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    LASER TRIMMING OF RESISTORS
    2.
    发明申请
    LASER TRIMMING OF RESISTORS 审中-公开
    电阻激光切割

    公开(公告)号：WO2004049401A3

    公开(公告)日：2005-02-17

    申请号：PCT/US0337439

    申请日：2003-11-20

    Applicant: SANMINA SCI CORP ,  BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

    Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

    IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02 ,  B23K26/38

    CPC classification number: H05K1/167 ,  B23K26/351 ,  H01C17/242 ,  H05K1/116 ,  H05K3/027 ,  H05K2203/171

    Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

    Abstract translation: 提供了改进的印刷在基底层上的激光微调电阻的系统和方法。 示例性实施例测量每个环形电阻器的电阻值，并且基于所测量的电阻值和与每个电阻器相关联的目标电阻值，将环形电阻器排列成一个或多个箱体。 然后可以基于预测装饰配方将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器与其各自的目标值一致。 激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

    LASER TRIMMING OF RESISTORS
    5.
    发明专利
    LASER TRIMMING OF RESISTORS 未知

    公开(公告)号：AU2003291150A1

    公开(公告)日：2004-06-18

    申请号：AU2003291150

    申请日：2003-11-20

    Applicant: SANMINA SCI CORP

    Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

    IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02

    Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

    Laser trimming of resistors
    6.
    发明专利
    Laser trimming of resistors 未知

    公开(公告)号：AU2003291150A8

    公开(公告)日：2004-06-18

    申请号：AU2003291150

    申请日：2003-11-20

    Applicant: SANMINA SCI CORP

    Inventor： BIUNNO NICHOLAS ,  OGLE KEN ,  PATEL ATUL ,  DUDNIKOV GEORGE

    IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02 ,  B23K26/38

    Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

    LASER TRIMMING OF RESISTORS
    7.
    发明公开
    LASER TRIMMING OF RESISTORS 有权
    激光切割电阻器

    公开(公告)号：EP1567302A4

    公开(公告)日：2009-07-29

    申请号：EP03783744

    申请日：2003-11-20

    Applicant: SANMINA SCI CORP

    Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

    IPC: B23K26/38 ,  H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02

    CPC classification number: H05K1/167 ,  B23K26/351 ,  H01C17/242 ,  H05K1/116 ,  H05K3/027 ,  H05K2203/171

    Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

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