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公开(公告)号：WO2021030425A1
公开(公告)日：2021-02-18
申请号：PCT/US2020/045908
申请日：2020-08-12
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENEDICT, James E. , SOUTHWORTH, Andrew R. , SIKINA, Thomas V. , WILDER, Kevin , SOUZA, Matthew , TORBERG, Aaron Michael
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (RGB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the RGB, solder an end of the segment of copper wire to a signal trace of the RGB, and flush cut an opposite end of the segment of the copper wire to a surface of the RGB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：WO2021091824A1
公开(公告)日：2021-05-14
申请号：PCT/US2020/058538
申请日：2020-11-02
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENINATI, Gregory G. , BENEDICT, James E. , SOUTHWORTH, Andrew R.
Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.
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公开(公告)号：WO2021091825A1
公开(公告)日：2021-05-14
申请号：PCT/US2020/058540
申请日：2020-11-02
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , BENEDICT, James, E. , SOUTHWORTH, Andrew, R. , SCHWANDA, Wade, A.
Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
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公开(公告)号：WO2021221740A1
公开(公告)日：2021-11-04
申请号：PCT/US2021/013847
申请日：2021-01-19
Applicant: RAYTHEON COMPANY
Inventor： PEVZNER, Mikhail , HERSEY, Donald, G. , BENINATI, Gregory, G. , TELLINGHUISEN, Thomas, J. , BENEDICT, James, E.
IPC: H05K3/36 , H05K3/40 , H05K1/144 , H05K2201/041 , H05K2201/042 , H05K2201/09845 , H05K2201/10287 , H05K2201/1031 , H05K2201/2036 , H05K2203/0415 , H05K2203/049 , H05K2203/0495 , H05K2203/167 , H05K3/3436 , H05K3/363 , H05K3/365 , H05K3/368 , H05K3/4015 , H05K3/4046
Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
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公开(公告)号：WO2021201969A1
公开(公告)日：2021-10-07
申请号：PCT/US2021/016294
申请日：2021-02-03
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James E. , DANELLO, Paul A. , PEVZNER, Mikhail , SIKINA, Thomas V. , SOUTHWORTH, Andrew R.
IPC: H05K3/40 , H01L2224/11602 , H01L2224/45147 , H01L2224/73207 , H01L24/11 , H01L24/45 , H01L24/73 , H05K2201/10287 , H05K2203/0257 , H05K2203/166 , H05K3/26 , H05K3/4007 , H05K3/4046 , H05K3/465 , H05K3/4679
Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.
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Patent Agency Ranking
公开(公告)号：WO2022173500A1
公开(公告)日：2022-08-18
申请号：PCT/US2021/062919
申请日：2021-12-10
Applicant: RAYTHEON COMPANY
Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit (18) having a base (20) and at least one side panel (24a-c). The at least one side panel (24a-c) is hingedly connected to the base (20). The method further includes disposing a support structure (12) on the flexible-hybrid circuit (18). The support structure (12) includes a base, which is disposed on the base (20) of the flexible-hybrid circuit (18), and at least one side that corresponds to the at least one side panel (24a-c) of the flexible-hybrid circuit (18). The method further includes folding the at least one side panel (24a-c) of the flexible-hybrid circuit (18) so that the at least one side panel (24a-c) is disposed co-planar with the at least one side of the support structure (12) to create a printed circuit assembly.
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公开(公告)号：WO2022169492A1
公开(公告)日：2022-08-11
申请号：PCT/US2021/056533
申请日：2021-10-26
Applicant: RAYTHEON COMPANY
Inventor： BOYLE, Patrick, E. , BENEDICT, James, E. , KLEK, Erika , PEVZNER, Mikhail
Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
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8.发明申请
公开(公告)号：WO2021252111A1
公开(公告)日：2021-12-16
申请号：PCT/US2021/031134
申请日：2021-05-06
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James, E. , BENINATI, Gregory, G. , PEVZNER, Mikhail , SIKINA, Thomas, V. , SOUTHWORTH, Andrew, R.
IPC: H05K3/34 , H05K3/00 , H05K3/40 , H05K2201/0305 , H05K2201/09154 , H05K2201/09572 , H05K2203/041 , H05K2203/043 , H05K2203/046 , H05K3/0044 , H05K3/0047 , H05K3/3485 , H05K3/4038
Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.
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公开(公告)号：WO2021230925A1
公开(公告)日：2021-11-18
申请号：PCT/US2021/013898
申请日：2021-01-19
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas, V. , HAVEN, John, P. , BENEDICT, James, E. , CLARK, William, J. , FAVREAU, Channing, P. , KLEK, Erika , PEVZNER, Mikhail , HERSEY, Donald, G. , BENINATI, Gregory, G. , TELLINGHUISEN, Thomas, J.
IPC: H01L23/552 , H01P1/16 , H01P1/20 , H05K1/02
Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
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公开(公告)号：EP4054847A1
公开(公告)日：2022-09-14
申请号：EP20811928.9
申请日：2020-11-02
Applicant: Raytheon Company
Inventor： PEVZNER, Mikhail , BENEDICT, James, E. , SOUTHWORTH, Andrew, R. , SCHWANDA, Wade, A.
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