Abstract:
A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 mu m. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 mu m while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 mu m.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
A multi-beam semiconductor laser device capable of emitting respective laser beams with uniform optical output levels and enabling easy alignment is provided. This multi-beam semiconductor laser device (40) is a GaN base multi-beam semiconductor laser device provided with four laser stripes (42A, 42B, 42C and 42D) which are capable of emitting laser beams with the same wavelength. The respective laser oscillating regions (42A to 42D) are provided with a p-type common electrode (48) on a mesa structure (46) which is formed on a sapphire substrate (44), and have active regions (50A, 50B, 50C and 50D) respectively. Two n-type electrodes (52A and 52B) are provided on an n-type GaN contact layer (54) and located as common electrodes opposite to the p-type common electrode (48) on both sides of the mesa structure (46). The distance A between the laser stripe (42A) and the laser stripe (42D) is no larger than 100 mu m. The distance B1 between the laser stripe (42A) and the n-type electrode (52B) is no larger than 150 mu m while the distance B2 between the laser stripe (42D) and the n-type electrode (52A) is no larger than 150 mu m.
Abstract:
In a multi-beam semiconductor laser including nitride III-V compound semiconductor layers stacked on one surface of a substrate of sapphire or other material to form laser structures, and including a plurality of anode electrodes and a plurality of cathode electrodes formed on the nitride III-V compound semiconductor layers, one of the anode electrodes is formed to bridge over one of the cathode electrodes via an insulating film, and another anode electrode is formed to bridge over another of the cathode electrodes via an insulating film.
Abstract:
A method for fabricating a semiconductor light emitting element or a semiconductor element by growing a nitride based III-V compound semiconducto r layer for forming a light emitting element structure or an element structure on a nitride based III-V compound semiconductor substrate where a plurality of second regions having a second mean dislocation density higher than a first mean dislocation density are arranged regularly in a first region of crystal having a first mean dislocation density, wherein an element region is define d on the nitride based III-V compound semiconductor substrate such that the second region is not included substantially or not included in a light emitting region or an active region.
Abstract:
A multibeam semiconductor laser wherein a group III-V nitride compound semiconductor layer having a laser structure is formed on a major surface of a sapphire substrate or the like, and anodes and cathodes are formed on the group III-V nitride compound semiconductor layer. An anode is formed across a cathode, with an insulating film between them. Another anode is formed across another cathode, with an insulating film between them.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
A multi−beam semiconductor laser element (40) which provides a uniform light output from each beam, for ease of positioning, and which is a GaN multi−beam semiconductor laser element having four laser stripes (42A, 42B, 42C, 42D) emitting laser beams of the same wavelength. Each laser stripe (42A−42D) has a p−side common electrode (48) on a mesa (46) formed on a sapphire substrate (44), and respective laser stripes have respective active regions (50A, 50B. 50C, 50D). Two n−side electrodes (52A, 52B) are provided on an n−type GaN contact layer (54) on the opposite sides of the mesa (46) as common electrode facing the p−side common electrode (48). The distance A between the laser stripe (42A) and the laser stripe (42D) is up to 100 μm. The distance B 1 between the laser stripe (42A) and the laser−side end of the n−side electrode (52B) is up to 150 μm, and the distance B 2 between the laser stripe (42D) and the laser−side end of the n−side electrode (52A) is up to 150 μm.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.
Abstract:
When a semiconductor light emitting device or a semiconductor device is manufactured by growing nitride III-V compound semiconductor layers, which will form a light emitting device structure or a device structure, on a nitride III-V compound semiconductor substrate composed of a first region in form of a crystal having a first average dislocation density and a plurality of second regions having a second average dislocation density higher than the first average dislocation density and periodically aligned in the first region, device regions are defined on the nitride III-V compound semiconductor substrate such that the device regions do not substantially include second regions, emission regions or active regions of devices finally obtained do not include second regions.