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公开(公告)号：WO2021030425A1
公开(公告)日：2021-02-18
申请号：PCT/US2020/045908
申请日：2020-08-12
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENEDICT, James E. , SOUTHWORTH, Andrew R. , SIKINA, Thomas V. , WILDER, Kevin , SOUZA, Matthew , TORBERG, Aaron Michael
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (RGB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the RGB, solder an end of the segment of copper wire to a signal trace of the RGB, and flush cut an opposite end of the segment of the copper wire to a surface of the RGB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：WO2021091824A1
公开(公告)日：2021-05-14
申请号：PCT/US2020/058538
申请日：2020-11-02
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENINATI, Gregory G. , BENEDICT, James E. , SOUTHWORTH, Andrew R.
Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：WO2019168992A1
公开(公告)日：2019-09-06
申请号：PCT/US2019/019847
申请日：2019-02-27
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas V. , BENEDICT, James E. , HAVEN, John P. , SOUTHWORTH, Andrew R. , AZADZOI, Semira M.
Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：WO2021201969A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/016294
申请日：2021-02-03
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James E. , DANELLO, Paul A. , PEVZNER, Mikhail , SIKINA, Thomas V. , SOUTHWORTH, Andrew R.
IPC: H05K3/40 , H01L2224/11602 , H01L2224/45147 , H01L2224/73207 , H01L24/11 , H01L24/45 , H01L24/73 , H05K2201/10287 , H05K2203/0257 , H05K2203/166 , H05K3/26 , H05K3/4007 , H05K3/4046 , H05K3/465 , H05K3/4679
Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.
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公开(公告)号：WO2021188657A1
公开(公告)日：2021-09-23
申请号：PCT/US2021/022742
申请日：2021-03-17
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James , KLEK, Erika , HAVEN, John P. , SOULIOTIS, Michael , SIKINA, Thomas V. , SOUTHWORTH, Andrew R. , WILDER, Kevin
Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstripto-stripline transition element operably connectable to the microstrip interface and to the stripline interface.
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Patent Agency Ranking
公开(公告)号：WO2020236324A1
公开(公告)日：2020-11-26
申请号：PCT/US2020/026714
申请日：2020-04-03
Applicant: RAYTHEON COMPANY , UNIVERSITY OF MASSACHUSETTS
Inventor： KLEK, Erika C. , HERNDON, Mary K. , SIKINA, Thomas V. , BENEDICT, James E. , SOUTHWORTH, Andrew R. , WILDER, Kevin M. , RANASINGHA, Oshadha K. , AKYURTLU, Alkim
IPC: H01C17/065 , H01C17/30 , H01C17/24 , H01C7/00
Abstract: A method includes blending (302) a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink (210). The method also includes printing (304) the modified carbon-based ink onto a structure (104, 106, 108). The method further includes curing (306) the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing (308) the cured printed modified carbon-based ink to form a thick film resistor (102). An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.
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公开(公告)号：EP3970167A1
公开(公告)日：2022-03-23
申请号：EP20723626.6
申请日：2020-04-03
Applicant: Raytheon Company , University Of Massachusetts
Inventor： KLEK, Erika C. , HERNDON, Mary K. , SIKINA, Thomas V. , BENEDICT, James E. , SOUTHWORTH, Andrew R. , WILDER, Kevin M. , RANASINGHA, Oshadha K. , AKYURTLU, Alkim
IPC: H01C17/065 , H01C17/30 , H01C17/24 , H01C7/00
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公开(公告)号：EP3760014A1
公开(公告)日：2021-01-06
申请号：EP19710905.1
申请日：2019-02-27
Applicant: Raytheon Company
Inventor： SIKINA, Thomas V. , BENEDICT, James E. , HAVEN, John P. , SOUTHWORTH, Andrew R. , AZADZOI, Semira M.
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公开(公告)号：EP4129024A1
公开(公告)日：2023-02-08
申请号：EP21708485.4
申请日：2021-02-03
Applicant: Raytheon Company
Inventor： BENEDICT, James E. , DANELLO, Paul A. , PEVZNER, Mikhail , SIKINA, Thomas V. , SOUTHWORTH, Andrew R.
IPC: H05K3/40
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公开(公告)号：EP4122045A1
公开(公告)日：2023-01-25
申请号：EP21718298.9
申请日：2021-03-17
Applicant: Raytheon Company
Inventor： BENEDICT, James , KLEK, Erika , HAVEN, John P. , SOULIOTIS, Michael , SIKINA, Thomas V. , SOUTHWORTH, Andrew R. , WILDER, Kevin
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