A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants

    公开(公告)号:AU2002303842A1

    公开(公告)日:2002-12-03

    申请号:AU2002303842

    申请日:2002-05-22

    Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.

    2.
    发明专利
    未知

    公开(公告)号:AT339704T

    公开(公告)日:2006-10-15

    申请号:AT01905068

    申请日:2001-01-25

    Abstract: A spatial light modulator having a substrate holding an array of deflectable (e.g. mirror) elements. The deflectable elements are deflectably coupled to the substrate via corresponding hinges, each hinge being disposed on a side of the deflectable element opposite to the side on which the substrate is disposed. By placing the hinge in this way the fill factor of the array is improved. The hinge can be provided flush against the deflectable element, or it can be provided with a gap between the deflectable element and the hinge. The hinge can be attached via one or more posts or walls connecting to the substrate, and with a flexible or deformable portion that is substantially or entirely hidden from view when viewed through the substrate (e.g. a glass substrate). In one embodiment, the hinge is connected to the undersides of both the substrate and the deflectable element, and connects towards a center part of the deflectable element. In this way, a longer hinge is provided thus reducing strain on any one part of the hinge. Advantages of the present invention include: (1) increased fill factor as the torsion hinge is hidden behind the reflective plate; (2) increased contrast due to fewer scattering optical surfaces exposed, and due to a greater ability to control their angle and geometry; and (3) increased geometric flexibility to optimize electro-mechanical performance and robustness with respect to manufacturing.

    A deflectable spatial light modulator having superimposed hinge and deflectable element

    公开(公告)号:AU3298601A

    公开(公告)日:2001-08-07

    申请号:AU3298601

    申请日:2001-01-25

    Abstract: A spatial light modulator having a substrate holding an array of deflectable (e.g. mirror) elements. The deflectable elements are deflectably coupled to the substrate via corresponding hinges, each hinge being disposed on a side of the deflectable element opposite to the side on which the substrate is disposed. By placing the hinge in this way the fill factor of the array is improved. The hinge can be provided flush against the deflectable element, or it can be provided with a gap between the deflectable element and the hinge. The hinge can be attached via one or more posts or walls connecting to the substrate, and with a flexible or deformable portion that is substantially or entirely hidden from view when viewed through the substrate (e.g. a glass substrate). In one embodiment, the hinge is connected to the undersides of both the substrate and the deflectable element, and connects towards a center part of the deflectable element. In this way, a longer hinge is provided thus reducing strain on any one part of the hinge. Advantages of the present invention include: (1) increased fill factor as the torsion hinge is hidden behind the reflective plate; (2) increased contrast due to fewer scattering optical surfaces exposed, and due to a greater ability to control their angle and geometry; and (3) increased geometric flexibility to optimize electro-mechanical performance and robustness with respect to manufacturing.

    A METHOD FOR MAKING A MICROMECHANICAL DEVICE BY REMOVING A SACRIFICIAL LAYER WITH MULTIPLE SEQUENTIAL ETCHANTS
    4.
    发明申请
    A METHOD FOR MAKING A MICROMECHANICAL DEVICE BY REMOVING A SACRIFICIAL LAYER WITH MULTIPLE SEQUENTIAL ETCHANTS 审中-公开
    一种通过多个顺序蚀刻去除真菌层制备微生物器件的方法

    公开(公告)号:WO02095800A3

    公开(公告)日:2003-02-13

    申请号:PCT/US0216224

    申请日:2002-05-22

    Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate (10); providing a sacrificial layer (20) directly or indirectly on the substrate; providing one or more micromechanical structural layers (30) on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer (20), the first etch comprising providing an etchant gas and energizing (42) the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material.

    Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构,包括提供衬底(10); 在衬底上直接或间接提供牺牲层(20); 在牺牲层上提供一个或多个微机械结构层(30); 执行第一蚀刻以去除牺牲层(20)的一部分,所述第一蚀刻包括提供蚀刻剂气体并激发(42)蚀刻剂气体,以便使蚀刻剂气体在物理或化学和物理上移除部分 的牺牲层; 执行第二蚀刻以去除牺牲层中的附加牺牲材料,第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。

    A DEFLECTABLE SPATIAL LIGHT MODULATOR HAVING SUPERIMPOSED HINGE AND DEFLECTABLE ELEMENT
    5.
    发明公开
    A DEFLECTABLE SPATIAL LIGHT MODULATOR HAVING SUPERIMPOSED HINGE AND DEFLECTABLE ELEMENT 有权
    可调的空间光调制器具有连接密封件,并且旋转元件

    公开(公告)号:EP1230574A4

    公开(公告)日:2005-05-25

    申请号:EP01905068

    申请日:2001-01-25

    CPC classification number: G02B26/0841

    Abstract: A spatial light modulator (100) having a substrate (110) holding an array of deflectable (e.g. mirror) elements (120). The deflectable elements (120) are deflectably coupled to the substrate (110) via corresponding hinges (134), each hinge (134) being disposed on a side of the deflectable element (120) opposite to the side on which the substrate (110) is disposed. By placing the hinge (134) in this way the fill factor of the array is improved. The hinge (134) can be provided flush against the deflectable element (120), or it can be provided with a gap between the deflectable element (120) and the hinge (134). The hinge (134) can be attached via one or more posts (136, 138) or walls connecting to the substrate (110), and with a flexible or deformable portion that is substantially or entirely hidden from view then viewed through the substrate (110) (e.g. a glass substrate). In one embodiment, the hinge (134) is connected to the undersides of both the substrate (110) and the deflectable element (120), and connects towards a center part of the deflectable element (120). In this way, a longer hinge (134) is provided thus reducing strain on any one part of the hinge (134).

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