公开(公告)号：WO2006120309A2

公开(公告)日：2006-11-16

申请号：PCT/FR2006000669

申请日：2006-03-29

Applicant: ST MICROELECTRONICS SA ,  PALMADE ROMAIN ,  ROGGE AGNES

Inventor： PALMADE ROMAIN ,  ROGGE AGNES

CPC classification number: H01L24/75 ,  H01L23/13 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/05 ,  H01L2224/24227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00014

Abstract: The invention relates to a semiconductor chip comprising an active face provided with an integrated circuit area which is implemented thereon and comprises at least one lateral inclined contact pad extending below the active face plane and electrically connected to the integrated circuit area. The invention also relates to an electronic module comprising a substrate provided with a cavity in which the chip is arranged. Said invention is used, in particular, for producing low-thickness contact-less micromodules for chip cards, badges and contact-less electronic labels.

Abstract translation: 本发明涉及一种半导体芯片，其包括设置有集成电路区域的有源面，其实现在其上，并且包括在有源面平面下方延伸并电连接到集成电路区域的至少一个侧向倾斜接触焊盘。 本发明还涉及一种电子模块，其包括设置有芯片的空腔的基板。 特别地，本发明用于生产用于芯片卡，徽章和无接触电子标签的低厚度无接触微型模块。

公开(公告)号：DE60204124D1

公开(公告)日：2005-06-16

申请号：DE60204124

申请日：2002-02-14

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07

公开(公告)号：FR2822272B1

公开(公告)日：2003-06-27

申请号：FR0103401

申请日：2001-03-13

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07 ,  G06K7/00

公开(公告)号：FR2822272A1

公开(公告)日：2002-09-20

申请号：FR0103401

申请日：2001-03-13

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07 ,  G06K7/00

Abstract: The invention relates to a contactless electronic chip card (10) characterised in that it comprises: a device for communicating (14) with a contactless electronic chip card reader (12) that communicates according to ISO standard 14443-4; a contact electronic chip card-type operating system (16) communicating by APDU command and APDU response according to ISO standard 7816-4; and a protocol conversion interface (18) between the communication device (14) and the operating system (16).

公开(公告)号：DE60204124T2

公开(公告)日：2006-01-19

申请号：DE60204124

申请日：2002-02-14

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07