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公开(公告)号：WO2020251852A1
公开(公告)日：2020-12-17
申请号：PCT/US2020/036346
申请日：2020-06-05
Applicant: RAYTHEON COMPANY
Inventor： WILDER, Kevin , NUFIO-MOLINA, Jonathan, E. , THIESSEN, Phillip, W. , SIKINA, Thomas, V. , BENEDICT, James, E. , SOUTHWORTH, Andrew, R. , KLEK, Erika
Abstract: An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.
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公开(公告)号：WO2022192053A1
公开(公告)日：2022-09-15
申请号：PCT/US2022/018601
申请日：2022-03-03
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas V. , FAVREAU, Channing P. , KLEK, Erika
Abstract: A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.
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公开(公告)号：WO2022169492A1
公开(公告)日：2022-08-11
申请号：PCT/US2021/056533
申请日：2021-10-26
Applicant: RAYTHEON COMPANY
Inventor： BOYLE, Patrick, E. , BENEDICT, James, E. , KLEK, Erika , PEVZNER, Mikhail
Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
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公开(公告)号：WO2021230925A1
公开(公告)日：2021-11-18
申请号：PCT/US2021/013898
申请日：2021-01-19
Applicant: RAYTHEON COMPANY
Inventor： SIKINA, Thomas, V. , HAVEN, John, P. , BENEDICT, James, E. , CLARK, William, J. , FAVREAU, Channing, P. , KLEK, Erika , PEVZNER, Mikhail , HERSEY, Donald, G. , BENINATI, Gregory, G. , TELLINGHUISEN, Thomas, J.
IPC: H01L23/552 , H01P1/16 , H01P1/20 , H05K1/02
Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.
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公开(公告)号：WO2021188657A1
公开(公告)日：2021-09-23
申请号：PCT/US2021/022742
申请日：2021-03-17
Applicant: RAYTHEON COMPANY
Inventor： BENEDICT, James , KLEK, Erika , HAVEN, John P. , SOULIOTIS, Michael , SIKINA, Thomas V. , SOUTHWORTH, Andrew R. , WILDER, Kevin
Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstripto-stripline transition element operably connectable to the microstrip interface and to the stripline interface.
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Patent Agency Ranking
公开(公告)号：EP4305709A1
公开(公告)日：2024-01-17
申请号：EP22711774.4
申请日：2022-03-03
Applicant: Raytheon Company
Inventor： SIKINA, Thomas V. , FAVREAU, Channing P. , KLEK, Erika
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公开(公告)号：EP3984097A1
公开(公告)日：2022-04-20
申请号：EP20750403.6
申请日：2020-06-05
Applicant: Raytheon Company
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公开(公告)号：EP4457898A1
公开(公告)日：2024-11-06
申请号：EP22844346.1
申请日：2022-11-30
Applicant: Raytheon Company
Inventor： BENEDICT, James , BINEK, Lawrence, A. , KLEK, Erika
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公开(公告)号：EP4457897A1
公开(公告)日：2024-11-06
申请号：EP22851058.2
申请日：2022-11-30
Applicant: Raytheon Company
Inventor： BENEDICT, James , BINEK, Lawrence, A. , KLEK, Erika
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公开(公告)号：EP4289000A1
公开(公告)日：2023-12-13
申请号：EP21810496.6
申请日：2021-10-26
Applicant: Raytheon Company
Inventor： BOYLE, Patrick, E. , BENEDICT, James, E. , KLEK, Erika , PEVZNER, Mikhail
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