公开(公告)号：WO2004049401A3

公开(公告)日：2005-02-17

申请号：PCT/US0337439

申请日：2003-11-20

Applicant: SANMINA SCI CORP ,  BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02 ,  B23K26/38

CPC classification number: H05K1/167 ,  B23K26/351 ,  H01C17/242 ,  H05K1/116 ,  H05K3/027 ,  H05K2203/171

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

Abstract translation: 提供了改进的印刷在基底层上的激光微调电阻的系统和方法。 示例性实施例测量每个环形电阻器的电阻值，并且基于所测量的电阻值和与每个电阻器相关联的目标电阻值，将环形电阻器排列成一个或多个箱体。 然后可以基于预测装饰配方将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器与其各自的目标值一致。 激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

公开(公告)号：WO2008098060A2

公开(公告)日：2008-08-14

申请号：PCT/US2008053193

申请日：2008-02-06

Applicant: SANMINA SCI CORP ,  BIUNNO NICHOLAS

Inventor： BIUNNO NICHOLAS

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/162 ,  H05K2201/09309 ,  H05K2201/09763 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y10T29/4913

Abstract: A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a second conductive layer coupled to a second surface of the first dielectric layer, and (4) a localized distributive non-discrete capacitive element adjacent the first conductive layer, wherein the capacitive element occupies a region that approximately coincides with a location over which a device to be coupled to the capacitive element is to be mounted. The embedded, localized, non-discrete, and distributive capacitive element may provide device-specific capacitance to suppress voltage/current noise for a particular device.

Abstract translation: 提供具有埋入式电容层和器件专用嵌入式，局部化，非离散式和分布式电容元件的多层电路板。 提供印刷电路板，其包括（1）第一介电层，（2）耦合到第一介电层的第一表面的第一导电层，（3）耦合到第一介电层的第二表面的第二导电层 ，以及（4）与第一导电层相邻的局部分布式非离散电容元件，其中电容元件占据与将要耦合到电容元件的器件将被安装在其上的位置大致一致的区域。 嵌入式的，局部的，非离散的和分布式的电容元件可以提供设备特定的电容以抑制特定设备的电压/电流噪声。

公开(公告)号：AU2003291150A1

公开(公告)日：2004-06-18

申请号：AU2003291150

申请日：2003-11-20

Applicant: SANMINA SCI CORP

Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

公开(公告)号：EP1567302A4

公开(公告)日：2009-07-29

申请号：EP03783744

申请日：2003-11-20

Applicant: SANMINA SCI CORP

Inventor： BIUNNO NICHOLAS ,  PATEL ATUL ,  OGLE KEN ,  DUDNIKOV GEORGE

IPC: B23K26/38 ,  H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02

CPC classification number: H05K1/167 ,  B23K26/351 ,  H01C17/242 ,  H05K1/116 ,  H05K3/027 ,  H05K2203/171

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.

公开(公告)号：AU2003291150A8

公开(公告)日：2004-06-18

申请号：AU2003291150

申请日：2003-11-20

Applicant: SANMINA SCI CORP

Inventor： BIUNNO NICHOLAS ,  OGLE KEN ,  PATEL ATUL ,  DUDNIKOV GEORGE

IPC: H01C17/242 ,  H05K1/11 ,  H05K1/16 ,  H05K3/02 ,  B23K26/38

Abstract: Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.