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1.发明专利
公开(公告)号：MY173413A
公开(公告)日：2020-01-23
申请号：MYPI2014700259
申请日：2012-08-09
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K -JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described. The Most Illustrative Drawing: Figure 4
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2.发明专利
公开(公告)号：AU2012294932B2
公开(公告)日：2016-08-11
申请号：AU2012294932
申请日：2012-08-09
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K-JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/18
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
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公开(公告)号：AU2014208227A1
公开(公告)日：2014-08-21
申请号：AU2014208227
申请日：2014-07-30
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER KARL-JOSEF , RANA VIRENDA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCAP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/0224 , H01L31/18
Abstract: Fabrication methods and structures relating to multi-level metallization for solar cells as well as fabrication methods and structures for forming thin film back contact solar cells are provided.
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公开(公告)号：AU2016265969A1
公开(公告)日：2016-12-15
申请号：AU2016265969
申请日：2016-11-28
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER KARL-JOSEF , RANA VIRENDA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCAP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/0224 , H01L31/18
Abstract: Fabrication methods and structures relating to multi-level metallization for solar cells as well as fabrication methods and structures for forming thin film back contact solar cells are provided.
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Patent Agency Ranking5.发明专利
公开(公告)号：AU2012294932A1
公开(公告)日：2014-03-27
申请号：AU2012294932
申请日：2012-08-09
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K-JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/18
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
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6.发明申请HIGH-EFFICIENCY SOLAR PHOTOVOLTAIC CELLS AND MODULES USING THIN CRYSTALLINE SEMICONDUCTOR ABSORBERS 审中-公开高效率太阳能光伏电池和模块使用薄晶体半导体吸收体
公开(公告)号：WO2013022479A3
公开(公告)日：2013-05-16
申请号：PCT/US2012000348
申请日：2012-08-09
Applicant: SOLEXEL INC , MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K-JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K-JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/18
CPC classification number: H01L31/022441 , H01L31/0201 , H01L31/02167 , H01L31/02327 , H01L31/03765 , H01L31/0392 , H01L31/049 , H01L31/0516 , H01L31/0682 , H01L31/075 , H01L31/1812 , H01L31/1896 , Y02E10/547
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
Abstract translation: 描述了与用于背接触太阳能电池的背板相关的制造方法和结构，其提供用于太阳能电池基板增强和电互连以及用于形成薄膜背接触太阳能电池的制造方法和结构。
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公开(公告)号：WO2012135395A3
公开(公告)日：2013-02-07
申请号：PCT/US2012031043
申请日：2012-03-28
Applicant: SOLEXEL INC , MOSLEHI MEHRDAD M , KRAMER KARL-JOSEF , SEUTTER SEAN , KAPUR PAWAN , STALCUP THOM , WANG DAVID XUAN-QI , KAMIAN GEORGE D , MANTEGHI KAMRAN , SU YEN-SHENG , ANBALAGAN PRANAV , RANA VIRENDRA V , CALCATERRA ANTHONY , OLSEN GERRY , WORWAG WOJCIECH
Inventor： MOSLEHI MEHRDAD M , KRAMER KARL-JOSEF , SEUTTER SEAN , KAPUR PAWAN , STALCUP THOM , WANG DAVID XUAN-QI , KAMIAN GEORGE D , MANTEGHI KAMRAN , SU YEN-SHENG , ANBALAGAN PRANAV , RANA VIRENDRA V , CALCATERRA ANTHONY , OLSEN GERRY , WORWAG WOJCIECH
IPC: H01L31/042 , H01L31/0216 , H01L31/18
CPC classification number: H01L31/022441 , H01L31/0516 , H01L31/0682 , H01L31/1892 , Y02E10/547
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, attaching a prepeg backplane to the interdigitated pattern of base electrodes and emitter electrodes, forming holes in the prepeg backplane which provide access to the first layer of electrically conductive metal, and depositing a second layer of electrically conductive metal on the backside surface of the prepeg backplane forming an electrical interconnect with the first layer of electrically conductive metal through the holes in the prepeg backplane.
Abstract translation: 描述了提供太阳能电池基板加强和电互连的背接触太阳能电池背板的制造方法和结构。 该方法包括在半导体衬底的背面上沉积基底电极和发射电极的交错图形，将预制电路背板连接到基极和发射电极的交错图案，在预制电路背板上形成提供对第一层 的导电金属，并且在所述预制底板的背面上沉积第二导电金属层，通过所述预制底板中的所述孔与所述第一导电金属层形成电互连。
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8.发明公开HIGH-EFFICIENCY SOLAR PHOTOVOLTAIC CELLS AND MODULES USING THIN CRYSTALLINE SEMICONDUCTOR ABSORBERS 审中-公开高效率的太阳能光伏和模块薄晶体半导体吸收
公开(公告)号：EP2742536A4
公开(公告)日：2015-08-12
申请号：EP12822670
申请日：2012-08-09
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K-JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
IPC: H01L31/042 , H01L31/18
CPC classification number: H01L31/022441 , H01L31/0201 , H01L31/02167 , H01L31/02327 , H01L31/03765 , H01L31/0392 , H01L31/049 , H01L31/0516 , H01L31/0682 , H01L31/075 , H01L31/1812 , H01L31/1896 , Y02E10/547
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
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公开(公告)号：EP2691990A4
公开(公告)日：2014-09-03
申请号：EP12765891
申请日：2012-03-28
Applicant: SOLEXEL INC
Inventor： MOSLEHI MEHRDAD M , KRAMER KARL-JOSEF , SEUTTER SEAN , KAPUR PAWAN , STALCUP THOM , WANG DAVID XUAN-QI , KAMIAN GEORGE D , MANTEGHI KAMRAN , SU YEN-SHENG , ANBALAGAN PRANAV , RANA VIRENDRA V , CALCATERRA ANTHONY , OLSEN GERRY , WORWAG WOJCIECH
IPC: H01L31/042 , H01L31/0216 , H01L31/0224 , H01L31/05 , H01L31/068 , H01L31/18
CPC classification number: H01L31/022441 , H01L31/0516 , H01L31/0682 , H01L31/1892 , Y02E10/547
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