1.
    发明专利
    未知

    公开(公告)号:FR2783093B1

    公开(公告)日:2000-11-24

    申请号:FR9811221

    申请日:1998-09-04

    Abstract: Built-in capacitance (C1) on a silicon substrate (7) comprises a first highly doped polysilicon electrode (1), a thin layer (3) of silicon oxide, a second polysilicon electrode (10) and a silicide layer (4) over the second electrode. The second electrode has a high dopant concentration at the interface with the silicon oxide and a relatively low dopant concentration at the interface with the silicide layer. An Independent claim is also included for an integrated circuit, comprising at least one capacitance as above.

    3.
    发明专利
    未知

    公开(公告)号:FR2783093A1

    公开(公告)日:2000-03-10

    申请号:FR9811221

    申请日:1998-09-04

    Abstract: Built-in capacitance (C1) on a silicon substrate (7) comprises a first highly doped polysilicon electrode (1), a thin layer (3) of silicon oxide, a second polysilicon electrode (10) and a silicide layer (4) over the second electrode. The second electrode has a high dopant concentration at the interface with the silicon oxide and a relatively low dopant concentration at the interface with the silicide layer. An Independent claim is also included for an integrated circuit, comprising at least one capacitance as above.

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