
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公开(公告)号:DE102005028748A1
公开(公告)日:2006-05-04
申请号:DE102005028748
申请日:2005-06-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: MOELLMER FRANK , BOERNER MIKE
IPC: H01L33/60
Abstract: An optoelectronic component includes a component housing and a body comprising a carrier substrate and a radiation emitting layer sequence. In certain embodiments, the body is arranged in a reflector cup of the component housing and is electrically conductively connected to external electrical leads of the component housing. The component housing can also be further provided with a lens that produces a desired aperture angle for the radiation cone. Uses for the component are also described.
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公开(公告)号:WO2005041247A3
公开(公告)日:2005-07-07
申请号:PCT/DE2004001877
申请日:2004-08-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH , HAAS HEINZ , MOELLMER FRANK , SCHWIND MICHAEL
Inventor: HAAS HEINZ , MOELLMER FRANK , SCHWIND MICHAEL
IPC: H01L31/0203 , H01L33/44
CPC classification number: H01L31/02162 , H01L31/0304 , H01L33/44 , H01L2224/4847 , Y02E10/544
Abstract: The invention relates to a radiation detector for detecting radiation with a preset spectral sensitivity distribution (14), which has a maximum sensitivity in a predetermined wavelength
Abstract translation: 本发明涉及的放射线检测器,用于检测与在预定波长lambda0具有灵敏度最大值的规定的分光灵敏度分布(14)的辐射,所述辐射检测器优选地包括III-V族半导体材料,特别优选至少一个半导体芯片(1)和至少一个 所述半导体芯片下游光学滤波器,其中所述半导体芯片包含至少一种III-V族半导体材料,并且所述光学滤波器吸收波长大于所述灵敏度最大值的波长λ0的辐射。
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公开(公告)号:DE102010023955A1
公开(公告)日:2011-12-22
申请号:DE102010023955
申请日:2010-06-16
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: O'BRIEN DAVID DR , HAUSHALTER MARTIN , FOERSTE MARKUS DR , MOELLMER FRANK
Abstract: Es wird ein Optoelektronisches Bauteil angegeben, mit – einer Leiterplatte (1), die eine Oberseite (1a) mit einen Chipanschlussbereich (10) aufweist, – einem optoelektronischen Halbleiterchip (2), der am Chipanschlussbereich (10) befestigt ist, – einem Gehäusekörper (3), der an der Oberseite (1a) der Leiterplatte (1) an der Leiterplatte (1) befestigt ist und einen Reflektorbereich (30) aufweist, wobei – der Reflektorbereich (30) eine Öffnung (31) im Gehäusekörper (3) umfasst, in der der optoelektronische Halbleiterchips (2) angeordnet ist, und – der Gehäusekörper (3) mit einem Kunststoffmaterial gebildet ist, das im Reflektorbereich (30) zumindest stellenweise metallisiert ist.
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公开(公告)号:DE102005019115A1
公开(公告)日:2006-07-27
申请号:DE102005019115
申请日:2005-04-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: BEHRINGER MARTIN , MOELLMER FRANK , HOEFER THOMAS , WAITL GUENTER
Abstract: The component has a lead frame (4), a carrier (6) with a chip mounting surface and a base surface opposite to the chip mounting surface. A side surface runs from the chip mounting surface to the base surface. A laser bars chip (3) is arranged on the chip mounting surface of the carrier. The lead frame is connected to the side surface and is designed as a heat sink. The chip is bonded with hard solder e.g. gold-tin solder.
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公开(公告)号:DE102004004783A1
公开(公告)日:2005-07-14
申请号:DE102004004783
申请日:2004-01-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: PAMMER WOLFGANG , MOELLMER FRANK , STEEGMUELLER ULRICH , HOEFER THOMAS
Abstract: A light emitting element e.g. LED or laser diode has a pre-prepared bond with a lead frame (8) connected to a plastics containing housing. Semiconductor chip (1) is attached to the lead frame using a hard solder bond. The housing is preferably die-, injection moulded or transfer moulded and at least partially surrounds the lead frame and keeps its shape at the melting point of the hard solder. A heat sink (6) is preferably included between the lead frame and te mounting frame.
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公开(公告)号:DE102004004097A1
公开(公告)日:2005-06-30
申请号:DE102004004097
申请日:2004-01-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: MORGOTT STEFAN , HERRMANN GERHARD , BEHRINGER MARTIN , MOELLMER FRANK
Abstract: During pulsed operation, an opto-electronic component's (1) temperature changes at a thermal time constant adapted to a duration of pulse in order to reduce amplitude in temperature changes. The thermal time constant for temperature changes during pulsed operation is assigned a value so as to reduce the amplitude in temperature variations during pulsed operation and varying mechanical loads. An independent claim is also included for a method for producing an opto-electronic component.
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